PL
IA
NT
Features
n
Semi-shielded construction
n
Component height: 2 mm max.
n
Inductance range: 1 to 33 µH
n
High rated current - up to 3.6 A
n
RoHS compliant* and halogen free**
F
RE
E
Applications
n
DC/DC converters
n
Notebook computers
n
Digital video cameras
n
Televisions, LCD displays
*R
oH
S
C
OM
LE
AD
Electrical Specifications @ 25 °C
Inductance
@ 100 KHz/1 V
SRN5020 Series - Semi-shielded Power Inductors
General Specifications
Test
Freq.
(MHz)
SRF
(MHz)
Typ.
DCR
(W)
Max.
Irms
(A)
Isat
(A)
Bourns Part No.
SRN5020-1R0Y
SRN5020-1R5Y
SRN5020-2R2Y
SRN5020-3R3M
SRN5020-4R7M
SRN5020-5R6M
SRN5020-6R8M
SRN5020-100M
SRN5020-150M
SRN5020-220M
SRN5020-330M
L (mH)
1.0
1.5
2.2
3.3
4.7
5.6
6.8
10
15
22
33
Tol. %
30
30
30
20
20
20
20
20
20
20
20
Q
(Ref.)
13
11
11
11
11
11
14
11
11
11
13
7.96
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
7.96
85
60
50
40
30
28
23
21
15
13
10
0.025
0.031
0.042
0.058
0.072
0.106
3.60
3.20
2.90
2.40
1.80
1.65
1.45
1.20
1.00
0.90
2.0
4.00
3.35
2.90
2.40
2.00
1.80
1.60
1.30
1.10
0.90
0.80
5.0 ± 0.2
(.197 ±
0.144
.008)
0.108
0.198
0.312
0.516
Operating Temperature
................................. -40 °C to +125 °C
(Temperature rise included)
Storage Temperature (Component)
................................. -40 °C to +125 °C
Resistance to Solder Heat
...............................+260 °C for 10 sec.
Temperature Rise .....40 °C at rated Irms
Rated Current
............ Inductance drops 30 % at Isat
Moisture Sensitivity Level .....................1
ESD Classification (HBM)................. N/A
Materials
Core ..............................................Ferrite
Wire ............................Enameled copper
Terminal Finish ........................Sn/Ag/Cu
Coating .................Magnetic epoxy resin
Packaging ..... 2000 pcs. per 13-inch reel
How to Order
Soldering
Peak Temperature 250
max.
Max. Peak Temperature -5
30 sec. max.
Max.
Profile
Time Above 217 : 60~150 sec. max.
Preheat
Area
150~200 °C / 60~120 Sec.
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
100
5.0 ± 0.2
(.197 ± .008)
Temperature
Rising Area
+4.0 °C/Sec. Max.
Reflow
Area
+3.0 °C/Sec. Max.
Forced
Cooling Area
-(1.0~5.0) °C/Sec. Max.
250
Peak Temperature: 250 °C
217 °C
Temperature (°C)
200
150
100
50
60~120 Sec.
60~150 Sec.
60 Sec.
Max.
Peak Temperature
250
max.
Max. Peak Temp. -5 °C
30 sec. max.
Max. Time Above 217
60~150 sec. max.
:
SRN5020 - 100M
Model
Value Code (see table)
Product Dimensions
5.0 ± 0.2
(.197 ± .008)
0
50
100
150
200
250
Time (Seconds)
Electrical Schematic
Recommended Layout
6.3
(.248)
2.0
(.079)
MAX.
100
5.0 ± 0.2
(.197 ± .008)
5.7
(.224)
1.6
(.063)
1.6
(.063)
* RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br ) content is 900 ppm or less;
(b) the Chlorine ( Cl ) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine ( Cl ) content is
1500 ppm or less.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device
performance may vary over time.
Users should verify actual device performance in their specific applications.
MM
DIMENSIONS:
(INCHES)
2.0
(.079)
MAX.
6.3
(.248)
SRF0504 Series - Line Filter
SRN5020 Series - Semi-shielded Power Inductors
Packaging Specifications
330
DIA.
(12.992)
2.0 ± 0.5
(.079 ± .020)
17.2
(.677)
13.5 ± 0.5
(.531 ± .020)
DIA.
99.5
(3.917)
13.5 ± 0.5
DIA.
(.531 ± .020)
12.6
(.496)
21.0 ± 0.8
(.827 ± .031)
0.4
(.016)
2.0 ± 0.05
(.079 ± .002)
4.0
(.157)
1.5 +0.1/-0.0
DIA.
(.059 +.004/-.000)
1.75
(.069)
5.5
(.217)
5.4
(.213)
12.0
(.472)
5.4
(.213)
8.0
(.315)
1.5
DIA.
(.059)
2.25
(.089)
USER DIRECTION OF FEED
QTY: 2000 PCS. PER REEL
MM
DIMENSIONS:
(INCHES)
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
EMEA:
Tel: +36 88 520 390 • Fax: +36 88 520 211
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. 09/17
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Embedded System
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