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D5C031-40

Description
300 gate CMOS pld
CategoryProgrammable logic devices    Programmable logic   
File Size353KB,12 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

D5C031-40 Overview

300 gate CMOS pld

D5C031-40 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntel
Parts packaging codeDIP
package instructionWDIP, DIP20,.3
Contacts20
Reach Compliance Codecompli
Other featuresPAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
ArchitecturePAL-TYPE
maximum clock frequency18.5 MHz
JESD-30 codeR-GDIP-T20
JESD-609 codee0
length24.825 mm
Dedicated input times8
Number of I/O lines8
Number of entries18
Output times8
Number of product terms74
Number of terminals20
Maximum operating temperature70 °C
Minimum operating temperature
organize8 DEDICATED INPUTS, 8 I/O
Output functionMACROCELL
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeWDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE, WINDOW
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programmable logic typeUV PLD
propagation delay40 ns
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Base Number Matches1

D5C031-40 Related Products

D5C031-40 D5C031 D5C031-50
Description 300 gate CMOS pld 300 gate CMOS pld 300 gate CMOS pld
Is it Rohs certified? incompatible - incompatible
Maker Intel - Intel
Parts packaging code DIP - DIP
package instruction WDIP, DIP20,.3 - WDIP, DIP20,.3
Contacts 20 - 20
Reach Compliance Code compli - compli
Other features PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK - PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
Architecture PAL-TYPE - PAL-TYPE
maximum clock frequency 18.5 MHz - 16.67 MHz
JESD-30 code R-GDIP-T20 - R-GDIP-T20
JESD-609 code e0 - e0
length 24.825 mm - 24.825 mm
Dedicated input times 8 - 8
Number of I/O lines 8 - 8
Number of entries 18 - 18
Output times 8 - 8
Number of product terms 74 - 74
Number of terminals 20 - 20
Maximum operating temperature 70 °C - 70 °C
organize 8 DEDICATED INPUTS, 8 I/O - 8 DEDICATED INPUTS, 8 I/O
Output function MACROCELL - MACROCELL
Package body material CERAMIC, GLASS-SEALED - CERAMIC, GLASS-SEALED
encapsulated code WDIP - WDIP
Encapsulate equivalent code DIP20,.3 - DIP20,.3
Package shape RECTANGULAR - RECTANGULAR
Package form IN-LINE, WINDOW - IN-LINE, WINDOW
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED
power supply 5 V - 5 V
Programmable logic type UV PLD - UV PLD
propagation delay 40 ns - 50 ns
Certification status Not Qualified - Not Qualified
Maximum seat height 5.08 mm - 5.08 mm
Maximum supply voltage 5.25 V - 5.25 V
Minimum supply voltage 4.75 V - 4.75 V
Nominal supply voltage 5 V - 5 V
surface mount NO - NO
technology CMOS - CMOS
Temperature level COMMERCIAL - COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE - THROUGH-HOLE
Terminal pitch 2.54 mm - 2.54 mm
Terminal location DUAL - DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED
width 7.62 mm - 7.62 mm
Base Number Matches 1 - 1

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