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IS61NVP6436A

Description
64K X 32 ZBT SRAM, 3.1 ns, PQFP100
Categorystorage   
File Size129KB,21 Pages
ManufacturerISSI(Integrated Silicon Solution Inc.)
Websitehttp://www.issi.com/
Download Datasheet Parametric View All

IS61NVP6436A Overview

64K X 32 ZBT SRAM, 3.1 ns, PQFP100

IS61NVP6436A Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals100
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage3.46 V
Minimum supply/operating voltage3.14 V
Rated supply voltage3.3 V
maximum access time3.1 ns
Processing package descriptionLEAD FREE, TQFP-100
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
CraftsmanshipCMOS
packaging shapeRECTANGULAR
Package SizeFLATPACK, LOW PROFILE
surface mountYes
Terminal formGULL WING
Terminal spacing0.6500 mm
terminal coatingMATTE TIN
Terminal locationQUAD
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
memory width32
organize64K X 32
storage density2.10E6 deg
operating modeSYNCHRONOUS
Number of digits65536 words
Number of digits64K
Memory IC typeZBT SRAM
serial parallelPARALLEL
IS61NLP6432A
IS61NLP6436A/IS61NVP6436A
IS61NLP12818A/IS61NVP12818A
64K x 32, 64K x 36, and 128K x 18
2Mb, PIPELINE 'NO WAIT' STATE BUS SRAM
ISSI
SEPTEMBER 2005
®
PRELIMINARY INFORMATION
FEATURES
• 100 percent bus utilization
• No wait cycles between Read and Write
• Internal self-timed write cycle
• Individual Byte Write Control
• Single R/W (Read/Write) control pin
• Clock controlled, registered address,
data and control
• Interleaved or linear burst sequence control using
MODE input
• Three chip enables for simple depth expansion
and address pipelining
• Power Down mode
• Common data inputs and data outputs
CKE
pin to enable clock and suspend operation
• JEDEC 100-pin TQFP package
• Power supply:
NVP: V
DD
2.5V (± 5%), V
DDQ
2.5V (± 5%)
NLP: V
DD
3.3V (± 5%), V
DDQ
3.3V/2.5V (± 5%)
• Industrial temperature available
• Lead-free available
DESCRIPTION
The 2 Meg 'NLP/NVP' product family feature high-speed,
low-power synchronous static RAMs designed to provide
a burstable, high-performance, 'no wait' state, device for
networking and communications applications. They are
organized as 64K words by 32 bits, 64K words by 36 bits,
and 128K words by 18 bits, fabricated with
ISSI
's advanced
CMOS technology.
Incorporating a 'no wait' state feature, wait cycles are
eliminated when the bus switches from read to write, or
write to read. This device integrates a 2-bit burst counter,
high-speed SRAM core, and high-drive capability outputs
into a single monolithic circuit.
All synchronous inputs pass through registers are controlled
by a positive-edge-triggered single clock input. Operations
may be suspended and all synchronous inputs ignored
when Clock Enable,
CKE
is HIGH. In this state the internal
device will hold their previous values.
All Read, Write and Deselect cycles are initiated by the
ADV input. When the ADV is HIGH the internal burst
counter is incremented. New external addresses can be
loaded when ADV is LOW.
Write cycles are internally self-timed and are initiated by
the rising edge of the clock inputs and when
WE
is LOW.
Separate byte enables allow individual bytes to be written.
A burst mode pin (MODE) defines the order of the burst
sequence. When tied HIGH, the interleaved burst sequence
is selected. When tied LOW, the linear burst sequence is
selected.
FAST ACCESS TIME
Symbol
t
KQ
t
KC
Parameter
Clock Access Time
Cycle Time
Frequency
-250
2.6
4
250
-200
3.1
5
200
Units
ns
ns
MHz
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability
arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any
published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00A
08/31/05
1

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