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Datasheet> All Categories > storage> storage> W3DG6417V10D2
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W3DG6417V10D2

Description
128MB - 16Mx64, SDRAM UNBUFFERED
Categorystorage    storage   
File Size126KB，6 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
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W3DG6417V10D2 Overview

128MB - 16Mx64, SDRAM UNBUFFERED

W3DG6417V10D2 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instructionDIMM,
Reach Compliance Codeunknow
access modeFOUR BANK PAGE BURST
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-XDMA-N168
memory density1073741824 bi
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals168
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16MX64
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

W3DG6417V10D2 Preview

White Electronic Designs
128MB - 16Mx64, SDRAM UNBUFFERED
FEATURES
PC100 and PC133 compatible
Burst Mode Operation
Auto and Self Refresh capability
LVTTL compatible inputs and outputs
Serial Presence Detect with EEPROM
Fully synchronous: All signals are registered on the
positive edge of the system clock
Programmable Burst Lengths: 1, 2, 4, 8 or Full
Page
3.3V ± 0.3V Power Supply
168 Pin DIMM JEDEC
W3DG6417V-D2
PRELIMINARY*
DESCRIPTION
The W3DG6417V is a 16Mx64 synchronous DRAM
module which consists of four 16Mx16 SDRAM
components in TSOP II package and one 2K EEPROM
in an 8 Pin TSSOP package for Serial Presence Detect
which are mounted on a 168 Pin DIMM multilayer FR4
Substrate.
* This product is under development, is not qualified or characterized and is subject to
change without notice.
PIN CONFIGURATIONS (FRONT SIDE/BACK SIDE)
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Front
V
SS
DQ0
DQ1
DQ2
DQ3
V
CC
DQ4
DQ5
DQ6
DQ7
DQ8
V
SS
DQ9
DQ10
DQ11
DQ12
DQ13
V
CC
DQ14
DQ15
CB0*
CB1*
Vss
NC
NC
V
CC
WE#
DQM0
Pin
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
Front
DQM1
CS0#
DNU
V
SS
A0
A2
A4
A6
A8
A10/AP
BA1
V
CC
V
CC
CLK0
V
SS
DNU
CS2#
DQM2
DQM3
DNU
V
CC
NC
NC
CB2*
CB3*
V
SS
DQ16
DQ17
Pin
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
Front
DQ18
DQ19
V
CC
DQ20
NC
V
REF
*
CKE1*
V
SS
DQ21
DQ22
DQ23
V
SS
DQ24
DQ25
DQ26
DQ27
V
CC
DQ28
DQ29
DQ30
DQ31
V
SS
CLK2
NC
NC
SDA**
SCL**
V
CC
Pin
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
Back
V
SS
DQ32
DQ33
DQ34
DQ35
V
CC
DQ36
DQ37
DQ38
DQ39
DQ40
V
SS
DQ41
DQ42
DQ43
DQ44
DQ45
V
CC
DQ46
DQ47
CB4*
CB5*
V
SS
NC
NC
V
CC
CAS#
DQM4
Pin
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
Back
DQM5
CS1#
RAS#
V
SS
A1
A3
A5
A7
A9
BA0
A11
V
CC
CLK1*
A12*
V
SS
CKE0
CS3#*
DQM6
DQM7
A13*
V
CC
NC
NC
CB6*
CB7*
V
SS
DQ48
DQ49
Pin
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
Back
DQ50
DQ51
V
CC
DQ52
NC
V
REF
*
DNU
V
SS
DQ53
DQ54
DQ55
V
SS
DQ56
DQ57
DQ58
DQ59
V
CC
DQ60
DQ61
DQ62
DQ63
V
SS
CLK3*
NC
SA0**
SA1**
SA2**
V
CC
PIN NAMES
A0 – A12
BA0-1
DQ0-63
CLK0,CLK2
CKE0
CS0# - CS2#
RAS#
CAS#
WE#
DQM0-7
V
CC
V
SS
SDA
SCL
DNU
NC
Address input (Multiplexed)
Select Bank
Data Input/Output
Clock input
Clock Enable input
Chip select Input
Row Address Strobe
Column Address Strobe
Write Enable
DQM
Power Supply (3.3V)
Ground
Serial data I/O
Serial clock
Do not use
No Connect
** These pins should be NC in the system which
does not support SPD.
*** WP (write protect) option available on Pin 81,
see ordering information page 5
June 2004
Rev. 0
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
FUNCTIONAL BLOCK DIAGRAM
W3DG6417V-D2
PRELIMINARY
BA1
BA2
W#
CKE0
CAS#
RAS#
A0-A11
SCL
SDA
SA0
SO#
DQMB0
DQMB1
SA1
SA2
DQML
DQMH
ADDR 16M x 16
RAS#
CAS#
CKE
W#
BA0
BA1
U0
CS#
DQ
DQ0-DQ16
DQMB2
DQMB3
DQML
DQMH
ADDR 16M x 16
RAS#
CAS#
CKE
W#
BA0
BA1
U1
CS#
DQ
DQ17-DQ31
DQMB4
DQMB5
DQML
DQMH
ADDR 16M x 16
RAS#
CAS#
CKE
W#
BA0
BA1
U2
CS#
DQ
DQ32-DQ47
DQMB6
DQMB7
DQML
DQMH
ADDR 16M x 16
RAS#
CAS#
CKE
W#
BA0
BA1
U3
CS#
DQ
DQ48-DQ63
June 2004
Rev. 0
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on any pin relative to V
SS
Voltage on V
CC
supply relative to V
SS
Storage Temperature
Power Dissipation
Short Circuit Current
Symbol
V
IN
, V
OUT
V
CC
, V
CCQ
TSTG
PD
IOS
Value
W3DG6417V-D2
PRELIMINARY
Units
V
V
°C
W
mA
-1.0 ~ 4.6
-1.0 ~ 4.6
-55 ~ +150
4
50
Note: Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
Voltage Referenced to: V
SS
= 0V, 0°C
≤
T
A
≤
+70°C
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
Output High Voltage
Output Low Voltage
Input Leakage Current
Symbol
V
CC
V
IH
V
IL
V
OH
V
OL
I
LI
Min
3.0
2.0
-0.3
2.4
—
-10
Typ
3.3
3.0
—
—
—
—
Max
3.6
V
CCQ
+0.3
0.8
—
0.4
10
Unit
V
V
V
V
V
µA
1
2
IOH= -2mA
IOL= -2mA
3
Note
Note:
1. V
IH
(max)= 5.6V AC. The overshoot voltage duration is ≤ 3ns.
2. V
IL
(min)= -2.0V AC. The undershoot voltage duration is ≤ 3ns.
3. Any input 0V ≤ V
IN
≤ V
CC
Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.
CAPACITANCE
T
A
= 25°C, f = 1MHz, V
CC
= 3.3V, V
REF
=1.4V
±
200mV
Parameter
Input Capacitance (A0-A12)
Input Capacitance (RAS#,CAS#,WE#)
Input Capacitance (CKE0)
Input Capacitance (CLK0, CLK2)
Input Capacitance (CS0#, CS2#)
Input Capacitance (DQM0-DQM7)
Input Capacitance (BA0-BA1)
Data input/output capacitance (DQ0-DQ63)
Symbol
C
IN1
C
IN2
C
IN3
C
IN4
C
IN5
C
IN6
C
IN7
C
OUT
Max
25
25
25
11
25
8
25
10
Unit
pF
pF
pF
pF
pF
pF
pF
pF
June 2004
Rev. 0
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
OPERATING CURRENT CHARACTERISTICS
V
CC
= 3.3V, 0°C
≤
T
A
≤
70°C
Parameters
Symbol
Conditions
W3DG6417V-D2
PRELIMINARY
Versions
Units
133
100
600
mA
1
Note
Operating Current
(One bank active)
Precharge Standby Current
in Power Down Mode
Precharge Standby Current
in Non-Power Down Mode
I
CC1
Burst Length = 1
t
RC
≥ t
RC
(min)
I
OL
= 0mA
CKE ≤ V
IL
(max), t
CC
= 10ns
CKE & CK ≤ V
IL
(max), t
CC
= ∞
CKE ≥ V
IH
(min), CS ≥ V
IH
(min), t
CC
=10ns
Input signals are charged one time during 20
CKE ≥ V
IH
(min), CK ≤ V
IL
(max), t
CC
= ∞
Input signals are stable
CKE ≥ V
IL
(max), t
CC
= 10ns
CKE & CK ≤ V
IL
(max), t
CC
= ∞
CKE ≥ V
IH
(min), CS ≥ V
IH
(min), t
CC
= 10ns
Input signals are charged one time during 20ns
CKE ≥ V
IH
(min), CK ≤ V
IL
(max), t
CC
= ∞
input signals are stable
Io = mA
Page burst
4 Banks activated
t
CCD
= 2CK
t
RC
≥ t
RC
(min)
CKE ≤ 0.2V
600
I
CC2P
I
CC2PS
I
CC2N
I
CC2NS
8
8
64
56
24
24
140
mA
mA
mA
mA
mA
Active standby current in power-
down mode
Active standby in current non
power-down mode
I
CC3P
I
CC3PS
I
CC3N
mA
I
CC3NS
Operating current (Burst mode)
I
CC4
120
720
720
mA
mA
1
Refresh current
Self refresh current
Notes:
1. Measured with outputs open.
2. Refresh period is 64ms.
I
CC5
I
CC6
880
12
880
mA
mA
2
June 2004
Rev. 0
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
ORDERING INFORMATION
Part Number
W3DG6417V10D2
W3DG6417V7D2
W3DG6417V75D2
Speed
100MHz
133MHz
133MHz
CAS Latency
CL=2
CL=2
CL=3
Height*
25.40 (1.00")
25.40 (1.00")
25.40 (1.00")
W3DG6417V-D2
PRELIMINARY
Note: Modules are available in industrial temperature: -40°C to 85°C
PACKAGE DIMENSIONS
3.99
(0.157)
(2X)
3.18 (0.125) (2X)
133.35
(5.255)
MAX
5.08
(0.200)
MAX
3.10
(0.000)
(0.122)
8.89
(0.350)
11.43
(0.450)
15.60 (0.614)
25.40
(1.000)
17.78 MAX
(0.700)
36.83
(1.450)
6.35 (0.250)
57.79
(2.275)
115.57
(4.550)
6.35
(0.250)
54.61
(2.150)
3.99
(0.157)
MIN
(0.000)
1.27 ± 0.10
(0.050 ± 0.004)
Measured after plating,
over fingers.
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)
June 2004
Rev. 0
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

W3DG6417V10D2 Related Products

W3DG6417V10D2 W3DG6417V-D2 W3DG6417V7D2 W3DG6417V75D2
Description 128MB - 16Mx64, SDRAM UNBUFFERED 128MB - 16Mx64, SDRAM UNBUFFERED 128MB - 16Mx64, SDRAM UNBUFFERED 128MB - 16Mx64, SDRAM UNBUFFERED
Is it Rohs certified? incompatible - incompatible incompatible
Maker White Electronic Designs Corporation - White Electronic Designs Corporation White Electronic Designs Corporation
package instruction DIMM, - DIMM, DIMM,
Reach Compliance Code unknow - unknow unknow
access mode FOUR BANK PAGE BURST - FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Other features AUTO/SELF REFRESH - AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-XDMA-N168 - R-XDMA-N168 R-XDMA-N168
memory density 1073741824 bi - 1073741824 bi 1073741824 bi
Memory IC Type SYNCHRONOUS DRAM MODULE - SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 64 - 64 64
Number of functions 1 - 1 1
Number of ports 1 - 1 1
Number of terminals 168 - 168 168
word count 16777216 words - 16777216 words 16777216 words
character code 16000000 - 16000000 16000000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C - 70 °C 70 °C
organize 16MX64 - 16MX64 16MX64
Package body material UNSPECIFIED - UNSPECIFIED UNSPECIFIED
encapsulated code DIMM - DIMM DIMM
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified - Not Qualified Not Qualified
self refresh YES - YES YES
Maximum supply voltage (Vsup) 3.6 V - 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V - 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V - 3.3 V 3.3 V
surface mount NO - NO NO
technology CMOS - CMOS CMOS
Temperature level COMMERCIAL - COMMERCIAL COMMERCIAL
Terminal form NO LEAD - NO LEAD NO LEAD
Terminal location DUAL - DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED

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