TSSP770..
www.vishay.com
Vishay Semiconductors
IR Sensor Module for Reflective Sensor, Light Barrier,
and Fast Proximity Applications
FEATURES
• Up to 2 m for presence and proximity sensing
• Uses modulated bursts of infrared light
4
3
2
1
• 940 nm peak wavelength
• PIN diode and sensor IC in one package
• Low supply current
• Shielding against EMI
• Visible light is suppressed by IR filter
20953
• Insensitive to supply voltage ripple and noise
MECHANICAL DATA
Pinning:
1, 4 = GND, 2 = V
S
, 3 = OUT
• Supply voltage: 2.5 V to 5.5 V
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
ORDERING CODE
Taping:
TSSP770..TT - top view taped
TSSP770..TR - side view taped
DESCRIPTION
The TSSP770.. series are compact infrared detector
modules for presence and fast proximity sensing
applications. They provide an active low output in response
to infrared bursts at 940 nm. The frequency of the burst
should correspond to the carrier frequency shown in the
parts table.
This component has not been qualified according to
automotive specifications.
APPLICATIONS
• Reflective sensors for hand dryers, towel or soap
dispensers, water faucets, toilet flush
• Vending machine fall detection
• Security and pet gates
• Person or object vicinity activation
• Fast proximity sensors for toys, robotics, drones, and
other consumer and industrial uses
PARTS TABLE
Carrier frequency
Package
Pinning
Dimensions (mm)
Mounting
Application
38 kHz
56 kHz
TSSP77038
TSSP77056
Heimdall
1, 4 = GND, 2 = V
S
, 3 = OUT
6.8 W x 3.0 H x 3.2 D
SMD
Presence sensors, fast proximity sensors
BLOCK DIAGRAM
2
33 kΩ
V
S
3
Input
AMP
Band
pass
Demo-
dulator
OUT
PRESENCE SENSING
+3 V
IR emitter
Envelope
signal
38 kHz
+3 V
1, 4
PIN
16833_17
GND
Out to
μC
Rev. 1.8, 13-Sep-17
1
Document Number: 82470
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
TSSP770..
www.vishay.com
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply voltage
Supply current
Output voltage
Output current
Junction temperature
Storage temperature range
Operating temperature range
Power consumption
T
amb
≤
85 °C
TEST CONDITION
SYMBOL
V
S
I
S
V
O
I
O
T
j
T
stg
T
amb
P
tot
VALUE
-0.3 to +6
5
-0.3 to (V
S
+ 0.3)
5
100
-25 to +85
-25 to +85
10
UNIT
V
mA
V
mA
°C
°C
°C
mW
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability
ELECTRICAL AND OPTICAL CHARACTERISTICS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
Supply voltage
Supply current
V
S
= 5 V, E
v
= 0
E
v
= 40 klx, sunlight
E
v
= 0,
IR diode TSAL6200,
I
F
= 400 mA,
test signal see fig. 1
I
OSL
= 0.5 mA, E
e
= 0.7 mW/m
2
,
test signal see fig. 1
Pulse width tolerance:
t
pi
- 5/f
o
< t
po
< t
pi
+ 6/f
o,
test signal see fig. 1
t
pi
- 5/f
o
< t
po
< t
pi
+ 6/f
o
,
test signal see fig. 1
Angle of half
transmission distance
TEST CONDITION
SYMBOL
V
S
I
SD
I
SH
d
MIN.
2.5
0.55
-
TYP.
-
0.7
0.8
MAX.
5.5
0.9
-
UNIT
V
mA
mA
Transmission distance
-
25
-
m
Output voltage low
V
OSL
E
e min.
E
e max.
ϕ
1/2
-
-
100
mV
mW/m
2
W/m
2
deg
Minimum irradiance
-
0.7
1.2
Maximum irradiance
Directivity
50
-
-
± 50
-
-
Rev. 1.8, 13-Sep-17
2
Document Number: 82470
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
TSSP770..
www.vishay.com
TYPICAL CHARACTERISTICS
(T
amb
= 25 °C, unless otherwise specified)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.1
1
10
100
1000
10 000
λ
= 950 nm,
optical test
signal,
Fig. 3
t
off
t
on
Vishay Semiconductors
(IR diode TSAL6200, I
F
= 0.4 A, 30 pulses, f = f
0
, t = 10 ms)
t
t
pi
*
* t
pi
V
O
V
OH
V
OL
T
10/f
0
is recommended for optimal function
16110
Output Signal
1)
7/f
0
< t
d
< 15/f
0
2)
t
pi
- 5/f
0
< t
po
< t
pi
+ 6/f
0
t
po 2)
t
t
d
1)
t
on
, t
off
- Output Pulse Width (ms)
E
e
Optical Test Signal
E
e
- Irradiance
(mW/m
2
)
Fig. 1 - Output Active Low
Fig. 4 - Output Pulse Diagram
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
1
10
100
1000
10 000 100 000
16925
1.2
E
e min.
/E
e
- Relative Responsivity
t
po
- Output Pulse Width (ms)
Output pulse width
1.0
0.8
0.6
0.4
0.2
0.0
0.7
0.9
1.1
1.3
f = f
0
± 5 %
Δf(3
dB) = f
0
/10
Input burst length
λ
= 950 nm,
optical test
signal,
Fig. 1
E
e
- Irradiance
(mW/m
2
)
f/f
0
- Relative Frequency
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
Fig. 5 - Frequency Dependence of Responsivity
E
e
E
e min.
- Threshold Irradiance (mW/m
2
)
Optical Test Signal
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-30
-10
10
30
50
70
90
600 µs
t = 60 ms
V
O
V
OH
V
OL
t
on
Output Signal,
(see Fig. 4)
600 µs
t
94 8134
t
off
t
T
amb
- Ambient Temperature (°C)
Fig. 6 - Sensitivity vs. Ambient Temperature
Fig. 3 - Output Function
Rev. 1.8, 13-Sep-17
3
Document Number: 82470
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
TSSP770..
www.vishay.com
Vishay Semiconductors
0°
10°
20°
30°
S (λ)
rel
- Relative Spectral Sensitivity
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
750
800
850
900
950 1000 1050 1100 1150
21428
40°
1.0
0.9
0.8
50°
60°
70°
80°
0.6
0.4
0.2
0
21425
λ-
Wavelength (nm)
d
rel
- Relative Transmission Distance
Fig. 7 - Relative Spectral Sensitivity vs. Wavelength
Fig. 9 - Vertical Directivity
0°
10°
20°
30°
2.0
E
e min.
-
Sensitivity
(mW/m
2
)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
2
3
4
5
40°
1.0
0.9
0.8
50°
60°
70°
80°
0.6
21427
0.4
0.2
0
d
rel
- Relative Transmission Distance
V
S
-
Supply
Voltage (V)
Fig. 10 - Sensitivity vs. Supply Voltage
Fig. 8 - Horizontal Directivity
The typical application of these devices is a reflective or
beam break sensor with active low “detect” or “no detect”
information contained in its output. The TSSP77056 is also
suitable for fast (~ 5 ms) proximity sensor applications for
ranges between 10 cm and 2 m. Please see application note
“Vishay’s TSSP4056 Sensor for Fast Proximity Sensing”
(www.vishay.com/doc?82741).
Example for a sensor hardware:
IR Receiver
TSSP6P38
Emitter
TSAL6200
Separation
to avoid
crosstalk by
stray
light inside
the housing
There should be no common window in front of the emitter
and detector in order to avoid crosstalk via guided light
through the window.
Rev. 1.8, 13-Sep-17
4
Document Number: 82470
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
TSSP770..
www.vishay.com
PACKAGE DIMENSIONS
in millimeters
6.8
6.6 ± 0.1
(3.4)
Mold residue
2.2
0.8
3.2
Mold residue
2.5
Vishay Semiconductors
3
(0.635)
1.27
(3 x)
0.5 ± 0.1
(4 x)
3 x 1.27 = 3.81
Marking area
Tool
separation
line
(2.2)
1.2 ± 0.2
(1.8)
(1)
technical drawings
according to DIN
specifications
Not indicated tolerances ± 0.15
(1.65)
2.2
Proposed pad layout
from component
side
(for reference only)
3 x 1.27 = 3.81
(R1.3)
1.27
Drawing-No.: 6.550-5297.01-4
Issue: 4; 13.09.11
22608
1.8
Pick and place area
0.8
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Rev. 1.8, 13-Sep-17
Document Number: 82470
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
5
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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