|
CD4048BM |
CD4048BE |
CD4048BPW |
CD4048BEE4 |
CD4048BM96G4 |
CD4048BEG4 |
| Description |
CMOS Multifunction Expandable 8-Input Gate 16-SOIC -55 to 125 |
CMOS Multifunction Expandable 8-Input Gate 16-PDIP -55 to 125 |
CMOS Multifunction Expandable 8-Input Gate 16-TSSOP -55 to 125 |
CMOS Multifunction Expandable 8-Input Gate 16-PDIP -55 to 125 |
CMOS Multifunction Expandable 8-Input Gate 16-SOIC -55 to 125 |
IC 8IN GATE EXPND MULTI 16-DIP |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
- |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
| Parts packaging code |
SOIC |
DIP |
TSSOP |
DIP |
SOIC |
- |
| package instruction |
SOP, SOP16,.25 |
DIP-16 |
TSSOP, TSSOP16,.25 |
DIP, DIP16,.3 |
SOP, SOP16,.25 |
- |
| Contacts |
16 |
16 |
16 |
16 |
16 |
- |
| Reach Compliance Code |
compli |
compli |
compli |
compli |
compli |
- |
| series |
4000/14000/40000 |
4000/14000/40000 |
4000/14000/40000 |
4000/14000/40000 |
4000/14000/40000 |
- |
| JESD-30 code |
R-PDSO-G16 |
R-PDIP-T16 |
R-PDSO-G16 |
R-PDIP-T16 |
R-PDSO-G16 |
- |
| JESD-609 code |
e4 |
e4 |
e4 |
e4 |
e4 |
- |
| length |
9.9 mm |
19.305 mm |
5 mm |
19.305 mm |
9.9 mm |
- |
| Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
- |
| Logic integrated circuit type |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
LOGIC CIRCUIT |
- |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
- |
| Number of terminals |
16 |
16 |
16 |
16 |
16 |
- |
| Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
- |
| Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
- |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
- |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
| encapsulated code |
SOP |
DIP |
TSSOP |
DIP |
SOP |
- |
| Encapsulate equivalent code |
SOP16,.25 |
DIP16,.3 |
TSSOP16,.25 |
DIP16,.3 |
SOP16,.25 |
- |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
| Package form |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
IN-LINE |
SMALL OUTLINE |
- |
| method of packing |
TUBE |
TUBE |
TUBE |
TUBE |
TAPE AND REEL |
- |
| Peak Reflow Temperature (Celsius) |
260 |
NOT SPECIFIED |
260 |
NOT SPECIFIED |
260 |
- |
| power supply |
5/15 V |
5/15 V |
5/15 V |
5/15 V |
5/15 V |
- |
| Prop。Delay @ Nom-Su |
600 ns |
600 ns |
600 ns |
600 ns |
600 ns |
- |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
| Schmitt trigger |
NO |
NO |
NO |
NO |
NO |
- |
| Maximum seat height |
1.75 mm |
5.08 mm |
1.2 mm |
5.08 mm |
1.75 mm |
- |
| Maximum supply voltage (Vsup) |
18 V |
18 V |
18 V |
18 V |
18 V |
- |
| Minimum supply voltage (Vsup) |
3 V |
3 V |
3 V |
3 V |
3 V |
- |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
- |
| surface mount |
YES |
NO |
YES |
NO |
YES |
- |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
- |
| Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
- |
| Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
| Terminal form |
GULL WING |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
GULL WING |
- |
| Terminal pitch |
1.27 mm |
2.54 mm |
0.65 mm |
2.54 mm |
1.27 mm |
- |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
- |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
| width |
3.9 mm |
7.62 mm |
4.4 mm |
7.62 mm |
3.9 mm |
- |