Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CD214C-B320 ~ B360
Schottky Barrier Rectifier Chip Diode
Rating and Characteristic Curves
Forward Current Derating Curve
5.0
Peak Forward Surge Current (Amps)
Average Forward Current (Amps)
4.0
3.0
2.0
1.0
0.0
Single Phase Half Wave 60 Hz
Resistive or Inductive Load
25
50
75
100
125
150
175
Maximum Non-Repetitive Surge Current
120
100
80
60
40
20
0
1
Pulse Width 8.3 ms
Single Half Sine-Wave
(JEDEC Method)
2
5
10
20
50
100
Lead Temperature (°C)
Number of Cycles at 60 Hz
Typical Forward Characteristics
10
Typical Junction Capacitance
1000
Instantaneous Forward Current (Amps)
B320 to B340
Ta = 25 °C
Pulsewidth: 300 µs
1.0
B350 to B360
Capacitance (pF)
100
0.1
.01
0
0
0.2
0.4
0.6
0.8
1.0
Instantaneous Forward Voltage (Volts)
F = 1 MHz
Ta = 25 °C
0.1
1.0
4.0
10.0
100
Reverse Voltage (Volts)
Typical Reverse Characteristics
100
10
Instantaneous Reverse Current (mA)
Ta = 125 °C
Ta = 100 °C
1.0
0.1
0.01
Ta = 25 °C
0.001
0
20
40
60
80
100
120
140
Percent of Rated Peak Reverse Voltage (%)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CD214C-B320 ~ B360
Schottky Barrier Rectifier Chip Diode
Packaging Information
The product will be dispensed in Tape and Reel format (see diagram below).
P
0
P
1
E
T
120 ϒ
F
B
W
D2
D1 D
d
Index Hole
P
Trailer
A
Device
C
Leader
W1
End
....... .......
....... .......
.......
....... ....... .......
10 pitches (min.)
10 pitches (min.)
Start
MM
DIMENSIONS:
(INCHES)
Direction of Feed
Devices are packed in accordance with EIA standard
RS-481-A and specifications shown here.
Item
Carrier Width
Carrier Length
Carrier Depth
Sprocket Hole
Reel Outside Diameter
Reel Inner Diameter
Feed Hole Diameter
Sprocket Hole Position
Punch Hole Position
Punch Hole Pitch
Sprocket Hole Pitch
Embossment Center
Overall Tape Thickness
Tape Width
Reel Width
Quantity per Reel
Symbol
A
B
C
d
D
D1
D2
E
F
P
P0
P1
T
W
W1
--
SMC (DO-214AB)
7.22 ± 0.10
(0.284 - 0.004)
8.11 ± 0.10
(0.319 - 0.004)
2.36 ± 0.10
(0.093 - 0.004)
1.55 ± 0.05
(0.061 - 0.002)
330
(12.992)
50.0
MIN.
(1.969)
13.0 ± 0.20
(0.512 - 0.008)
1.75 ± 0.10
(0.069 - 0.004))
7.50 ± 0.10
(0.295 - 0.004)
4.00 ± 0.10
(0.157 - 0.004)
4.00 ± 0.10
(0.157 - 0.004)
2.00 ± 0.10
(0.079 - 0.004)
0.30 ± 0.10
(0.012 - 0.004)
16.00 ± 0.20
(0.630 - 0.008)
22.4
MAX.
(0.882)
3,000
REV. 01/18
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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