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BLF6G20-110112

Description
RF MOSFET Transistors LDMOS TNS
Categorysemiconductor    Discrete semiconductor   
File Size918KB,11 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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BLF6G20-110112 Overview

RF MOSFET Transistors LDMOS TNS

BLF6G20-110112 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerNXP
Product CategoryRF MOSFET Transistors
RoHSDetails
Transistor PolarityN-Channel
Id - Continuous Drain Current29 A
Vds - Drain-Source Breakdown Voltage65 V
Rds On - Drain-Source Resistance160 mOhms
TechnologySi
Minimum Operating Temperature- 65 C
Maximum Operating Temperature+ 150 C
Mounting StyleSMD/SMT
Package / CaseSOT-539A-5
PackagingTube
ConfigurationSingle
Height4.72 mm
Length20.02 mm
TypeRF Power MOSFET
Width9.91 mm
Channel ModeEnhancement
NumOfPackaging1
Factory Pack Quantity60
Vgs - Gate-Source Voltage13 V
BLF6G20-110; BLF6G20LS-110
Power LDMOS transistor
Rev. 4 — 1 September 2015
Product data sheet
1. Product profile
1.1 General description
110 W LDMOS power transistor for base station applications at frequencies from
1800 MHz to 2000 MHz.
Table 1.
Typical performance
RF performance at T
case
= 25
C in a common source class-AB production test circuit.
Mode of operation
2-carrier W-CDMA
[1]
f
(MHz)
1930 to 1990
V
DS
(V)
28
P
L(AV)
(W)
25
G
p
(dB)
19
D
(%)
32
IMD3
(dBc)
34
[1]
ACPR
(dBc)
38
[1]
Test signal: 3GPP; test model 1; 64 DPCH; PAR = 7 dB at 0.01 % probability on CCDF per carrier; carrier
spacing 10 MHz.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features
Typical 2-carrier W-CDMA performance at frequencies of 1930 MHz and 1990 MHz,
a supply voltage of 28 V and an I
Dq
of 900 mA:
Average output power = 25 W
Power gain = 19 dB
Efficiency = 32 %
IMD3 =
34
dBc
ACPR =
38
dBc
Easy power control
Integrated ESD protection
Excellent ruggedness
High efficiency
Excellent thermal stability
Designed for broadband operation (1800 MHz to 2000 MHz)
Internally matched for ease of use
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)

BLF6G20-110112 Related Products

BLF6G20-110112 BLF6G20LS-110,118 BLF6G20LS-110,112
Description RF MOSFET Transistors LDMOS TNS RF MOSFET Transistors LDMOS TNS RF MOSFET Transistors LDMOS TNS
Configuration Single SINGLE SINGLE
Brand Name - NXP Semiconductor NXP Semiconductor
Is it Rohs certified? - conform to conform to
Maker - NXP NXP
Parts packaging code - SOT SOT
package instruction - ROHS COMPLIANT, CERAMIC PACKAGE-2 ROHS COMPLIANT, CERAMIC PACKAGE-2
Contacts - 2 2
Manufacturer packaging code - SOT502B SOT502B
Reach Compliance Code - compliant compliant
ECCN code - EAR99 EAR99
Shell connection - SOURCE SOURCE
Minimum drain-source breakdown voltage - 65 V 65 V
Maximum drain current (Abs) (ID) - 29 A 29 A
Maximum drain current (ID) - 29 A 29 A
FET technology - METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
highest frequency band - L BAND L BAND
JESD-30 code - R-CDFP-F2 R-CDFP-F2
Number of components - 1 1
Number of terminals - 2 2
Operating mode - ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature - 225 °C 225 °C
Package body material - CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape - RECTANGULAR RECTANGULAR
Package form - FLATPACK FLATPACK
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED
Polarity/channel type - N-CHANNEL N-CHANNEL
Certification status - Not Qualified Not Qualified
surface mount - YES YES
Terminal form - FLAT FLAT
Terminal location - DUAL DUAL
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED
transistor applications - AMPLIFIER AMPLIFIER
Transistor component materials - SILICON SILICON

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