Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Characteristics
DC Supply Voltage
DC Input Voltage
DC Output Voltage
V
CC
= 0
High or Low State
Symbol
V
CC
V
IN
V
OUT
T
A
t
r
, t
f
Min
2.0
0.0
0.0
0.0
−55
0
0
Max
5.5
5.5
5.5
V
CC
+125
100
20
Unit
V
V
V
°C
ns/V
Operating Temperature Range
Input Rise and Fall Time
V
CC
= 3.3 V
±
0.3 V
V
CC
= 5.0 V
±
0.5 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
TEST POINT
3.0V
A
50%
GND
t
PLH
t
PHL
V
OH
Y
50% V
CC
V
OL
*Includes all probe and jig capacitance
OUTPUT
DEVICE
UNDER
TEST
C
L
*
Figure 1. Switching Waveforms
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2
Figure 2. Test Circuit
MC74VHCT50A
DC ELECTRICAL CHARACTERISTICS
V
CC
Symbol
V
IH
Parameter
Minimum High−Level
Input Voltage
Maximum Low−Level
Input Voltage
Minimum High−Level
Output Voltage
V
IN
= V
IH
or V
IL
V
IN
= V
IH
or V
IL
I
OH
=
−50
mA
V
IN
= V
IH
or V
IL
I
OH
=
−4
mA
I
OH
=
−8
mA
V
IN
= V
IH
or V
IL
I
OL
= 50
mA
V
IN
= V
IH
or V
IL
I
OH
=
−4
mA
I
OL
= 8 mA
V
IN
= 5.5 V or GND
V
IN
= V
CC
or GND
Input: V
IN
= 3.4 V
V
OUT
= 5.5 V
Test Conditions
(V)
3.0
4.5
5.5
3.0
4.5
5.5
3.0
4.5
3.0
4.5
3.0
4.5
3.0
4.5
0 to
5.5
5.5
5.5
0.0
2.9
4.4
2.58
3.94
0.0
0.0
0.1
0.1
0.36
0.36
±0.1
2.0
1.35
0.5
3.0
4.5
Min
1.2
2.0
2.0
0.53
0.8
0.8
2.9
4.4
2.48
3.80
0.1
0.1
0.44
0.44
±1.0
20
1.50
5.0
T
A
= 25°C
Typ
Max
T
A
≤
85°C
Min
1.2
2.0
2.0
0.53
0.8
0.8
2.9
4.4
2.34
3.66
0.1
0.1
0.52
0.52
±1.0
40
1.65
10
Max
T
A
≤
125°C
Min
1.2
2.0
2.0
0.53
0.8
0.8
Max
Unit
V
V
IL
V
V
OH
V
V
V
OL
Maximum Low−Level
Output Voltage
V
IN
= V
IH
or V
IL
V
V
I
IN
I
CC
I
CCT
I
OFF
Maximum Input
Leakage Current
Maximum Quiescent
Supply Current
Quiescent Supply
Current
Output Leakage
Current
μA
μA
mA
μA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS
(C
load
= 50 pF, Input t
r
= t
f
= 3.0ns)
Symbol
Parameter
Test Conditions
Min
T
A
= 25°C
Typ
5.5
8.0
6.2
7.0
5
T
A
≤
85°C
T
A
≤
125°C
Max
7.9
11.4
7.5
8.5
10
Min
1.0
1.0
Max
Min
Max
Unit
ns
t
PLH
,
t
PHL
Maximum
Propogation Delay,
Input A to Y
V
CC
= 3.3
±
0.3 V
V
CC
= 5.0
±
0.5 V
C
L
= 15 pF
C
L
= 50 pF
C
L
= 15 pF
C
L
= 50 pF
9.5
13.0
8.5
9.5
10
9.5
10.5
10
pF
C
IN
Maximum Input
Capacitance
Typical @ 25°C, V
CC
= 5.0 V
15
C
PD
Power Dissipation Capacitance (Note 6)
pF
6. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
. C
PD
is used to determine the no−load dynamic
power consumption; P
D
= C
PD
V
CC2
f
in
+ I
CC
V
CC
.
NOISE CHARACTERISTICS
(Input t
r
= t
f
= 3.0ns, C
L
= 50pF, V
CC
= 5.0V)
T
A
= 25°C
Symbol
V
OLP
V
OLV
V
IHD
V
ILD
Characteristic
Quiet Output Maximum Dynamic V
OL
Quiet Output Minimum Dynamic V
OL
Minimum High Level Dynamic Input Voltage
Maximum Low Level Dynamic Input Voltage
Typ
0.8
−0.8
Max
1.0
−1.0
2.0
0.8
Unit
V
V
V
V
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3
MC74VHCT50A
ORDERING INFORMATION
Device
MC74VHCT50ADR2G
MC74VHCT50ADTR2G
NLVVHCT50ADTR2G*
Package
SOIC−14
(Pb−Free)
TSSOP−14
(Pb−Free)
Shipping
†
2500 / Tape & Reel
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
MARKING DIAGRAMS
(Top View)
14
13
12
11
10
9
8
14 13 12 11 10
VHCT
50A
ALYWG
G
5
6
7
1
2
3
4
5
6
7
9
8
VHCT50AG
AWLYWW*
1
2
3
4
14−LEAD SOIC
D SUFFIX
CASE 751A
A
WL, L
Y
WW, W
G or
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
14−LEAD TSSOP
DT SUFFIX
CASE 948G
*See Applications Note #AND8004/D for date code and traceability information.
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
14
1
SCALE 1:1
D
14
8
SOIC−14 NB
CASE 751A−03
ISSUE L
DATE 03 FEB 2016
A
B
A3
E
L
H
1
7
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0
_
7
_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0
_
7
_
0.25
M
B
M
13X
b
0.25
M
C A
A
S
B
S
X 45
_
h
DETAIL A
0.10
e
A1
C
M
SEATING
PLANE
SOLDERING FOOTPRINT*
6.50
1
14X
GENERIC
MARKING DIAGRAM*
14
XXXXXXXXXG
AWLYWW
1
XXXXX
A
WL
Y
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
1.18
1.27
PITCH
0.58
14X
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “
G”,
may or may not be present.
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
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ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
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