The MAX6477–MAX6484 are constructed using a unique set of packaging techniques that impose a limit on the thermal pro-
file the devices can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder
profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and
Convection reflow. Pre-heating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
IN
= (V
OUT
+ 0.5V) or +2.5V, whichever is greater, C
OUT
= 3.3µF, T
A
= -40°C to +85°C. Typical specifications are at T
A
= +25°C,
unless otherwise noted.) (Note 2)
PARAMETER
Input Voltage Range
Input Undervoltage Lockout
Supply Current (Ground Current)
Shutdown Supply Current
REGULATOR CIRCUIT
Output Current
Output Voltage Accuracy (Fixed
Output Voltage Operation,
Table 1) MAX6469–MAX6476
Output Voltage Accuracy (Fixed
Output Voltage Operation,
Table 1) MAX6477–MAX6484
Adjustable Output Voltage Range
SET Reference Voltage
SET Dual Mode
TM
Threshold
SET Input Leakage Current
1mA
≤
I
OUT
≤
150mA, T
A
= +25°C
1mA
≤
I
OUT
≤
150mA, T
A
= -40°C to +85°C
1mA
≤
I
OUT
≤
300mA, T
A
= -40°C to +85°C
2mA
≤
I
OUT
≤
100mA, T
A
= +25°C
2mA
≤
I
OUT
≤
100mA, T
A
= -40°C to +85°C
2mA
≤
I
OUT
≤
300mA, T
A
= -40°C to +85°C
(Note 3)
V
SET
I
SET
V
SET
= 0V, +1.2V (Note 3)
SYMBOL
V
IN
V
UVLO
I
Q
I
SHDN
V
IN
falling
I
OUT
= 0A
I
OUT
= 300mA
T
A
= +25°C
300
-1.3
-2.3
-2.7
-1.1
-2.0
-2.5
V
SET
1.200
CONDITIONS
MIN
2.5
2.25
82
96
0.1
TYP
MAX
5.5
2.47
136
1
UNITS
V
V
µA
µA
mA
+1.3
+2.3
+2.7
+1.1
+2.0
+2.5
5.0
1.258
±100
V
V
mV
nA
%
%
1.229
185
±20
Dual Mode is a trademark of Maxim Integrated Products, Inc.
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Embedded System
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