TMS320VC5404GGU datasheet, PDF

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TMS320VC5404GGU: DescriptionDigital Signal Processors & Controllers - DSP, DSC Dig Sig Proc; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，114 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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Digital Signal Processors & Controllers - DSP, DSC Dig Sig Proc

TMS320VC5404GGU Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	PLASTIC, BGA-144
Contacts	144
Reach Compliance Code	_compli
Factory Lead Time	1 week
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	23
barrel shifter	YES
bit size	16
boundary scan	YES
maximum clock frequency	20 MHz
External data bus width	16
Format	FIXED POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B144
JESD-609 code	e0
length	12 mm
low power mode	NO
Humidity sensitivity level	3
Number of terminals	144
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA144,13X13,32
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	220
power supply	1.5,3.3 V
Certification status	Not Qualified
RAM (number of words)	16384
Maximum seat height	1.4 mm
Maximum supply voltage	1.65 V
Minimum supply voltage	1.42 V
Nominal supply voltage	1.5 V
surface mount	YES
technology	CMOS
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	12 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER

TMS320VC5404GGU Related Products

	TMS320VC5404GGU	TMS320VC5407GGU
Description	Digital Signal Processors & Controllers - DSP, DSC Dig Sig Proc	Digital Signal Processors & Controllers - DSP, DSC Dig Signal Proc
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible
Parts packaging code	BGA	BGA
package instruction	PLASTIC, BGA-144	LFBGA, BGA144,13X13,32
Contacts	144	144
Reach Compliance Code	_compli	_compli
Other features	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
Address bus width	23	23
barrel shifter	YES	YES
bit size	16	16
boundary scan	YES	YES
maximum clock frequency	20 MHz	20 MHz
External data bus width	16	16
Format	FIXED POINT	FIXED POINT
Internal bus architecture	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B144	S-PBGA-B144
JESD-609 code	e0	e0
length	12 mm	12 mm
low power mode	NO	NO
Humidity sensitivity level	3	3
Number of terminals	144	144
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA
Encapsulate equivalent code	BGA144,13X13,32	BGA144,13X13,32
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	220	220
power supply	1.5,3.3 V	1.5,3.3 V
Certification status	Not Qualified	Not Qualified
RAM (number of words)	16384	40960
Maximum seat height	1.4 mm	1.4 mm
Maximum supply voltage	1.65 V	1.65 V
Minimum supply voltage	1.42 V	1.42 V
Nominal supply voltage	1.5 V	1.5 V
surface mount	YES	YES
technology	CMOS	CMOS
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	12 mm	12 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER

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