PROTECTION PRODUCTS - MicroClamp
®
Description
The
μClamp
®
series of TVS arrays are designed to pro-
tect sensitive electronics from damage or latch-up due
to ESD. It is designed to replace single line devices such
as multilayer varistors (MLVs) in space constrained ap-
plications such as cell phones, notebook computers, and
other portable electronics. It features large cross-sec-
tional area junctions for conducting high transient cur-
rents. TVS diodes offer desirable characteristics for
board level protection including fast response time, low
operating and clamping voltage, and no device degrada-
tion.
The
μClamp
®
0504T is in a 6-pin SLP1313P6T package.
It measures 1.3 x 1.3 mm with a nominal height of only
0.4mm. The leads are spaced at a pitch of 0.4mm
and are finished with lead-free NiPdAu. Each device
features four TVS diodes with an operating voltage of
5 volts and a maximum loading capacitance of only
10pF.
They may be used to meet the ESD immunity require-
ments of IEC 61000-4-2, Level 4 (±15kV air, ±8kV
contact discharge). The combination of small size and
high ESD surge capability makes them ideal for use in
portable applications such as cellular phones, digital
cameras, and notebook computers.
Low Profile
μClamp
®
4-Line ESD Protection
Features
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
Ultra-small package
Protects four data lines
Low clamping voltage
Working voltage: 5V
Low capacitance (10pF)
Solid-state silicon-avalanche technology
uClamp0504T
Mechanical Characteristics
SLP1313P6T package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.3 x 1.3 x 0.4 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code
Packaging : Tape and Reel
Applications
Cellular Handsets & Accessories
Notebooks & Handhelds
mp3 Players
Cordless Phones
Portable Instrumentation
Digital Cameras
Peripherals
Dimensions
1.30
1 2
3
Schematic
1
1.30
3
4
6
6
5
4
0.40 BSC
0.40
Nominal Dimensions (mm)
(SLP1313P6T Bottom View)
Revision 10/07/2009
1
Center Tab (GND)
Note: Pin 2 and 5 are N.C.
www.semtech.com
uClamp0504T
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Peak Pulse Power (tp = 8/20
μ
s)
Maximum Peak Pulse Current (tp = 8/20
μ
s)
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
Op erating Temp erature
Storage Temp erature
Symbol
P
p k
I
p p
V
ESD
T
J
T
STG
Value
25
2
+/- 20
+/- 15
-55 to +125
-55 to +150
Units
Watts
Amps
kV
°C
°C
Electrical Characteristics (T=25
o
C)
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Forward Voltage
Clamp ing Voltage
Junction Cap acitance
Junction Cap acitance
Symbol
V
RWM
V
BR
I
R
V
F
V
C
C
j
C
j
I
t
= 1mA
V
RWM
= 5V, T=25°C
I
F
= 10mA
I
PP
= 2A, t
p
= 8/20
μ
s
V
R
= 0V, f = 1MHz
V
R
= 3.3V, f = 1MHz
4.5
1
6
0.25
1.2
12.5
10
Conditions
Minimum
Typical
Maximum
5
Units
V
V
μ
A
V
V
pF
pF
©
2009 Semtech Corp.
2
www.semtech.com
uClamp0504T
PROTECTION PRODUCTS
Applications Information
Device Connection Options
This device is designed to protect four data lines. The
device is unidirectional and may be used on lines
where the signal polarity is above ground.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
Circuit Diagram
1
3
4
6
Center Tab (GND)
Note: Pin 2 and 5 are N.C.
©
2009 Semtech Corp.
4
www.semtech.com
京公网安备 11010802033920号
EEWORLD
