LA363B5
Technical
METAL CASE, CASE-MOUNTED
SEMICONDUCTORS
LA363B5
Natural Conv. (°C/W): 11.1
Forced Air (°C/W): 3.9
Mounting Envelope: 1.63" x 1.29" x 1.25"
DESCRIPTION OF CURVES
A.
B.
C.
D.
E.
N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.
•
•
Thermal Resistance Case to Sink is 1.0-1.4
°C/W
w/Joint Compound.
Derate 0.7
°C/watt
for unplated part in natural convection only.
Ordering Information
Unplated
LA363B5U
CTS IERC PART NO.
Comm'l. Black
Mil. Black
Anodize
Anodize
LA363B5CB
LA363B5B
Semiconductor
Accommodated
Any TO-3 can
Hole patt.
ref. no.
3
Max. Weight
(Grams)
12.6
HOLE PATTERNS
3.
Hole pattern no. 363 accommodates T0-3s or T0-3 ICs.
Available in LA-B series heat dissipators only.
CTS IERC, Heat Sinks and Thermal Management Solutions
413 North Moss Street, Burbank, California 91502
Tel: (818) 842-7277
Fax: (818) 848-8872
Rev. 03-04-03
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