The MAX6477–MAX6484 are constructed using a unique set of packaging techniques that impose a limit on the thermal pro-
file the devices can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder
profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and
Convection reflow. Pre-heating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
IN
= (V
OUT
+ 0.5V) or +2.5V, whichever is greater, C
OUT
= 3.3µF, T
A
= -40°C to +85°C. Typical specifications are at T
A
= +25°C,
unless otherwise noted.) (Note 2)
PARAMETER
Input Voltage Range
Input Undervoltage Lockout
Supply Current (Ground Current)
Shutdown Supply Current
REGULATOR CIRCUIT
Output Current
Output Voltage Accuracy (Fixed
Output Voltage Operation,
Table 1) MAX6469–MAX6476
Output Voltage Accuracy (Fixed
Output Voltage Operation,
Table 1) MAX6477–MAX6484
Adjustable Output Voltage Range
SET Reference Voltage
SET Dual Mode
TM
Threshold
SET Input Leakage Current
1mA
≤
I
OUT
≤
150mA, T
A
= +25°C
1mA
≤
I
OUT
≤
150mA, T
A
= -40°C to +85°C
1mA
≤
I
OUT
≤
300mA, T
A
= -40°C to +85°C
2mA
≤
I
OUT
≤
100mA, T
A
= +25°C
2mA
≤
I
OUT
≤
100mA, T
A
= -40°C to +85°C
2mA
≤
I
OUT
≤
300mA, T
A
= -40°C to +85°C
(Note 3)
V
SET
I
SET
V
SET
= 0V, +1.2V (Note 3)
SYMBOL
V
IN
V
UVLO
I
Q
I
SHDN
V
IN
falling
I
OUT
= 0A
I
OUT
= 300mA
T
A
= +25°C
300
-1.3
-2.3
-2.7
-1.1
-2.0
-2.5
V
SET
1.200
CONDITIONS
MIN
2.5
2.25
82
96
0.1
TYP
MAX
5.5
2.47
136
1
UNITS
V
V
µA
µA
mA
+1.3
+2.3
+2.7
+1.1
+2.0
+2.5
5.0
1.258
±100
V
V
mV
nA
%
%
1.229
185
±20
Dual Mode is a trademark of Maxim Integrated Products, Inc.
SSD1306 is an OLED driver chip with a maximum support of 128*64 pixels, and is widely used in driving small-size OLED displays. In particular, its low display power consumption makes it a good combina...
Does anyone know how to connect the development board of msp430f5529 to ldc1000, as shown in the attached pdf file, and follow the instructions in the file, such as loading the program, updating the d...
[i=s]This post was last edited by 灞波儿奔 on 2019-4-21 18:10[/i] [size=4]This design demonstrates how TI mmWave sensor technology can be used for area occupancy detection to monitor an area of interest w...
I saw a signed integer multiplication calculation on the Internet. Could anyone explain it to me?Why is the addition here different from what we usually do? How should we understand it?...
I bought a cheap chip and want to make an emulator myself. There is no startup program in it. I want to DIY an emulator. Can anyone who succeeded send me a usable one? 1. Circuit diagram 2. Software 3...
Medicines are special commodities. If patients are given the wrong medicine, fake medicine, inferior medicine or expired medicine, it will pose a threat to people's health and lives.
In recent...[Details]
Blood pressure is one of the important physiological parameters of the human body. Accurate measurement of it is conducive to early detection and identification of hypertension types, and to the pro...[Details]
Many medical applications require portable, self-powered devices that do not require external power and data cables. The most obvious example is a portable data logger that patients carry with them to...[Details]
JTAG Technology Introduction
One disadvantage of shrinking technology is that the complexity of testing small devices increases dramatically. When the board area is large, the board is tested...[Details]
This summary will introduce the transmitter characteristic test of TD terminal products - uplink power control. According to the 3GPP TS34.122 standard, UE uplink power control is divided into uplink ...[Details]
Wireless personal area networks (or WPANs) are particularly useful for sensing, monitoring, and control applications. Cost-effective WPANs have the unique potential to implement wireless connectivi...[Details]
Introduction With the continuous development of economy, people's demand for automobiles is increasing day by day. Correspondingly, automobile consumer groups are becoming more and more mature. It...[Details]
In recent years, the development of automotive electronic technology has significantly improved vehicle safety performance. One of the technologies that is expected to be widely used is the tire p...[Details]
0 Introduction
At present, most of the automatic blood pressure monitoring systems used in hospitals are imported equipment, which are expensive and increase the cost of medical treatment. The...[Details]
Capacitive sensing user interfaces are emerging as a practical and innovative alternative to mechanical buttons in mobile phones. While capacitive sensors can be viewed as a drop-in replacement fo...[Details]
Abstract:
Online dynamic signature authentication is increasingly used in various fields, especially in banking and financial systems and personal identification. As the basis of online signa...[Details]
When it comes to ATX power supply, people will think of two "classic" ICs: pulse width modulation chip TL494 and voltage comparator LM339. The new dedicated control chip AT2005B has the functions ...[Details]
After more than ten years of technological development and application market cultivation, biometric technology has been applied on a large scale in many application fields. As far as the Chinese m...[Details]
As mobile phones and other portable devices have more functions, there are more potential input and output (I/O) channels for electrostatic discharge (ESD) voltage to enter, including keyboards, bu...[Details]
introduction
The latest embedded designs enable a multitude of complex new products and services across a wide range of industries and applications. Driven by shrinking cost constraints an...[Details]