
I/O Controller Interface IC 10MHz CMOS USC XTEMP
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Zilog, Inc. |
| Parts packaging code | LCC |
| package instruction | QCCJ, |
| Contacts | 68 |
| Reach Compliance Code | unknown |
| Address bus width | 16 |
| boundary scan | NO |
| Bus compatibility | 8X86; 680X0 |
| maximum clock frequency | 20 MHz |
| letter of agreement | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC; BISYNC TRANSPARENT; NBIP |
| Data encoding/decoding methods | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL |
| Maximum data transfer rate | 1.25 MBps |
| External data bus width | 16 |
| JESD-30 code | S-PQCC-J68 |
| JESD-609 code | e3 |
| length | 24.23 mm |
| low power mode | NO |
| Number of serial I/Os | 2 |
| Number of terminals | 68 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | MATTE TIN |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 40 |
| width | 24.23 mm |
| uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |

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| Z16C3010VEG | Z16C3010ASG | |
|---|---|---|
| Description | I/O Controller Interface IC 10MHz CMOS USC XTEMP | I/O Controller Interface IC 10MHz CMOS USC |
| Is it lead-free? | Lead free | Lead free |
| Parts packaging code | LCC | QFP |
| package instruction | QCCJ, | LFQFP, |
| Contacts | 68 | 100 |
| Reach Compliance Code | unknown | unknown |
| Address bus width | 16 | 16 |
| boundary scan | NO | NO |
| Bus compatibility | 8X86; 680X0 | 8X86; 680X0 |
| maximum clock frequency | 20 MHz | 20 MHz |
| letter of agreement | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC; BISYNC TRANSPARENT; NBIP | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; EXT SYNC; BISYNC TRANSPARENT; NBIP |
| Data encoding/decoding methods | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL |
| Maximum data transfer rate | 1.25 MBps | 1.25 MBps |
| External data bus width | 16 | 16 |
| JESD-30 code | S-PQCC-J68 | S-PQFP-G100 |
| length | 24.23 mm | 14 mm |
| low power mode | NO | NO |
| Number of serial I/Os | 2 | 2 |
| Number of terminals | 68 | 100 |
| Maximum operating temperature | 85 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | LFQFP |
| Package shape | SQUARE | SQUARE |
| Package form | CHIP CARRIER | FLATPACK, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 4.57 mm | 1.6 mm |
| Maximum supply voltage | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL |
| Terminal form | J BEND | GULL WING |
| Terminal pitch | 1.27 mm | 0.5 mm |
| Terminal location | QUAD | QUAD |
| Maximum time at peak reflow temperature | 40 | NOT SPECIFIED |
| width | 24.23 mm | 14 mm |
| uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |