2.1 State Control Circuit ..................................................................................................................................................................................9
2.1.1 Normal Mode..............................................................................................................................................................................10
2.1.2 Fast Lock Mode..........................................................................................................................................................................10
2.2 Frequency Select Circuit .........................................................................................................................................................................10
2.4 Invalid Input Signal Detection ..................................................................................................................................................................10
2.5 TIE Control Block.....................................................................................................................................................................................11
2.6.5 Digital Control Oscillator (DCO)..................................................................................................................................................13
2.10 Power Supply Filtering Techniques .........................................................................................................................................................15
Measures of Performance ...............................................................................................................................................................................16
3.3 Jitter Transfer ..........................................................................................................................................................................................16
3.4 Frequency Accuracy................................................................................................................................................................................16
3.6 Capture Range ........................................................................................................................................................................................16
3.7 Lock Range .............................................................................................................................................................................................16
3.9 Time Interval Error (TIE)..........................................................................................................................................................................16
3.10 Maximum Time Interval Error (MTIE) ......................................................................................................................................................16
Absolute Maximum Ratings ............................................................................................................................................................................18
Recommended DC Operating Conditions .....................................................................................................................................................18
DC Electrical Characteristics ..........................................................................................................................................................................18
6.1 Single End Input/Output Port...................................................................................................................................................................18
6.2 Differential Output Port (LVDS) ...............................................................................................................................................................19
AC Electrical Characteristics ..........................................................................................................................................................................20
Ordering Information .......................................................................................................................................................................................31
State Control Circuit ............................................................................................................................................................................ 9
State Control Diagram......................................................................................................................................................................... 9
TIE Control Block Diagram................................................................................................................................................................ 11
Reference Switch with TIE Control Block Enabled............................................................................................................................ 11
Reference Switch with TIE Control Block Disabled........................................................................................................................... 12
IDT82V3011 Power Decoupling Scheme.......................................................................................................................................... 15
Timing Parameter Measurement Voltage Levels .............................................................................................................................. 26
Input to Output Timing (Normal Mode).............................................................................................................................................. 28
Input Control Setup and Hold Timing ................................................................................................................................................ 30
1. Circuit Function Overview
The infrared diode sensing circuit can realize that when the hand is close to the infrared transmitting tube and the infrared receiving tube, the buzzer sounds and the L...
[align=left][size=14px]The flower pad, also called the heat dissipation pad, Thermal Pad, is a way to connect the inner layer of a multilayer board to other layers through vias. Sometimes the connecti...
Waveform generation [ 1] . Standard pulse generators and arbitrary waveform generators are designed to generate waveforms at fixed cycle intervals rather than the Log ( time ) numbers required for mos...
Preparation: 1. Download rt_thread source code 2. Download ENV tool: 3. Hardware F407 4. Open the BSP/stm32f4xx-HAL folder under the rt_thread source code path and open it with the ENV tool 5. In RT-T...
Maylove is a good person. He gave me a board and I tried it. It's very good. Ti's CCS is getting better and better. I believe there are many engineers developing and maintaining it. It is getting bett...
On August 24th, Tesla CEO Elon
Musk
revealed information about the upcoming FSD V14, claiming it will outperform human drivers. Tesla FSD lead Ashok stated last year that FSD version 12.5, ...[Details]
Reflow soldering is a critical process in electronics assembly production, and the cleanliness of the reflow oven has a direct impact on product quality. Dust and residue accumulation within the ov...[Details]
On August 22, Lantu Motors officially launched its Lanhai Intelligent Hybrid technology via an online livestream. This intelligent hybrid technology, which integrates a full-range 800V high-voltage...[Details]
On August 20th, Tiantai Robotics Co., Ltd., along with strategic partners including Shandong Future Robotics Technology Co., Ltd., Shandong Future Data Technology Co., Ltd., and Gangzai Robotics Gr...[Details]
1. Ease of Use: The HMI module should be designed to be simple and clear, allowing users to easily operate and configure the energy storage device.
2. Ease of Maintenance: The HMI module should...[Details]
On August 22, according to CNBC's report today, the National Highway Traffic Safety Administration (NHTSA) is launching an investigation into Tesla, and the latter is questioned whether it has fail...[Details]
Industrial computers with GPUs leverage powerful parallel processing to build deep learning models to analyze and respond to optical inputs. The systems develop an understanding of visual data to i...[Details]
On August 20, Geely announced its focus on "One Cockpit". Through a unified AI OS architecture, a unified AI Agent, and a unified user ID, it will achieve an All-in-One AI cockpit, create the first...[Details]
Charging is an essential topic for electric vehicles. Batteries are a core component of new energy vehicles. So, what's the optimal charge level for electric vehicles? Based on current battery tech...[Details]
I recently read an article in the Wall Street Journal titled "We need the right to repair our gadgets" (reference original article: ). The author was very angry about the phenomenon of "planned obs...[Details]
The characteristics of electric vehicles place high demands on the motors they use. To increase top speed, the motor should have high instantaneous power and power density (W/kg); to increase drivi...[Details]
As the electric vehicle industry continues to surge in today's society, while people are concerned about the appearance and interior of new energy vehicles, they are also concerned about the classi...[Details]
Pure electric vehicles have experienced rapid growth in recent years, and many consumers now consider them as a top choice when purchasing a car. But do you know how to choose a satisfactory and sa...[Details]
In industrial production, many different controllers are often used, such as those for pressure, flow, electrical parameters, temperature, and sound. However, due to the limitations of the on-site ...[Details]
In the wave of electrification and intelligence in the automotive industry, the E/E architecture is transitioning from distributed to domain control and then to regional architecture.
Th...[Details]