M368L3313DTL datasheet, PDF - EEWORLD Datasheet

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M368L3313DTL: Description256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM); File Size88KB，12 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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M368L3313DTL Overview

256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM)

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M368L3313DTL

184pin Unbuffered DDR SDRAM MODULE

256MB DDR SDRAM MODULE

(32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM)

Unbuffered 184pin DIMM

64-bit Non-ECC/Parity

Revision 0.2

May. 2002

Rev. 0.2 May.2002

M368L3313DTL Related Products

	M368L3313DTL	M368L3313DTL-CA2	M368L3313DTL-CB0	M368L3313DTL-CB3
Description	256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM)	256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM)	256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM)	256MB DDR SDRAM MODULE (32Mx64(16Mx64*2 bank) based on 16Mx8 DDR SDRAM)
Is it Rohs certified?	-	incompatible	incompatible	incompatible
Maker	-	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	-	DIMM	DIMM	DIMM
package instruction	-	DIMM, DIMM184	DIMM, DIMM184	DIMM, DIMM184
Contacts	-	184	184	184
Reach Compliance Code	-	compli	compli	compli
ECCN code	-	EAR99	EAR99	EAR99
access mode	-	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	-	0.75 ns	0.75 ns	0.7 ns
Other features	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	-	133 MHz	133 MHz	166 MHz
I/O type	-	COMMON	COMMON	COMMON
JESD-30 code	-	R-XDMA-N184	R-XDMA-N184	R-XDMA-N184
memory density	-	2147483648 bi	2147483648 bi	2147483648 bi
Memory IC Type	-	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	-	64	64	64
Humidity sensitivity level	-	1	1	1
Number of functions	-	1	1	1
Number of ports	-	1	1	1
Number of terminals	-	184	184	184
word count	-	33554432 words	33554432 words	33554432 words
character code	-	32000000	32000000	32000000
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	-	70 °C	70 °C	70 °C
organize	-	32MX64	32MX64	32MX64
Output characteristics	-	3-STATE	3-STATE	3-STATE
Package body material	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	-	DIMM	DIMM	DIMM
Encapsulate equivalent code	-	DIMM184	DIMM184	DIMM184
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	-	225	225	225
power supply	-	2.5 V	2.5 V	2.5 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified
refresh cycle	-	4096	4096	4096
self refresh	-	YES	YES	YES
Maximum supply voltage (Vsup)	-	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	-	2.3 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	-	2.5 V	2.5 V	2.5 V
surface mount	-	NO	NO	NO
technology	-	CMOS	CMOS	CMOS
Temperature level	-	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	-	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	-	1.27 mm	1.27 mm	1.27 mm
Terminal location	-	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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