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MM5Z12VT1

Description
Zener Diodes 12V 200mW
CategoryDiscrete semiconductor    diode   
File Size95KB,4 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance
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Zener Diodes 12V 200mW

MM5Z12VT1 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instruction0.047 X 0.032 INCH, 0.028 INCH HEIGHT, PLASTIC, CASE 502-01, 2 PIN
Contacts2
Manufacturer packaging codeCASE 502-01
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance25 Ω
JESD-30 codeR-PDSO-F2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.2 W
Certification statusNot Qualified
Nominal reference voltage12 V
surface mountYES
technologyZENER
Terminal surfaceTin (Sn)
Terminal formFLAT
Terminal locationDUAL
Maximum time at peak reflow temperature40
Maximum voltage tolerance5.39%
Working test current5 mA
Base Number Matches1
MM5ZxxxT1G Series,
SZMM5ZxxxT1G Series
Zener Voltage Regulators
300 mW SOD−523 Surface Mount
This series of Zener diodes is packaged in a SOD−523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
Specification Features:
http://onsemi.com
Standard Zener Breakdown Voltage Range
2.4 V to 75 V
Steady State Power Rating of 300 mW
Small Body Outline Dimensions:
SOD−523
CASE 502
STYLE 1
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
Low Body Height: 0.028″ (0.7 mm)
ESD Rating of Class 3 (> 16 kV) per Human Body Model
AEC−Q101 Qualified and PPAP Capable
SZMM5ZxxxT1G
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These are Pb−Free Devices*
1
Cathode
2
Anode
MARKING DIAGRAM
XX M
G
G
1
2
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH:
100% Matte Sn (Tin)
MOUNTING POSITION:
Any
QUALIFIED MAX REFLOW TEMPERATURE:
260°C
XX = Specific Device Code
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Total Device Dissipation FR−5 Board,
@ T
A
= 25°C
Thermal Resistance,
Junction−to−Ambient (Note 1)
Junction and Storage
Temperature Range
Symbol
P
D
R
qJA
T
J
, T
stg
Max
300
390
−65
to +150
Unit
mW
°C/W
°C
ORDERING INFORMATION
Device
MM5ZxxxxT1G
SZMM5ZxxxT1G
Package
SOD−523
(Pb−Free)
SOD−523
(Pb−Free)
Shipping
3,000 /
Tape & Reel
3,000 /
Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. EIA/JEDEC51.3 board design and EIA/JEDEC51.2 still air test method
(25 mm
2
, 2 oz., 3.8
mm
plating).
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2013
April, 2013
Rev. 10
1
Publication Order Number:
MM5Z2V4T1/D
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