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DF37SB-60DS-04V51

Description
Board to Board & Mezzanine Connectors
CategoryThe connector   
File Size866KB,12 Pages
ManufacturerHirose
Websitehttp://www.hirose-connectors.com/
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DF37SB-60DS-04V51 Overview

Board to Board & Mezzanine Connectors

DF37SB-60DS-04V51 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerHirose
Product CategoryBoard to Board & Mezzanine Connectors
RoHSDetails
Factory Pack Quantity8000
0.4mm Pitch, 0.98/1.5mm Mated Height, Board-to-Board / Board-to-FPC Connectors
DF37 Series
■Further
reduction of the board space.
●Comparison
of board mounting space
30 positions, 0.4 mm pitch, 0.98 mm height
Mar.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
DF37
8.22mm
2.98mm
4.56mm
Fig.1
0.98
DF30
■Features
1. Reduced size and board-occupied area
With the mated height of 0.98/1.5mm, width of
2.98mm and length of 8.22mm (30 positions) the
connectors are one of the smallest in its class. Also
2.6mm depth short-lead type is available. (Fig.1)
Sufficiently large flat areas allow pick-up with
vacuum nozzles of automatic placement
equipment.
Header
2. Reliable electrical and mechanical
connection
Despite its small mated height, unique contact
configuration, with a 2-point contacts and effective
mating length of 0.25mm, assures highly reliable
connection while confirming a complete mating with
a definite tactile feel.
Receptacle
Lock
Fig.2
●Splatter
protection
Contact areas
3. Self alignment
Recognizing the difficulties of mating extremely small
connectors in limited spaces, the connectors will self-
align within 0.3mm.
4. Physical shock and vibration protection
2-point contact assures electrical connection in a
shock or vibration applications. (Fig.2)
Contact areas are not exposed to the outside
penetration of the flux or other physical particles.
5. Solder wicking prevention
Nickel barriers (receptacles) and unique forming of the
contacts (headers) prevent un-intentional solder
wicking.
Contact areas
6. Contamination protection
Insulator walls protect the contact areas against flux
splatter or other physical particles contamination. (Fig.3)
Fig.3
2016.8④
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