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PIC32MZ1025DAG169-I-HF

Description
32-bit Microcontrollers - MCU 32-bit cache-based MCU, Graphics Integrated, stacked DDR2
Categorysemiconductor    The embedded processor and controller   
File Size6MB,809 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
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PIC32MZ1025DAG169-I-HF Overview

32-bit Microcontrollers - MCU 32-bit cache-based MCU, Graphics Integrated, stacked DDR2

PIC32MZ1025DAG169-I-HF Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerMicrochip
Product Category32-bit Microcontrollers - MCU
RoHSDetails
PackagingBulk
Factory Pack Quantity176
PIC32MZ Graphics (DA) Family
32-bit Graphics Applications MCUs (up to 2 MB Live Update Flash,
640 KB SRAM, and 32 MB DDR2 SDRAM) with XLP Technology
Operating Conditions
• 2.2V to 3.6V, -40ºC to +85ºC, DC to 200 MHz
• 2.2V to 3.6V, -40ºC to +105ºC (Planned)
Core: 200 MHz / 330 DMIPS MIPS32
®
microAptiv™
32 KB I-Cache, 32 KB D-Cache
MMU for optimum embedded OS execution
microMIPS™ mode for up to 35% smaller code size
DSP-enhanced core:
- Four 64-bit accumulators
- Single-cycle MAC, saturating and fractional math
• Code-efficient (C and Assembly) architecture
Advanced Analog Features
• 12-bit ADC modules:
- 18 Msps with up to six ADC circuits (five dedicated and one
shared)
- Up to 45 analog input
- Can operate during Sleep and Idle modes
- Multiple trigger sources
- Six Digital Comparators and six Digital Filters
• Two Comparators with 32 programmable voltage references
• Temperature sensor with ±2ºC accuracy
• Charge Time Measurement Unit (CTMU)
Clock Management
Programmable PLLs and oscillator clock sources
Dedicated PLL for DDR2
Fail-Safe Clock Monitor
Independent Watchdog and Deadman Timers
Fast wake-up and start-up
Communication Interfaces
• Two CAN modules (with dedicated DMA channels):
- 2.0B Active with DeviceNet™ addressing support
• Six UART modules (25 Mbps):
- Supports LIN 1.2 and IrDA
®
protocols
• Six 4-wire SPI modules (up to 50 MHz)
• SQI configurable as additional SPI module (up to 80 MHz)
• Five I
2
C modules (up to 1 Mbaud) with SMBus support
• Parallel Master Port (PMP)
• Peripheral Pin Select (PPS) to enable function remap
Power Management
• Various power management options for extreme power
reduction (V
BAT
, Deep Sleep, Sleep and Idle)
• Deep Sleep current: < 1 µA (typical)
• Integrated POR and BOR
• Programmable High/Low-Voltage Detect (HLVD) on V
DDIO
and High-Voltage Detect (HVD) on V
DDR1V8
Timers/Output Compare/Input Capture
Nine 16-bit and up to four 32-bit timers/counters
Nine Output Compare (OC) modules
Nine Input Capture (IC) modules
Real-Time Clock and Calendar (RTCC) module
5V-tolerant pins with up to 32 mA source/sink
Selectable open drain, pull-ups, and pull-downs
Selectable slew rate control
External interrupts on all I/O pins
PPS to enable function remap
Memory Interfaces
DDR2 SDRAM interface (up to DDR2-400)
SD/SDIO/eMMC bus interface (up to 50 MHz)
Serial Quad Interface (up to 80 MHz)
External Bus Interface (up to 50 MHz)
Input/Output
Graphics Features
• 3-layer Graphics Controller with up to 24-bit color support
• High-performance 2D Graphics Processing Unit (GPU)
Audio Interfaces
• Audio data communication: I
2
S, LJ, and RJ
• Audio control interfaces: SPI and I
2
C
• Audio master clock: Fractional clock frequencies with USB
synchronization
Qualification and Class B Support
• AEC-Q100 REVG (Grade 2 -40ºC to +105ºC) (Planned)
• Class B Safety Library, IEC 60730
• Back-up internal oscillator
High-Speed Communication Interfaces (with
Dedicated DMA)
• USB 2.0-compliant High-Speed On-The-Go (OTG) controller
• 10/100 Mbps Ethernet MAC with MII and RMII interface
Debugger Development Support
In-circuit and in-application programming
4-wire MIPS
®
Enhanced JTAG interface
Unlimited software and 12 complex breakpoints
IEEE 1149.2-compatible (JTAG) boundary scan
Non-intrusive hardware-based instruction trace
C/C++ compiler with native DSP/fractional support
MPLAB
®
Harmony Integrated Software Framework
TCP/IP, USB, Graphics, and mTouch™ middleware
MFi, Android™, and Bluetooth
®
audio frameworks
Security Features
• Crypto Engine with a RNG for data encryption/decryption and
authentication (AES, 3DES, SHA, MD5, and HMAC)
• Advanced memory protection:
- Peripheral and memory region access control
Integrated Software Libraries and Tools
Direct Memory Access (DMA)
• Eight channels with automatic data size detection
• Programmable Cyclic Redundancy Check (CRC)
• RTOS Kernels: Express Logic ThreadX, FreeRTOS™,
OPENRTOS
®
, Micriµm
®
µC/OS™, and SEGGER embOS
®
Packages
Type
Pin Count
I/O Pins (up to)
Contact/Lead Pitch
Dimensions
169
120
0.8 mm
11x11 mm
LFBGA
288
120
0.8 mm
15x15 mm
LQFP
176
120
0.4 mm
20x20 mm
2015-2017 Microchip Technology Inc.
DS60001361E-page 1
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