REVISIONS
LTR
A
B
DESCRIPTION
Drawing updated to reflect current requirements. Editorial changes throughout. –
drw
Corrected paragraph 1.2.1. Editorial changes throughout. – drw
DATE (YR-MO-DA)
00-12-13
APPROVED
Raymond Monnin
02-12-11
Raymond Monnin
The original first page of this drawing has been replaced.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Marcia B. Kelleher
B
1
B
2
B
3
B
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B
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B
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B
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STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Wm. J. Johnson
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
88-12-08
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
MICROCIRCUIT, LINEAR, 16-CHANNEL JFET
ANALOG MULTIPLEXER, MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
B
SIZE
A
SHEET
CAGE CODE
67268
1 OF
12
5962-87717
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E119-03
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87717
01
X
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type. The device type identify the circuit function as follows:
Device type
01
02
Generic number
MUX-16A
MUX-16B
Circuit function
16-channel JFET analog multiplexer
(overvoltage protected)
16-channel JFET analog multiplexer
(overvoltage protected)
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
X
3
Descriptive designator
GDIP1-T28 or CDIP2-T28
CQCC1-N28
Terminals
28
28
Package style
Dual-in-line
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Positive supply voltage (V
CC
).......................................................
Negative supply voltage (V
EE
) .....................................................
Logic input voltage ......................................................................
Analog input voltage....................................................................
Maximum current through any pin ..............................................
Storage temperature range.........................................................
Power dissipation (P
D
) 1/ ..........................................................
Lead temperature (soldering, 60 seconds).................................
Junction temperature (T
J
) ...........................................................
Thermal resistance, junction-to-case (θ
JC
) .................................
Thermal resistance, junction-to-case (θ
JA
):
Case X.....................................................................................
Case 2 .....................................................................................
1.4 Recommended operating conditions.
Positive supply voltage (V
CC
).......................................................
Negative supply voltage (V
EE
) .....................................................
Ambient operating temperature range (T
A
) ................................
Digital “1” input voltage (V
IH
) .......................................................
Digital “0” input voltage (V
IL
)........................................................
Analog voltage range (V
A
)...........................................................
+15 V dc
-15 V dc
-55°C to +125°C
2.0 V min
0.8 V max
±10
V max
+18 V dc
-18 V dc
(-4 V or V
EE
) to V
CC
V
EE
- 20 V to V
CC
+ 20 V
25 mA
-65°C to +150°C
1.2 mW
300°C
150°C
See MIL-STD-1835
55°C/W
108°C/W
1/
Derate above +75°C, 16 mW/°C.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87717
SHEET
B
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the
issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN
class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535
may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval
in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is
required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.
3.2.5 Switching time waveforms. The switching time waveforms shall be as specified on figure 7.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87717
SHEET
B
3
TABLE I. Electrical performance characteristics.
Conditions
-55°C
≤
T
A
≤
+125°C
V
CC
= +15 V, V
EE
= -15 V
unless otherwise specified
Positive supply current
I
CC
1
2, 3
Negative supply current
I
EE
1
2, 3
“ON” resistance
R
ON
-10 V
≤
V
SOURCE
≤
+10 V,
I
SOURCE
≤
200
µA
1
2,3
1
2, 3
“ON” resistance change with
change in source voltage
∆
R
ON
/
∆
V
SOURCE
R
ON
MATCH
-10 V
≤
V
SOURCE
≤
+10 V,
I
SOURCE
= 200
µA
1/
V
SOURCE
= 0 V,
I
SOURCE
= 200
µA
1/, 2/
1, 2
3
1, 2
3
1, 2
3
Digital input current
I
IN
V
IN
= 0.4 V to 15 V
1
2, 3
Digital “0” enable current
I
IN(EN)
V
IN(EN)
= 0.4 V
1
2, 3
See footnotes at end of table.
All
All
02
01
All
02
01
All
-7.0
-8.2
380
500
580
800
5
7
15
18
20
23
±10
±20
±10
±20
µA
µA
%
%
Ω
All
Test
Symbol
Group A
subgroups
Device
type
Limits
Min
Max
19
24
Unit
mA
mA
R
ON
MATCH
between switches
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87717
SHEET
B
4
TABLE I. Electrical performance characteristics - continued.
Conditions
-55°C
≤
T
A
≤
+125°C
V
CC
= +15 V, V
EE
= -15 V
unless otherwise specified
Source current
(Switch “OFF”)
I
SOURCE
(OFF)
V
SOURCE
= 10 V
V
DRAIN
= -10 V
3/
V
IL
= 0.8 V
V
IL
= 0.7 V
V
IL
= 0.8V
V
IL
= 0.7 V
Drain current
(Switch “OFF”)
I
DRAIN
(OFF)
V
SOURCE
= 10 V
V
DRAIN
= -10 V
3/
V
IL
= 0.8V
V
IL
= 0.7 V
V
IL
= 0.8 V
V
IL
= 0.7 V
Leakage current
(Switch “ON”)
I
DRAIN
(ON)+
I
SOURCE
(ON)
V
IH
= 2 V,
V
SOURCE
= V
DRAIN
= +10 V
3/
1, 3
2
1, 3
2
1, 3
2
1, 3
2
1, 3
2
1, 3
2
Analog voltage range
Digital “0” input voltage
V
A
V
IL
1/
1/
1, 2, 3
1, 3
2
Digital “1” input voltage
Functional tests 4/
Switching time
t
PHL
, t
PLH
V
IH
1/
See 4.3.1c
V
S1
= +10 V, V
S16
= -10 V,
R
L
= 10 MΩ, C
L
= 10 pF
See figures 4 and 7
1, 2, 3
1, 2, 3
9
10, 11 1/
All
All
All
2.0
3.5
µs
2.0
All
All
±10
0.8
0.7
V
02
01
02
01
02
01
Test
Symbol
Group A
subgroups
Device
type
Limits
Min
Max
±1
±25
±2
±50
±1
±75
±2
±250
±1
±75
±2
±250
Unit
nA
nA
nA
V
V
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87717
SHEET
B
5
Embedded System
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