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5962-8854403XX

Description
Standard SRAM, 256KX1, 55ns, CMOS, CQCC28, CERAMIC, LCC-28
Categorystorage    storage   
File Size144KB,11 Pages
ManufacturerWhite Microelectronics
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5962-8854403XX Overview

Standard SRAM, 256KX1, 55ns, CMOS, CQCC28, CERAMIC, LCC-28

5962-8854403XX Parametric

Parameter NameAttribute value
MakerWhite Microelectronics
package instructionCERAMIC, LCC-28
Reach Compliance Codeunknown
Maximum access time55 ns
Other featuresTTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY
JESD-30 codeR-CQCC-N28
JESD-609 codee4
length13.97 mm
memory density262144 bit
Memory IC TypeSTANDARD SRAM
memory width1
Number of functions1
Number of terminals28
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize256KX1
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height3.048 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfacePALLADIUM GOLD
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
width8.89 mm
Base Number Matches1
SRAM
Austin Semiconductor, Inc.
256K x 1 SRAM
SRAM MEMORY ARRAY
AVAILABLE AS MILITARY
SPECIFICATIONS
• SMD 5962-88725
• SMD 5962-88544
• MIL-STD-883
MT5C2561
PIN ASSIGNMENT
(Top View)
24-Pin DIP (C)
(300 MIL)
A6
A7
A8
A9
A10
A11
A14
A15
A0
Q
WE\
Vss
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
Vcc
A5
A4
A3
A2
A1
A17
A16
A13
A12
D
CE\
FEATURES
High Speed: 35, 45, 55, and 70
Battery Backup: 2V data retention
Low power standby
High-performance, low-power, CMOS double-metal
process
• Single +5V (+10%) Power Supply
• Easy memory expansion with CE\
• All inputs and outputs are TTL compatible
28-Pin LCC (EC)
• Timing
35ns access
45ns access
55ns access
70ns access
• Package(s)
Ceramic DIP (300 mil)
Ceramic LCC
A8
A7
A6
Vcc
A17
3 2 1 28 27
26
25
24
23
22
21
20
19
18
13 14 15 16 17
A12
D
CE\
Vss
WE\
OPTIONS
MARKING
-35
-45
-55*
-70*
NC 4
A9 5
A10 6
A11 7
A14 8
A15 9
A0 10
Q 11
NC 12
NC
A4
A3
A2
A1
A17
A16
A13
NC
C
EC
No. 106
No. 204
• Operating Temperature Ranges
Industrial (-40
o
C to +85
o
C)
IT
o
o
Military (-55 C to +125 C)
XT
• 2V data retention/low power
L
GENERAL DESCRIPTION
The Austin Semiconductor SRAM family employs
high-speed, low-power CMOS and are fabricated using double-
layer metal, double-layer polysilicon technology.
For flexibility in high-speed memory applications,
Austin Semiconductor offers chip enable (CE\) on all organiza-
tions. This enhancement can place the outputs in High-Z for
additional flexibility in system design. The x1 configuration
features separate data input and output.
Writing to these devices is accomplished when write
enable (WE\) and CE\ inputs are both LOW. Reading is accom-
plished when WE\ remains HIGH and CE\ goes LOW. The
device offers a reduced power standby mode when disabled.
This allows system designs to achieve low standby power re-
quirements.
These devices operate from a single +5V power sup-
ply and all inputs and outputs are fully TTL compatible.
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
*Electrical characteristics identical to those provided for the 45ns
access devices.
For more products and information
please visit our web site at
www.austinsemiconductor.com
MT5C2561
Rev. 2.5 1/01
1

5962-8854403XX Related Products

5962-8854403XX 5962-8854403LX 5962-8854402XX 5962-8854402LX
Description Standard SRAM, 256KX1, 55ns, CMOS, CQCC28, CERAMIC, LCC-28 Standard SRAM, 256KX1, 55ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Standard SRAM, 256KX1, 45ns, CMOS, CQCC28, CERAMIC, LCC-28 Standard SRAM, 256KX1, 45ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24
package instruction CERAMIC, LCC-28 0.300 INCH, CERAMIC, DIP-24 CERAMIC, LCC-28 0.300 INCH, CERAMIC, DIP-24
Reach Compliance Code unknown unknown unknown unknown
Maximum access time 55 ns 55 ns 45 ns 45 ns
Other features TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY
JESD-30 code R-CQCC-N28 R-CDIP-T24 R-CQCC-N28 R-CDIP-T24
memory density 262144 bit 262144 bit 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 1 1 1 1
Number of functions 1 1 1 1
Number of terminals 28 24 28 24
word count 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
organize 256KX1 256KX1 256KX1 256KX1
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCN DIP QCCN DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Filter level MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883
Maximum seat height 3.048 mm 5.08 mm 3.048 mm 5.08 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES NO YES NO
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal surface PALLADIUM GOLD PALLADIUM GOLD PALLADIUM GOLD PALLADIUM GOLD
Terminal form NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location QUAD DUAL QUAD DUAL
width 8.89 mm 7.62 mm 8.89 mm 7.62 mm
Base Number Matches 1 1 1 1

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