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PEB2035-P

Description
ICs for Communications (Advanced CMOS Frame Aligner)
CategoryWireless rf/communication    Telecom circuit   
File Size526KB,134 Pages
ManufacturerSIEMENS
Websitehttp://www.infineon.com/
Download Datasheet Parametric Compare View All

PEB2035-P Overview

ICs for Communications (Advanced CMOS Frame Aligner)

PEB2035-P Parametric

Parameter NameAttribute value
Parts packaging codeDIP
package instruction,
Contacts40
Reach Compliance Codeunknow
JESD-30 codeR-PDIP-T40
Number of functions1
Number of terminals40
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Telecom integrated circuit typesFRAMER
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal locationDUAL
Base Number Matches1
ICs for Communications
Advanced CMOS Frame Aligner
ACFA
PEB 2035
Data Sheet 01.94

PEB2035-P Related Products

PEB2035-P PEB2035-N PEB2035
Description ICs for Communications (Advanced CMOS Frame Aligner) ICs for Communications (Advanced CMOS Frame Aligner) ICs for Communications (Advanced CMOS Frame Aligner)
Parts packaging code DIP LCC -
Contacts 40 44 -
Reach Compliance Code unknow unknow -
JESD-30 code R-PDIP-T40 S-PQCC-J44 -
Number of functions 1 1 -
Number of terminals 40 44 -
Maximum operating temperature 70 °C 70 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY -
Package shape RECTANGULAR SQUARE -
Package form IN-LINE CHIP CARRIER -
Certification status Not Qualified Not Qualified -
Nominal supply voltage 5 V 5 V -
surface mount NO YES -
technology CMOS CMOS -
Telecom integrated circuit types FRAMER FRAMER -
Temperature level COMMERCIAL COMMERCIAL -
Terminal form THROUGH-HOLE J BEND -
Terminal location DUAL QUAD -
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