ATLV
Features
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Specifically Designed for Battery Powered Applications
1.0 - 3.0 Volts and will Operate from 0.7 to 5.5 Volts
Static Current Drain of <75 nA at 1.0 Volts
200 MHz Maximum Toggle Frequency for Flip Flop at 1.5 Volts
1.0
µ
Drawn Gate Length CMOS Gate Arrays
All Package Styles Offered Including TQFP and TAB
Improved Product Testability Using Serial Scan, Boundary Scan,
and JTAG
Second Source Existing ASIC Design in Atmel's ATLV via Design
Translation. Improved Performance and Lower Cost
Description
The ATLV Series CMOS gate arrays employ 1.0
µ-drawn,
double-level metal,
Si-gate, CMOS technology processed in Atmel's U.S.-based, advanced
manufacturing facility. The arrays utilize an enhanced channelless architecture
which results in greater than 50 percent usable gates.
Atmel's flexible design system uses industry design standards and is compatible
with popular CAD/CAE software and hardware packages. The customer can
start designing with the ATLV series today using existing CAD/CAE tools.
ATLV Series
Ultra Low
Voltage
Gate Arrays
ATLV2
ATLV3
ATLV5
ATLV7
ATLV10
ATLV15
ATLV20
ATLV35
ATLV Array Organization
Device
Number
ATLV2
ATLV3
ATLV5
ATLV7
ATLV10
ATLV15
ATLV20
ATLV35
Raw
Gates
2,000
3,000
5,000
7,000
10,000
15,000
22,000
35,000
Routable
Gates
1,400
1,600
2,800
4,400
6,600
8,000
12,000
18,000
Max Pin
Count
44
68
84
100
120
144
160
208
Max I/O
(1)
Pins
36
60
76
92
112
136
152
192
Gate
(2)
Speed
1.3 ns
1.3 ns
1.3 ns
1.3 ns
1.3 ns
1.3 ns
1.3 ns
1.3 ns
Notes: 1. Absolute maximum I/O pins is maximum pin count minus 8. Additional power
and ground pins are assumed to be required to support simultaneous
switching outputs as pin count increases.
2. Nominal 2 input nand gate with a fan out of 2 at 1.5 volts, room temperature.
0261B
1
ATLV Design
Design Systems Supported
Atmel supports the major CAE/CAD software systems
with complete macro cell libraries (symbols, timing and
function), as well as utilities for checking the netlist and
accurate pre-route delay simulations. Atmel uses Cadence’s
Verilog-XL as our golden simulator. Design systems
which are supported include Cadence, Viewlogic, Mentor,
and Synopsys.
Design Options
Schematic Capture
Schematic capture and simulation are performed by the
customer using an Atmel supplied macro cell library. The
customer can also receive complete back annotation delay
data for post-route simulation.
VHDL/Verilog-HDL
Atmel can accept Register Transfer level (RTL) designs for
VHDL (MIL-STD-454, IEEE STD 1076) or Verilog-HDL
format. Atmel fully supports Synopsys for VHDL simula-
tion as well as synthesis. Design via VHDL or Verilog-
HDL is the preferred method of performing a gate array
design.
Design Flow
While Atmel provides four options for implementing a gate
array design, they all have the same basic flow. Data base
acceptance is the first milestone. This is when Atmel
receives and accepts the complete design data base.
Preliminary design review is where the performance of the
design is set based on the Cadence simulation. Final design
review is the last review of the design before making masks.
The back annotation data is incorporated into the simulations.
After final design review masks are released and prototypes
in ceramic packages are delivered.
ASIC Design Translation
Atmel has successfully translated dozens of existing de-
signs from most major ASIC vendors (LSI Logic, Oki,
NEC, Fujitsu and others) into our gate arrays. These
designs have been optimized for speed, gate count, modi-
fied to add logic or memory, or replicated for a pin-for-pin
compatible, drop-in replacement.
ATLV Gate Array Design Flow
Customer
Atmel Cell
Library
Gate Array
Design
Translation
Design
Synthesis FPGA/EPLD
Conversions
-VHDL
-Verilog-HDL
Atmel
Data Base Acceptance
Atmel
Simulation
and Verification
Atmel
Customer
Preliminary Design Review
Atmel
Physical Design, Simulation
and Verification
Atmel
Customer
Final Design Review
Atmel
Customer
Prototype Delivery
Atmel
2
ATLV
ATLV
FPGA and EPLD Conversions
Atmel has successfully translated existing FPGA/EPLD
designs from most major vendors (Xilinx, Actel, Altera,
AMD & Atmel) into our gate arrays. The design can be
optimized for speed or power consumption, modified to
add logic or memory or replicated for a pin-for-pin compat-
ible, drop-in replacement. Atmel frequently combines
several devices onto a single gate array.
at the transistor level and verified through measurements
made on fabricated test arrays. The symbols for the ATLV
cell library are compatible with Atmel's ATL (1.0
µ
3.3
and 5.0 V) and ATL80 (0.8
µ
3.3 and 5.0 V) cell libraries.
Existing designs can be easily migrated to the ATLV
series. Characterization has been performed over
commercial temperature and 1.0 to 3.0 volts, to ensure
that the simulation accurately predicts the performance
of the finished product. Atmel is continually expanding
the ATLV series cell library with both soft and hard
macros. Check with your sales representative for the most
recent additions.
ATLV Series Cell Library
Atmel’s ATLV series gate arrays use cells from an
accurately modeled and highly flexible library. The cell
library contains over 120 hard-wired data path elements
and has been characterized via extensive SPICE modeling
Cell Guide
Buffers and Inverters
1x Buffer
2x Buffer
2x Buffer with Enable
2x Buffer with Enable Low
3x Buffer
4x Buffer
8x Buffer
12x Buffer
16x Buffer
Delay Buffer 2.0 ns
Delay Buffer 3.5 ns
Delay Buffer 8.0 ns
AND, NAND, OR, NOR Gates
2 input AND
3 input AND
4 input AND
5 input AND
2 input NAND
Dual 2-input NAND
3 input NAND
4 input NAND
5 input NAND
6 input NAND
8 input NAND
Multiplexers
2:1 MUX
Inverting 2:1 MUX w/o Buffered Inputs
Inverting 2:1 MUX w/o Buffered Inputs
2:1 MUX with Enable Low
Quad 2:1 MUX with Enable
Quad 2:1 MUX
Inverting 3:1 MUX w/o Buffered Inputs
Inverting 3:1 MUX w/o Buffered Inputs
4:1 MUX
4:1 MUX w/o Buffered Inputs
4:1 MUX w/o Buffered Inputs
8:1 MUX
8:1 MUX with Enable Low
2 input NOR
Dual 2 input NOR
3 input NOR
4 input NOR
5 input NOR
8 input NOR
2 input OR
3 input OR
4 input OR
1x Inverter
Dual 1x Inverter
Quad 1x Inverter
Quad Tri-state Inverter
2x Inverter
Dual 2x Inverter
2x Tri-state Inverter
3x Inverter
4x Inverter
8x Inverter
10x Inverter
3
Cell Guide
AND/OR, OR/AND Gates
3 input AND OR INVERT
4 input AND OR INVERT
6 input AND OR INVERT
Exclusive OR/NOR Gates
1 bit Adder
1 bit Adder with Buffered Outputs
7 input Carry Lookahead
Decoders
2:4 Decoder
2:4 Decoder with Low Enable
Flip-flops/Latches
D Flip-flop
D Flip-flop with Clear/Preset
D Flip-flop with Clear
D Flip-flop with Reset
D Flip-flop with Set
D Flip-flop with Set/Reset
JK Flip-flop
JK Flip-flop with Clear/Preset
JK Flip-flop with Clear
Scan Cells
Set-scan Register
Set-scan Register with Clear and Preset
Set-scan Register with Reset
I/O Options
Input, Output, Bidirectional, Tristate Output, Internal Clock Driver and Oscillator
Output Drive Value Programmable from 0.5 mA to 6 mA in 0.5 mA increments with Slew Rate Control
CMOS Operation
Testable NAND Gate on Input (Bidirectional, Input)
Inverting and Non-inverting Input Buffers (Bidirectional, Input)
Pullup Resistor - 10K
Ω
to 310K
Ω
Pulldown Resistor - 3.5K
Ω
to 108.5K
Ω
Set-scan Register with Set
Set-scan Register with Set and Reset
LATCH
LATCH with Complementary Outputs
LATCH with Inverted Gate Signal
QUAD LATBG with Common Gate Signal
QUAD Inverting LATCH
LATCH with Reset
LATCH with Set
LATCH with Set and Reset
3:8 Decoder with Low Enable
2 input Exclusive OR
2 input Exclusive NOR
3 input OR AND INVERT
4 input OR AND INVERT
8 input OR AND INVERT
4
ATLV
ATLV
CMOS Input Interface Characteristics
Interface
CMOS
Logic High
0.90 V
DD
Logic Low
0.1 V
DD
Switchpoint
V
DD
/2 Typical
Absolute Maximum Ratings*
Operating Temperature .......................-40°C to +85°C
Storage Temperature ........................-65°C to +150°C
Voltage on Any Pin
with Respect to Ground ....................-2.0 V to +5.5 V
1
Maximum Operating Voltage ...............................5.5 V
*NOTICE: Stresses beyond those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other
conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Notes:
1. Minimum voltage is -0.6 V dc which may undershoot to -2.0 V
for pulses of less than 20 ns. Maximum output pin voltage is
V
DD
+ 0.75V dc which may overshoot to +7.0 V for pulses of less
than 20 ns.
1.5 Volt DC Characteristics
Applicable over recommended operating range from T
a
= -40°C to +85°C, V
DD
= 1.0 V to 3.0 V (unless otherwise noted)
Symbol
I
IH
I
IL
Parameter
Input Leakage High
Input Leakage Low
(no pull-up)
Output Leakage (no pull-up)
Output Short Circuit Current
(3 x Buffer)
(2)
CMOS Input Low Voltage
CMOS Input High Voltage
CMOS Switching Threshold
Output Low Voltage
Output buffer has
12 stages of drive capability
with 0.5 mA I
OL
per stage.
Output High Voltage
Output buffer has
12 stages of drive capability
with -0.5 mA I
OH
per stage.
Static Current
Input Leakage Low
(no pull-up)
V
DD
=1.5 V, 25°C
I
OL
=as rated
V
DD
=1.5 V
0.8 x V
DD
0.75
0.2 x V
DD
Test Condition
V
IN
=V
DD
, V
DD
=1.8 V
V
IN
=V
SS
, V
DD
=1.8 V
-10
Min
Typ
1 x 10
-5
-1 x 10
-5
Max
10
Units
µA
µA
µA
mA
mA
V
V
V
V
I
OZ
I
OS
V
IL
V
IH
V
T
V
OL
V
IN
=V
DD
or V
SS
, V
DD
=3.6 V
V
DD
=1.8 V, V
OUT
=V
DD
V
DD
=1.8 V, V
OUT
=V
SS
-10
5
-60
1 x 10
-5
25
-25
10
60
-5
0.2 x V
DD
V
OH
I
OH
=as rated
V
DD
=1.5 V
0.8 x V
DD
V
I
DD
1.0 V
3.0 V
< 75
< 1.0
nA
µA
Note:
2. This is the specification for the 3 x Output Buffer. Output short circuit current for other outputs will scale accordingly. Not more
than one output shorted at a time, for a maximum of one second, is allowed.
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