5962-9561308HUC datasheet, PDF

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5962-9561308HUC: DescriptionStandard SRAM, 512KX8, 25ns, CMOS, CDFP36,; Categorystorage storage; File Size548KB，47 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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5962-9561308HUC Overview

Standard SRAM, 512KX8, 25ns, CMOS, CDFP36,

5962-9561308HUC Parametric

Parameter Name	Attribute value
Maker	White Electronic Designs Corporation
package instruction	DFP, FL36,.5
Reach Compliance Code	unknown
Maximum access time	25 ns
I/O type	COMMON
JESD-30 code	R-XDFP-F36
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of terminals	36
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL36,.5
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum standby current	0.007 A
Minimum standby current	2 V
Maximum slew rate	0.16 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Added device types 05 through 10. Added case outlines X, Z, and T.

Redrew entire document.

Added device types 11 through 13. Added case outline U.

Made changes in accordance with NOR 5962-R289-97. -sld

Table I; Changed the max limit for the operating supply current test

for device types 05-10 from 130 mA to 135 mA. Table I; Changed

the max limit for data retention current (I

CCDR1

) for device types 05-10

from 3.0 mA to 7.0 mA. Add vendor cage 88379 for device types 11,

12, and 13 per letter dated 1 MAY 1997. -sld

Add device type 14.

Changes to case outlines U and X.

Add: note to paragraph 1.2.2 and table I, conditions. Add device types

15 through 27, case outlines M, N, and 9, vendor CAGE code 0EU86,

condition D to paragraphs 4.2.a.1 and 4.3.3.b.1. Changes to table I

and dimensions to case outlines T, U, Y, and Z. Table I, add note 3 to

and C

OUT

Table I; Changed the I

from 8 mA to 6 mA for device types 07-14

and 21-27 for the V

test. Added device types 28, 29, and 30.

Editorial changes throughout. -sld

Add new case outline 7. gc

Updated drawing paragraphs. -sld

DATE (YR-MO-DA)

96-08-23

96-10-22

97-04-28

98-02-18

APPROVED

K. A. Cottongim

98-06-22

99-04-30

01-02-08

K. A. Cottongim

Raymond Monnin

04-05-28

Raymond Monnin

08-08-04

12-04-02

Robert M. Heber

Charles F. Saffle

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Steve L. Duncan

CHECKED BY

Michael C. Jones

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

http://www.landandmaritime.dla.mil/

APPROVED BY

Kendall A. Cottongim

MICROCIRCUIT, MEMORY, DIGITAL, SRAM,

512K x 8-BIT, MONOLITHIC SILICON

DRAWING APPROVAL DATE

95-11-07

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-95613

DSCC FORM 2233

APR 97

5962-E296-12

3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4 and 5.

3.2.5 Block diagram. The block diagram shall be as specified on figure 6.

3.2.6 Output load circuit. The output load circuit used to test product shall be equivalent to the circuit specified on figure 7.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full specified operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

3.6 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with

the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.

3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described

herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,

for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those

which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be

made available to the preparing activity (DLA Land and Maritime -VA) upon request.

3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this

drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the

manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.

3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of

microcircuits delivered to this drawing.

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as

modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,

fit, or function as described herein.

4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:

Burn-in test, method 1015 of MIL-STD-883.

(1)

Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request.

Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance

with the intent specified in method 1015 of MIL-STD-883.

as specified in accordance with table 1 of method 1015 of MIL-STD-883.

(2)

Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter

tests prior to burn-in are optional at the discretion of the manufacturer.

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

SIZE

REVISION LEVEL

5962-95613

SHEET

DSCC FORM 2234

APR 97

5962-9561308HUC Related Products

	5962-9561308HUC	5962-9561311HYC	5962-9561306HUC	5962-9561307HUC	5962-9561313HYC	5962-9561305HUC	5962-9561309HUC	5962-9561310HUC	5962-9561312HYC
Description	Standard SRAM, 512KX8, 25ns, CMOS, CDFP36,	Standard SRAM, 512KX8, 45ns, CMOS, CDIP32,	Standard SRAM, 512KX8, 45ns, CMOS, CDFP36,	Standard SRAM, 512KX8, 35ns, CMOS, CDFP36,	Standard SRAM, 512KX8, 25ns, CMOS, CDIP32,	Standard SRAM, 512KX8, 55ns, CMOS, CDFP36,	Standard SRAM, 512KX8, 20ns, CMOS, CDFP36,	Standard SRAM, 512KX8, 17ns, CMOS, CDFP36,	Standard SRAM, 512KX8, 35ns, CMOS, CDIP32,
package instruction	DFP, FL36,.5	DIP, DIP32,.6	DFP, FL36,.5	DFP, FL36,.5	DIP, DIP32,.6	DFP, FL36,.5	DFP, FL36,.5	DFP, FL36,.5	DIP, DIP32,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	25 ns	45 ns	45 ns	35 ns	25 ns	55 ns	20 ns	17 ns	35 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDFP-F36	R-XDIP-T32	R-XDFP-F36	R-XDFP-F36	R-XDIP-T32	R-XDFP-F36	R-XDFP-F36	R-XDFP-F36	R-XDIP-T32
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8	8	8
Number of terminals	36	32	36	36	32	36	36	36	32
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	DIP	DFP	DFP	DIP	DFP	DFP	DFP	DIP
Encapsulate equivalent code	FL36,.5	DIP32,.6	FL36,.5	FL36,.5	DIP32,.6	FL36,.5	FL36,.5	FL36,.5	DIP32,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	IN-LINE	FLATPACK	FLATPACK	IN-LINE	FLATPACK	FLATPACK	FLATPACK	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum standby current	0.007 A	0.01 A	0.007 A	0.007 A	0.01 A	0.007 A	0.007 A	0.007 A	0.01 A
Minimum standby current	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	0.16 mA	0.2 mA	0.16 mA	0.16 mA	0.2 mA	0.16 mA	0.16 mA	0.16 mA	0.2 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES	NO	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	THROUGH-HOLE	FLAT	FLAT	THROUGH-HOLE	FLAT	FLAT	FLAT	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1	1
Maker	White Electronic Designs Corporation	-	-	-	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation

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