NC7S08L6X datasheet, PDF - EEWORLD Datasheet

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NC7S08L6X: DescriptionLogic Gates TinyLogic HS 2-Input; Categorylogic logic; File Size579KB，13 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/; Environmental Compliance

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NC7S08L6X Overview

Logic Gates TinyLogic HS 2-Input

NC7S08L6X Parametric

Parameter Name	Attribute value
Brand Name	Fairchild Semiconductor
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Fairchild
Parts packaging code	MICROPAK MLP
package instruction	VSON, SOLCC6,.04,20
Contacts	6
Manufacturer packaging code	6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED)
Reach Compliance Code	unknown
ECCN code	EAR99
series	HC/UH
JESD-30 code	R-XDSO-N6
JESD-609 code	e4
length	1.45 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	AND GATE
MaximumI(ol)	0.0013 A
Humidity sensitivity level	1
Number of functions	1
Number of entries	2
Number of terminals	6
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	VSON
Encapsulate equivalent code	SOLCC6,.04,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260
power supply	2/6 V
Prop。Delay @ Nom-Sup	125 ns
propagation delay (tpd)	125 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	0.55 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	1 mm

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Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers

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NC7S08L6X Related Products

	NC7S08L6X
Description	Logic Gates TinyLogic HS 2-Input
Brand Name	Fairchild Semiconductor
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Fairchild
Parts packaging code	MICROPAK MLP
package instruction	VSON, SOLCC6,.04,20
Contacts	6
Manufacturer packaging code	6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED)
Reach Compliance Code	unknown
ECCN code	EAR99
series	HC/UH
JESD-30 code	R-XDSO-N6
JESD-609 code	e4
length	1.45 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	AND GATE
MaximumI(ol)	0.0013 A
Humidity sensitivity level	1
Number of functions	1
Number of entries	2
Number of terminals	6
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	VSON
Encapsulate equivalent code	SOLCC6,.04,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260
power supply	2/6 V
Prop。Delay @ Nom-Sup	125 ns
propagation delay (tpd)	125 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	0.55 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	1 mm

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