P4C164L-12L32CLF datasheet, PDF

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P4C164L-12L32CLF: DescriptionStandard SRAM, 8KX8, 12ns, CMOS, CQCC32, 0.450 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC-32; Categorystorage storage; File Size1MB，16 Pages; ManufacturerPyramid Semiconductor Corporation; Websitehttp://www.pyramidsemiconductor.com/; Environmental Compliance

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P4C164L-12L32CLF Overview

Standard SRAM, 8KX8, 12ns, CMOS, CQCC32, 0.450 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC-32

P4C164L-12L32CLF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	QFJ
package instruction	QCCN,
Contacts	32
Reach Compliance Code	compli
ECCN code	EAR99
Maximum access time	12 ns
JESD-30 code	R-CQCC-N32
length	13.97 mm
memory density	65536 bi
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	32
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum seat height	1.905 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.43 mm
Base Number Matches	1

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P4C164

ULTRA HIGH SPEED 8K X 8

STATIC CMOS RAMS

FEATURES

Full CMOS, 6T Cell

High Speed (Equal Access and Cycle Times)

– 8/10/12/15/20/25/35/70/100 ns (Commercial)

– 10/12/15/20/25/35/70/100 ns(Industrial)

– 12/15/20/25/35/45/70/100 ns (Military)

Low Power Operation

Output Enable and Dual Chip Enable Control

Functions

Single 5V±10% Power Supply

Data Retention with 2.0V Supply, 10 µA Typical

Current (P4C164L Only)

Common Data I/O

Fully TTL Compatible Inputs and Outputs

Standard Pinout (JEDEC Approved)

– 28-Pin 300 mil Plastic DIP, SOJ

– 28-Pin 600 mil Plastic DIP

– 28-Pin 300 mil SOP (70 & 100ns)

– 28-Pin 300 mil Ceramic DIP

– 28-Pin 600 mil Ceramic DIP

– 28-Pin 350 x 550 mil LCC

– 32-Pin 450 x 550 mil LCC

– 28-Pin Glass-sealed CERPACK

– 28-Pin Solder-sealed CERPACK

DESCRIPTIOn

The P4C164 is a 65,536-bit ultra high-speed static RAM

organized as 8K x 8. The CMOS memory requires no

clocks or refreshing and has equal access and cycle times.

Inputs are fully TTL-compatible. The RAM operates from

a single 5V±10% tolerance power supply. With battery

backup (P4C164L Only), data integrity is maintained with

supply voltages down to 2.0V. Current drain is typically 10

µA from a 2.0V supply.

Access times as fast as 8 nanoseconds are available,

permitting greatly enhanced system operating speeds.

The P4C164 is available in 28-pin 300 mil DIP and SOJ,

28-pin 600 mil plastic and ceramic DIP, 28-pin 350 x 550 mil

LCC, 32-pin 450 x 550 mil LCC, and 28-pin glass-sealed

CERPACK and solder-sealed flatpack.

FUnCTIOnAL BLOCK DIAGRAM

PIn COnFIGURATIOnS

DIP (P5, P6, C5, C5-1, D5-1, D5-2),

SOJ (J5), CERPACK (F4), SOLDER-SEAL FLATPACK (FS-5), SOP (S6)

SEE PAGE 8 FOR LCC PIN CONFIGURATIONS

Document #

SRAM115

REV H

Revised April 2011

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