!
W
NE
Features
■
■
■
■
Applications
High Density Circuit Board Applications:
■
Hard disk drives
■
PC motherboards
■
PC peripherals
■
Point-of-sale (POS) equipment
■
PCMCIA cards
■
USB ports
100 % compatible with all previous
generations of 1812 SMT devices
Compatible with Pb and Pb-free solder
reflow profiles
Surface mount packaging for automated
assembly
Agency recognition:
T V Rheinland
MF-MSMF Series -
PTC Resettable Fuses
Electrical Characteristics
Tripped
Power
Dissipation
Ihold
Model
V max.
Volts
I max.
Amps
Itrip
Resistance
Ohms
at 23 °C
RMin.
R1Max.
Max. Time
To Trip
Amperes
at 23 °C
Seconds
at 23 °C
Amperes
at 23 °C
Hold
Trip
Watts
at 23 °C
Typ.
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF125
MF-MSMF150
MF-MSMF160
MF-MSMF200
MF-MSMF250/16
MF-MSMF260
60.0
60.0
30.0
30.0
15.0
13.2
24.0
6.0
16.0
6.0
6.0
8.0
6.0
16.0
6.0
40
40
80
10
100
100
40
100
100
100
100
100
100
100
100
0.10
0.14
0.20
0.30
0.50
0.75
0.75
1.10
1.10
1.25
1.50
1.60
2.00
2.50
2.60
0.30
0.34
0.40
0.60
1.00
1.50
1.50
2.20
2.20
2.50
3.00
2.80
4.00
5.00
5.20
0.70
0.40
0.40
0.30
0.15
0.11
0.11
0.04
0.04
0.035
0.03
0.035
0.020
0.015
0.015
15.00
6.50
6.00
3.00
1.00
0.45
0.45
0.21
0.21
0.14
0.120
0.099
0.100
0.100
0.080
0.5
1.5
6.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
1.50
0.15
0.06
0.10
0.15
0.20
0.20
0.30
0.30
0.40
0.5
2.0
3.0
5.0
5.0
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
Environmental Characteristics
Operating Temperature ......................................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................125 °C
Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change
Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours ..................±5 % typical resistance change
Thermal Shock ....................................................+85 °C to -40 °C, 20 times ........................±10 % typical resistance change
Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change
Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change
Condition A
Test Procedures And Requirements For Model MF-MSMF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description
Resistance ......................................In still air @ 23 °C............................................................Rmin
≤
R
≤
R1max
Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T
≤
max. time to trip (seconds)
Hold Current ..................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning
Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning
Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage
UL File Number ..................................E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
CSA File Number ................................CA110338
http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000
TÜV Certificate Number......................R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Additional Features
■
■
■
Standard 4532 mm (1812 mils) footprint
Symmetrical design
Patents pending
MF-MSMF Series -
PTC Resettable Fuses
Product Dimensions
Model
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF125
MF-MSMF150
MF-MSMF160
MF-MSMF200
MF-MSMF250/16
MF-MSMF260
A
Min.
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
4.37
(0.172)
Max.
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
4.73
(0.186)
Min.
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
3.07
(0.121)
B
Max.
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
3.41
(0.134)
Min.
0.70
(0.028)
0.70
(0.028)
0.70
(0.028)
0.70
(0.028)
0.55
(0.015)
0.55
(0.015)
0.55
(0.015)
0.45
(0.018)
0.45
(0.018)
0.55
(0.015)
0.55
(0.015)
0.55
(0.015)
0.55
(0.015)
1.00
(0.039)
0.48
(0.019)
C
Max.
1.10
(0.043)
1.10
(0.043)
1.10
(0.043)
1.10
(0.043)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.75
(0.030)
0.75
(0.030)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
2.00
(0.078)
0.85
(0.033)
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
UNIT =
MM
(INCHES)
Packaging:
MF-MSMF010 through MF-MSMF030 = 1500 pcs. per reel.
MF-MSMF050 through MF-MSMF200 & MF-MSMF260 = 2000 pcs. per reel.
MF-MSMF250/16 = 1000 pcs. per reel.
Top and Bottom View
A
Side View
C
Recommended Pad Layout
1.5 ± 0.05
(.059 ± .002)
1.5 ± 0.05
(.059 ± .002)
3.2 ± 0.1
(0.126 ± .004)
2.7 ± 0.1
(.106 ± .004)
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Optional Sn finish:
Meets ANSI/J-STD-002 Category 3.
Recommended Storage:
40 °C max./70 % RH max.
B
D
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-MSMF Series -
PTC Resettable Fuses
Typical Time to Trip at 23 ˚C
100
MF-MSMF200
MF-MSMF010
How to Order
MF - MSMF 075/24 T - 2
Multifuse
®
Product
Designator
Series
MSMF = 4532 mm (1812 mils)
Surface Mount Component
Hold Current, Ihold
010-260 (0.10 Amps - 2.60 Amps)
Higher Voltage Option
__ = Standard Voltage
/16 = 16 Volt Rated
/24 = 24 Volt Rated
Optional Terminal Finish
__ = Standard Au Finish
T = Optional Sn Finish
10
Time to Trip (Seconds)
MF-MSMF030
1
0.1
MF-MSMF260
MF-MSMF250/16
MF-MSMF160
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
0.01
MF-MSMF014
MF-MSMF020
MF-MSMF075/24
MF-MSMF050
0.001
0.1
1
MF-MSMF150
MF-MSMF125
MF-MSMF110
MF-MSMF075
MF-MSMF110/16
Typical Part Marking
Represents total content. Layout may vary.
DATE CODE:
WEEK 1 AND 2 OF 2003 = 3A
WEEK 51 AND 52 OF 2003 = 3Z
PART IDENTIFICATION EXAMPLES:
MF-MSMF050 = 50
MF-MSMF075 = 75
MF-MSMF110 = 11
MF-MSMF150 = 15
10
100
The Time to Trip curves represent typical performance of a device in a simulated application
environment. Actual performance in specific customer applications may differ from these values due
to the influence of other variables.
MANUFACTURER'S
TRADEMARK
Solder Reflow Recommendations
Preheating
Soldering
Cooling
300
250
Temperature (°C)
200
150
100
50
0
160–220
10–20
Time (seconds)
120
Notes:
•
MF-MSMF models cannot be wave soldered.
•
If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
• Compatible with Pb and Pb-free solder reflow profiles.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
113G
Fault Current (Amps)
Embedded System
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