= 25°C, AVCC = 15.5 V, DVCC = 3.3 V, VRH = 9.5 V, VRL = 7 V, T
A MIN
= 0°C, T
A MAX
= 75°C still air, unless otherwise noted.
Table 1.
Parameter
VIDEO DC PERFORMANCE
1
VDE—Differential Error Voltage
Conditions
T
A MIN
to T
A MAX
,VFS = 5 V
@ DAC code 0
@ DAC code 1024
@ DAC code 2048
@ DAC code 3072
@ DAC code 4095
DAC code range 0 to 4095
@ DAC code 0
@ DAC code 1024
@ DAC code 2048
@ DAC code 3072
@ DAC code 4095
DAC code range 0 to 4095
@ DAC code 0
@ DAC code 1024
@ DAC code 2048
@ DAC code 3072
@ DAC code 4095
DAC code range 0 to 4095
@ DAC code 0
@ DAC code 1024
@ DAC code 2048
@ DAC code 3072
@ DAC code 4095
DAC code range 0 to 4095
−1
T
A MIN
to T
A MAX
VIDx = 5 V step, C
L
= 150 pF
20% to 80%
Min
Typ
Max
Unit
−5.5
−4.4
−3.6
−2.8
−2.1
−6.0
−2.5
−2.5
−2.5
−2.5
−2.5
−3.5
−0.8
−0.5
−0.3
−0.3
+0.2
+5.0
+3.6
+3.3
+2.8
+2.1
+6.0
+2.5
+2.5
+2.5
+2.5
+2.5
+3.5
4.8
4.3
4.0
3.8
2.8
5.5
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
LSB
VCME—Common-Mode Error Voltage
−0.3
−0.3
−0.3
−0.3
−0.3
ΔVDE—VDE Channel Matching
1.9
1.8
1.6
1.4
1.0
ΔV—Channel Matching
2.7
2.7
2.5
2.5
2.0
7.5
−0.2
35
22
420
15
69
50
0.4
70
34
700
25
150
40
50
28
DNL
2
VIDEO OUTPUT DYNAMIC PERFORMANCE
Data Switching Settling Time to 0.25%
Data Switching Settling Time to 1%
Data Switching Slew Rate
CLK and Data Feedthrough
3
All-Hostile Crosstalk
4
Amplitude
Glitch Duration
DAC Transition Glitch Energy
Invert Switching Settling Time to 0.25%
Invert Switching Settling Time to 1%
Invert Switching Slew Rate
Invert Switching Overshoot
ns
ns
V/μs
mV p-p
mV p-p
ns
nV-s
ns
ns
V/μs
mV
DAC Code 2047 to 2048
VIDx = 10 V step, C
L
= 150 pF
20% to 80%
Rev. 0 | Page 3 of 16
AD8387
Parameter
VIDEO OUTPUT CHARACTERISTICS
Output Voltage Swing
Output Voltage—Grounded Mode
Data Switching Delay: t
7 5
Data Switching Delay Skew: Δt
75
INV Switching Delay: t
8 6
INV Switching Delay Skew: Δt
86
Output Current
Output Resistance
REFERENCE INPUTS
VRL Range
VRH Range
VRH to VRL Range
1
VRH Input Resistance
VRL Input Current
VRH Input Current
RESOLUTION
DIGITAL INPUT CHARACTERISTICS
CLK Frequency
Data Setup Time: t
1
XFR Setup Time: t
3
Data Hold Time: t
2
XFR Hold Time: t
4
CLK High Time: t
5
CLK Low Time: t
6
CLK High Time: t
7
CLK Low Time: t
8
C
IN
I
IH
I
IH
TSW
I
IH
XFR
I
IL
I
IL
TSW
I
IL
XFR
V
IH
V
IL
V
TH
POWER SUPPLIES
DVCC, Operating Range
DVCC, Quiescent Current
AVCC, Operating Range
AVCC, Quiescent Current
OPERATING TEMPERATURE
Ambient Temperature Range, T
A 7
Ambient Temperature Range, T
A7
1
Conditions
AVCC − VOH, VOL − AGND
VIDx = 5 V step
VIDx = 10 V step
Min
Typ
0.9
0.06
15.7
16.2
Max
1.3
0.150
4
4
Unit
V
V
ns
ns
ns
ns
mA
Ω
V
V
V
kΩ
μA
μA
Bits
100
28
VRH ≥ VRL
VRH ≥ VRL
To VRL
5.25
VRL
0
22
−44
111
12
AVCC − 4
VRL + 2.75
2.75
Binary Coding
T
A MIN
to T
A MAX
CLK input duty cycle 40% to 60%
DSW = HIGH
DSW = LOW
110
85
0
0
3.5
3.5
2.5
3.0
3.5
4.0
3
0.05
333
0.05
−0.6
−1.3
−1.2
2
0.8
1.65
3
11
75
3.3
54
3.6
70
18
100
75
85
DSW = HIGH
DSW = HIGH
DSW = LOW
DSW = LOW
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
pF
μA
μA
μA
μA
μA
μA
V
V
V
V
mA
V
mA
°C
°C
Still air, TSW = LOW
200 lfm airflow, TSW = LOW
0
0
VDE = differential error voltage, VCME = common-mode error voltage, ΔVDE = VDE matching between outputs, ΔV = maximum deviation between outputs, and full-scale output
voltage = VFS = 2 × (VRH − VRL). See the Accuracy section.
2
Guaranteed monotonic by characterization to four sigma limits.
3
Measured on two outputs differentially as CLK and DBx(0:11) are driven and XFR is held LOW.
4
Measured on two outputs differentially as the others are transitioning by 5 V. Measured for both states of INV.
5
Measured from 50% of rising CLK edge to 50% of output change. Measurement is made for both states of INV.
6
Measured from 50% of INV transition to 50% of output change.
7
Operation at elevated ambient temperature requires a thermally optimized PCB and additional thermal management, such as airflow across the surface of the AD8387.
Rev. 0 | Page 4 of 16
AD8387
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltages
AVCCx − AGNDx
DVCC − DGND
Input Voltages
Maximum Digital Input Voltage
Minimum Digital Input Voltage
Maximum Analog Input Voltage
Minimum Analog Input Voltage
Internal Power Dissipation
1
TQFP E-Pad @ T
A
= 25°C
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering 10 sec)
1
Rating
18 V
4.5 V
DVCC + 0.5 V
DGND − 0.5 V
AVCC + 0.5 V
AGND − 0.5 V
4.38 W
0°C to 85°C
−65°C to +125°C
300°C
When TSW is HIGH, the output current limiter, as well as the
thermal switch, is enabled. The thermal switch debiases the
output amplifier when the junction temperature reaches the
internally set trip point. In the event of an extended short-
circuit between a video output and a power supply rail, the
output amplifier current continues to switch between 0 and
100 mA typical with a period determined by the thermal time
constant and the hysteresis of the thermal trip point. The
thermal switch, when enabled, provides long-term protection
from accidental shorts during the assembly process by limiting
the average junction temperature to a safe level.
MAXIMUM POWER DISSIPATION
The maximum power that the AD8387 can safely dissipate is
limited by its junction temperature. The maximum safe junction
temperature for plastic encapsulated devices, as determined by the
glass transition temperature of the plastic, is approximately 150°C.
Exceeding this limit temporarily can cause a shift in the parametric
performance due to a change in the stresses exerted on the die by
the package. Exceeding a junction temperature of 150°C for an
extended period can result in device failure.
80-lead TQFP E-Pad:
θ
JA
= 28.5°C/W (still air) [JEDEC Standard, 4-layer PCB in still air]
θ
JC
= 12.2°C/W
θ
JB
= 14.6°C/W
Ψ
JB
= 12.0°C/W
Ψ
JT
= 0.3°C/W.
Stresses above those listed under the Absolute Maximum
Ratings may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to the
absolute maximum ratings for extended periods may reduce
device reliability.
OPERATING TEMPERATURE RANGE
To ensure operation within the specified operating temperature
range, it is necessary to limit the maximum power dissipation as
follows.
3.0
500LFM
200LFM
2.5
EXPOSED PADDLE
To ensure optimized thermal performance, the exposed paddle
must be thermally connected to an external plane, such as
AVCC or GND, as described in the Applications section.
MAXIMUM POWER DISSIPATION (W)
STILL AIR
2.0
OVERLOAD PROTECTION
The AD8387 overload protection circuit consists of an output
current limiter and a thermal switch.
When TSW is LOW, the thermal switch is disabled and the
output current limiter is enabled. The maximum current at any
one output is internally limited to 100 mA average. In the event
of a momentary short-circuit between a video output and a
power supply rail (VCC or AGND), the output current limit is
sufficiently low to provide temporary protection.
1.5
QUIESCENT
05653-002
THERMAL
SWITCH
ENABLED
DISABLED
1.0
50
75
55
80
60
65
70
75
80
85
85
90
95
100 105 110
AMBIENT TEMPERATURE (°C)
90
115
95
120
100
125
Figure 3. Maximum Power Dissipation vs. Temperature,
AD8387 on a 4-Layer JEDEC PCB with Thermally Optimized Landing
Pattern as Described in the Applications Section
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
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