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5519S-25

Description
Thermal Interface Products THERMAL INTERFACE PAD 210x155x1.5mm
CategoryThermal management products   
File Size103KB,3 Pages
Manufacturer3M
Websitehttp://3M.com/esd
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5519S-25 Overview

Thermal Interface Products THERMAL INTERFACE PAD 210x155x1.5mm

5519S-25 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
Manufacturer3M
Product CategoryThermal Interface Products
RoHSDetails
Factory Pack Quantity1
Technical Data | October 2016
3M™ Thermally Conductive Silicone Interface Pad 5519
3M™ Thermally Conductive Silicone Interface Pad (TCSIP) 5519 is designed to provide a preferential heat transfer path
between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M TCSIP 5519 consists
of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles,
which helps provide enhanced thermal conductivity and excellent electrical insulation performance.
Product Description
Key Features
Very high thermal conductivity and good electrical insulation properties
Good softness and conformability even to non-flat surfaces
Good electrical insulation properties
Good flame retardant, UL94 V-0 equivalent material
Compression relaxation properties help reduce pressure to electric components
Slight tack allows pre-assembly
Good wettability for improved and lower thermal resistance
Product Construction/Material Description
Note:
3M™ Thermally Conductive Silicone Interface Pad 5519
Property
Color
Base resin
Thickness
Primary Filler Type
Product Liner
The following technical information and data should be considered representative or typical only and should not be used for
specification purposes.
Value
White
Silicone
0.5 – 2.0mm*
Ceramic
PET Film Liner
* Standard thickness range. Custom thickness options available up to 10mm. Contact your local 3M representative for more
information.
3M™ Thermally Conductive Silicone Interface Pad 5519
PET Liner
Filled Silicone Elastomer
PET Liner
Applications
Integrated chip (IC) packaging heat conduction
Heat sink interface
Chip on film (COF) heat conduction
LED board thermal interface material (TIM)
HDTV integrated chip (IC)
General gap filling in electronic device

5519S-25 Related Products

5519S-25 5519-05 5519-210x155-40 5519-155x210 5519-210x155-20 5519S-210x155-80 5519S-1 5519S-2
Description Thermal Interface Products THERMAL INTERFACE PAD 210x155x1.5mm Thermal Interface Products THERM COND INT PAD 0.5MM 155MMX210MM Thermal Interface Products THERMAL INTERFACE PAD 210 x 155 x 1mm Thermal Interface Products THERM COND INT PAD 1.5MM 155MMX210MM Thermal Interface Products THERMAL INTERFACE PAD 210 x 155 x 2mm Thermal Interface Products THERMAL INTERFACE PAD 210 x 155 x .5mm Thermal Interface Products THERM COND INT PAD 1MIL 155MMX210MM Thermal Interface Products THERM COND INT PAD 2MIL 155MMX210MM
Product Attribute Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value Attribute Value
Manufacturer 3M 3M 3M 3M 3M 3M 3M 3M
Product Category Thermal Interface Products Thermal Interface Products Thermal Interface Products Thermal Interface Products Thermal Interface Products Thermal Interface Products Thermal Interface Products Thermal Interface Products
RoHS Details Details Details Details Details Details Details Details
Factory Pack Quantity 1 1 1 20 1 1 1 1
Type - Thermally Conductive Gap Pad Thermally Conductive Gap Pad Thermally Conductive Gap Pad Thermally Conductive Gap Pad Thermally Conductive Gap Pad Thermally Conductive Gap Pad Thermally Conductive Gap Pad
Material - Silicone Silicone Silicone Silicone Silicone Silicone Silicone
Product - Pads Pads Pads Pads Pads Pads Pads
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