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24LC08B-I-MSG

Description
EEPROM 1kx8 - 2.5V Lead Free Package
Categorystorage   
File Size233KB,25 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
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24LC08B-I-MSG Overview

EEPROM 1kx8 - 2.5V Lead Free Package

24LC08B-I-MSG Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerMicrochip
Product CategoryEEPROM
RoHSDetails
Mounting StyleSMD/SMT
Package / CaseMSOP-8
Memory Size8 kbit
Organization1 k x 8
Interface TypeSerial, 2-Wire, I2C
Access Time900 ns
Data Retention200 Year
Maximum Clock Frequency0.4 MHz
Supply Current - Max3 mA
Supply Voltage - Min2.5 V
Supply Voltage - Max5.5 V
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 85 C
Height0.85 mm
Length3 mm
Width3 mm
Operating Supply Current3 mA
Operating Supply Voltage2.5 V, 5.5 V
Programming Voltage2.5 V to 5.5 V
Factory Pack Quantity100
Unit Weight0.004938 oz
24AA08/24LC08B
8K I
2
C
Serial EEPROM
Device Selection Table
Part
Number
24AA08
24LC08B
Note 1:
V
CC
Range
1.8-5.5
2.5-5.5
Max Clock
Frequency
400 kHz
(1)
400 kHz
Temp
Ranges
I
I, E
Description
The Microchip Technology Inc. 24AA08/24LC08B
(24XX08*) is a 8 Kbit Electrically Erasable PROM. The
device is organized as four blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low voltage
design permits operation down to 1.8V, with standby
and active currents of only 1
µA
and 1 mA,
respectively. The 24XX08 also has a page write
capability for up to 16 bytes of data. The 24XX08 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP and MSOP packages and is also
available in the 5-lead SOT-23 package.
100 kHz for V
CC
<2.5V
Features
• Single supply with operation down to 1.8V
• Low-power CMOS technology
- 1 mA active current typical
- 1
µA
standby current typical (I-temp)
• Organized as 4 blocks of 256 bytes (4 x 256 x 8)
• 2-wire serial interface bus, I
2
C™ compatible
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (<2.5V) and 400 kHz (≥2.5V) compatibility
• Self-timed write cycle (including auto-erase)
• Page write buffer for up to 16 bytes
• 2 ms typical write cycle time for page write
• Hardware write-protect for entire memory
• Can be operated as a serial ROM
• Factory programming (QTP) available
• ESD protection > 4,000V
• 1,000,000 erase/write cycles
• Data retention > 200 years
• 8-lead PDIP, SOIC, TSSOP and MSOP packages
• 5-lead SOT-23 package
• Standard and Pb-free finishes available
• Available for extended temperature ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Package Types
PDIP/SOIC/TSSOP/MSOP
A0 1
8 Vcc
SCL
Vss
SOT-23-5
1
2
3
5
WP
24XX08
24XX08
A1 2
A2 3
Vss 4
Note:
7 WP
6 SCL
5 SDA SDA
4
Vcc
Pins A0, A1 and A2 are not used by the
24XX08. (No internal connections).
Block Diagram
WP
HV
Generator
I/O
Control
Logic
Memory
Control
Logic
XDEC
EEPROM
Array
Page
Latches
I/O
SDA
SCL
YDEC
V
CC
V
SS
Sense Amp.
R/W Control
*24XX08 is used in this document as a generic part number for the 24AA08/24LC08B devices.
2003 Microchip Technology Inc.
DS21710C-page 1

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Description EEPROM 1kx8 - 2.5V Lead Free Package EEPROM 1kx8 - 2.5V Lead Free Package EEPROM 1kx8 - 1.8V Lead Free Package EEPROM 1kx8 - 2.5V Lead Free Package EEPROM 1kx8 - 2.5V Lead Free Package EEPROM 1kx8 - 2.5V Lead Free Package Electrically Erasable Programmable Read Only Memory 1kx8 - 2.5V Lead Free Package Electrically Erasable Programmable Read Only Memory 1kx8 - 1.8V Lead Free Package Electrically Erasable Programmable Read Only Memory 1kx8 - 2.5V Lead Free Package
Is it lead-free? - - - Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? - - - conform to conform to conform to conform to conform to conform to
Parts packaging code - - - MSOP SOT-23 TSSOP DIP SOIC SOIC
package instruction - - - ROHS COMPLIANT, PLASTIC, MSOP-8 ROHS COMPLIANT, PLASTIC, SOT-23, 5 PIN 4.40 MM, ROHS COMPLIANT, PLASTIC, MO-153, TSSOP-8 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
Contacts - - - 8 5 8 8 8 8
Reach Compliance Code - - - compliant compliant compliant compliant compliant compliant
ECCN code - - - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) - - - 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.1 MHz 0.4 MHz
Data retention time - minimum - - - 200 200 200 200 200 200
Durability - - - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C control byte - - - 1010XMMR 1010XMMR 1010XMMR 1010XMMR 1010XMMR 1010XMMR
JESD-30 code - - - S-PDSO-G8 R-PDSO-G5 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8
JESD-609 code - - - e3 e3 e3 e3 e3 e3
length - - - 3 mm 2.9 mm 4.4 mm 9.27 mm 4.9 mm 4.9 mm
memory density - - - 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit
Memory IC Type - - - EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width - - - 8 8 8 8 8 8
Humidity sensitivity level - - - 1 1 1 - 1 1
Number of functions - - - 1 1 1 1 1 1
Number of terminals - - - 8 5 8 8 8 8
word count - - - 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words
character code - - - 1000 1000 1000 1000 1000 1000
Operating mode - - - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature - - - 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - - - -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize - - - 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8
Package body material - - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - - - TSSOP LSSOP TSSOP DIP SOP SOP
Encapsulate equivalent code - - - TSSOP8,.19 TSOP5/6,.11,37 TSSOP8,.25 DIP8,.3 SOP8,.25 SOP8,.25
Package shape - - - SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - - - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE SMALL OUTLINE SMALL OUTLINE
Parallel/Serial - - - SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) - - - 260 260 260 NOT SPECIFIED 260 260
power supply - - - 3/5 V 3/5 V 3/5 V 3/5 V 2/5 V 3/5 V
Certification status - - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - - - 1.1 mm 1.45 mm 1.2 mm 5.334 mm 1.75 mm 1.75 mm
Serial bus type - - - I2C I2C I2C I2C I2C I2C
Maximum standby current - - - 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A 0.000001 A
Maximum slew rate - - - 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA
Maximum supply voltage (Vsup) - - - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) - - - 2.5 V 2.5 V 2.5 V 2.5 V 1.7 V 2.5 V
Nominal supply voltage (Vsup) - - - 5 V 5 V 5 V 5 V 2.5 V 5 V
surface mount - - - YES YES YES NO YES YES
technology - - - CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level - - - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface - - - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form - - - GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal pitch - - - 0.65 mm 0.95 mm 0.65 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location - - - DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature - - - 40 40 40 NOT SPECIFIED 40 40
width - - - 3 mm 1.55 mm 3 mm 7.62 mm 3.9 mm 3.9 mm
Maximum write cycle time (tWC) - - - 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
write protect - - - HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE
Base Number Matches - - - 1 1 1 1 1 1
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