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74HCT367DB118

Description
Buffers & Line Drivers HEX BUFFER 4-BIT AND
Categorysemiconductor    logic   
File Size759KB,18 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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74HCT367DB118 Overview

Buffers & Line Drivers HEX BUFFER 4-BIT AND

74HCT367DB118 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerNXP
Product CategoryBuffers & Line Drivers
RoHSDetails
Number of Input Lines6 Input
Number of Output Lines6 Output
PolarityNon-Inverting
Supply Voltage - Max5.5 V
Supply Voltage - Min4.5 V
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 125 C
Mounting StyleSMD/SMT
Package / CaseSOT-338-16
PackagingCut Tape
PackagingMouseReel
PackagingReel
FunctionBuffer/Line Driver
Height1.8 mm (Max)
Length6.4 mm (Max)
Output Type3-State
Quiescent Current8 uA
TechnologyCMOS
Width5.4 mm (Max)
Logic FamilyHCT
Number of Channels6
Supply Current - Max8 uA
High Level Output Current- 6 mA
Input Signal TypeSingle-Ended
Low Level Output Current6 mA
Operating Supply Voltage5 V
Propagation Delay Time25 ns at 4.5 V
Factory Pack Quantity2000
74HC367; 74HCT367
Hex buffer/line driver; 3-state
Rev. 3 — 17 October 2016
Product data sheet
1. General description
The 74HC367; 74HCT367 is a hex buffer/line driver with 3-state outputs controlled by the
output enable inputs (nOE). A HIGH on nOE causes the outputs to assume a high
impedance OFF-state. Inputs include clamp diodes. It enables the use of current limiting
resistors to interface inputs to voltages in excess of V
CC
.
2. Features and benefits
Input levels:
For 74HC367: CMOS level
For 74HCT367: TTL level
3-state outputs
Complies with JEDEC standard no. 7 A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74HC367D
74HCT367D
74HC367DB
74HCT367DB
74HC367PW
74HCT367PW
40 C
to +125
C
40 C
to +125
C
SSOP16
plastic shrink small outline package; 16 leads;
body width 5.3 mm
SOT338-1
SOT403-1
40 C
to +125
C
Name
SO16
Description
Version
plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
Type number
TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm

74HCT367DB118 Related Products

74HCT367DB118 74HC367PW 74HCT367N652 74HC367DB 74HC367PW-T 74HC367D-T 74HCT367DB-T
Description Buffers & Line Drivers HEX BUFFER 4-BIT AND Buffers & Line Drivers HEX BUFFER 4-BIT AND 2-BIT 3-S Buffers & Line Drivers HEX BUFF/DRVR 3ST Buffers & Line Drivers HEX BUFFER 4-BIT AND 2-BIT 3-S Buffers & Line Drivers HEX BUFFER 4-BIT AND 2-BIT 3-S Buffers & Line Drivers HEX BUFFER 4-BIT AND 2-BIT 3-S Buffers & Line Drivers HEX BUFFER 4-BIT AND 2-BIT 3-S
Is it Rohs certified? - conform to - conform to conform to conform to conform to
Maker - NXP - NXP NXP NXP -
Parts packaging code - TSSOP - SOIC TSSOP SOIC SOIC
package instruction - TSSOP, TSSOP16,.25 - PLASTIC, SSOP-16 TSSOP, SOP, SSOP,
Contacts - 16 - 16 16 16 16
Reach Compliance Code - compliant - unknown unknown compliant unknown
Other features - ONE FUNCTION WITH TWO BITS - ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS
series - HC/UH - HC/UH HC/UH HC/UH HCT
JESD-30 code - R-PDSO-G16 - R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
JESD-609 code - e4 - e4 e4 e4 e4
length - 5 mm - 6.2 mm 5 mm - 6.2 mm
Load capacitance (CL) - 50 pF - 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type - BUS DRIVER - BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
Humidity sensitivity level - 1 - 1 1 1 1
Number of digits - 6 - 6 6 6 6
Number of functions - 1 - 1 1 1 1
Number of ports - 2 - 2 2 2 2
Number of terminals - 16 - 16 16 16 16
Maximum operating temperature - 125 °C - 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature - -40 °C - -40 °C -40 °C -40 °C -40 °C
Output characteristics - 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity - TRUE - TRUE TRUE TRUE TRUE
Package body material - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - TSSOP - SSOP TSSOP SOP SSOP
Package shape - RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius) - 260 - 260 260 260 260
propagation delay (tpd) - 29 ns - 29 ns 29 ns 29 ns 38 ns
Certification status - Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 1.1 mm - 2 mm 1.1 mm - 2 mm
Maximum supply voltage (Vsup) - 6 V - 6 V 6 V 6 V 5.5 V
Minimum supply voltage (Vsup) - 2 V - 2 V 2 V 2 V 4.5 V
Nominal supply voltage (Vsup) - 5 V - 5 V 5 V 5 V 5 V
surface mount - YES - YES YES YES YES
technology - CMOS - CMOS CMOS CMOS CMOS
Temperature level - AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface - NICKEL PALLADIUM GOLD - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal form - GULL WING - GULL WING GULL WING GULL WING GULL WING
Terminal pitch - 0.65 mm - 0.65 mm 0.65 mm - 0.65 mm
Terminal location - DUAL - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature - 30 - 30 30 30 30
width - 4.4 mm - 5.3 mm 4.4 mm - 5.3 mm
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