CW160808-15NG datasheet, PDF - EEWORLD Datasheet

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CW160808-15NG: DescriptionFixed Inductors 15nH 5% HIGH Q; CategoryPassive components; File Size182KB，2 Pages; ManufacturerBourns; Websitehttp://www.bourns.com

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CW160808-15NG Overview

Fixed Inductors 15nH 5% HIGH Q

CW160808-15NG Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	Bourns
Product Category	Fixed Inductors
RoHS	Details
Termination Style	SMD/SMT
Shielding	Unshielded
Inductance	15 nH
Tolerance	2 %
Maximum DC Current	700 mA
Maximum DC Resistance	600 mOhms
Minimum Operating Temperature	- 40 C
Maximum Operating Temperature	+ 125 C
Q Minimum	30
Test Frequency	250 MHz
Termination	-
Mounting Style	PCB Mount
Length	1.65 mm
Width	1.05 mm
Height	1 mm
Application	RF
Packaging	Cut Tape
Packaging	MouseReel
Packaging	Reel
Core Material	Alumina
Product	Fixed Inductors
Self Resonant Frequency	4000 MHz
Case Code - in	0603
Case Code - mm	1608
Factory Pack Quantity	3000
Unit Weight	0.000071 oz

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Features

■

0603 size

■

Available in E12 series

■

High Q - up to 80 typ.

■

High operating temperature of 125 °C

■

Small size of only 1.6 mm

■

RoHS compliant*

Applications

■

Mobile phones

■

Cellular phones

■

CTV, VCR, HIC, FDD

CW160808 Series - High Q Chip Inductors

Electrical Speciﬁcations

Inductance

CW160808-1N8M

CW160808-2N2D

CW160808-3N9J

CW160808-4N7J

CW160808-6N8J

CW160808-8N2J

CW160808-10NJ

CW160808-12NJ

CW160808-15NJ

CW160808-18NJ

CW160808-22NJ

CW160808-27NJ

CW160808-33NJ

CW160808-39NJ

CW160808-47NJ

CW160808-56NJ

CW160808-68NJ

CW160808-72NJ

CW160808-82NJ

CW160808-R10J

CW160808-R12J

CW160808-R15J

CW160808-R18J

CW160808-R22J

CW160808-R27J

1.8

2.2

3.9

4.7

6.8

8.2

100

120

150

180

220

270

Tol. %

±20

±15

±5

Min.

Test Freq.

(MHz)

250

200

150

100

250

150

100

SRF

(MHz)

Min.

6000

5800

5000

4800

4000

3100

3000

2800

2300

2200

2100

1900

1700

1400

1350

1300

990

RDC

Ohms

0.04

0.08

0.10

0.11

0.13

0.17

0.19

0.22

0.25

0.28

0.31

0.34

0.49

0.54

0.71

0.79

0.92

1.25

1.90

2.30

I rms

(mA)

Max.

700

600

400

300

280

240

200

170

0.35

(.014)

Preheat

Area

150~200 °C / 60~120 Sec.

Reflow

Area

20~

40 °C/

Sec.

Max.

Forced Cooling

Area

-1~5 °C/Sec. Max.

PEAK TEMP.

260 °C

230 °C

50 SECONDS MAX.

General Speciﬁcations

Temperature Rise

.................20 °C max. at rated current

Operating Temperature

................................-40 °C to +125 °C

Storage Temperature

................................-40 °C to +125 °C

Reﬂow Soldering .. 230 °C, 50 sec. max.

Resistance to Soldering Heat

.......................... +260 °C, 10 seconds

Materials

Core Material .............................Alumina

(1CC150707-302291)

Wire ........ Enameled copper (1W1E180)

Terminal ...........................Mo/Mn+Ni+Au

Encapsulate ......... Epoxy (1EAS-UV300)

Packaging ................. 3,000 pcs. per reel

Product Dimensions

0.35

(.014)

1.0

0.2

(.040

.008)

Bourns

Part No.

1.65

0.2

(.065

.008)

1.05

0.2

(.041

.008)

Solder Proﬁle

Temperature

Rising

Area

0.35

(.014)

Recommended Layout

0.7

(.028)

0.7

REF.

(.028)

4 °C/

Sec.

Max.

REF.

250

Temperature (°C)

200

150

70 SECONDS MAX.

REF.

0.64

(.025)

1.2

REF.

(.047)

100

DIMENSIONS:

(INCHES)

100

150

200

250

Time (Seconds)

*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.

Speciﬁcations are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their speciﬁc applications.

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