5962-9315708HYX datasheet, PDF

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5962-9315708HYX: DescriptionSRAM Module, 256KX8, 25ns, CMOS, DIP-32; Categorystorage storage; File Size112KB，22 Pages; ManufacturerWhite Microelectronics

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5962-9315708HYX Overview

SRAM Module, 256KX8, 25ns, CMOS, DIP-32

5962-9315708HYX Parametric

Parameter Name	Attribute value
Maker	White Microelectronics
package instruction	DIP-32
Reach Compliance Code	unknown
Maximum access time	25 ns
JESD-30 code	R-XDIP-T32
length	41.525 mm
memory density	2097152 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256KX8
Package body material	UNSPECIFIED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.13 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Table I; Changed the max limit for I

for device types 06 through 09

from 150 mA to 180 mA. Changed the max limit for I

CCDR

for device

types 06 through 09 from 6.4 mA to 7.0 mA. -sld

Added cage code 0EU86 fro device types 05 through 08. Figure 1;

case outline Y, changed dimension C (min) from 0.009 to 0.008

inches, dimension D (min) from 1.654 to 1.584 inches, dimension E

(max) from 0.604 to 0.605 inches and dimension Q (max) from 0.047

to 0.060 inches. Added a monolithic block diagram to figure 6. -sld

Added note to paragraph 1.2.2 and table I to regarding the 4

transistor design. Added thermal resistance ratings for all case

outlines to paragraph 1.3. Editorial changes throughout. -sld

Table I; Change the min limit for t

as follows: For device types 01-

03 change from 15 ns to 3 ns. For device type 04 change from 5 ns to

3 ns. For device types 05-09 change from 3 ns to 0 ns. -gjc

DATE (YR-MO-DA)

98-06-22

APPROVED

K. A. Cottongim

99-11-01

Raymond Monnin

00-07-11

Raymond Monnin

02-04-02

Raymond Monnin

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Steve L. Duncan

CHECKED BY

Michael C. Jones

STANDARD

MICROCIRCUIT

DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

POST OFFICE BOX 3990

COLUMBUS, OHIO 43216-5000

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

APPROVED BY

Kendall A. Cottongim

MICROCIRCUIT, MEMORY, HYBRID AND

MONOLITHIC, DIGITAL, STATIC RANDOM

ACCESS MEMORY, CMOS, 256K x 8-BIT

DRAWING APPROVAL DATE

93-04-01

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-93157

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E291-02

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in

accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as

designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.

Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).

Furthermore, the manufacturers may take exceptions or use alternate methods to the tests and inspections herein and not

perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device

class.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38534 and herein.

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.

3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4 and 5.

3.2.5 Block diagram. The block diagram shall be as specified on figure 6.

3.2.6 Output load circuit. The output load circuit shall be as specified on figure 7.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full specified operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked

with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.

3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described

herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot

sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for

those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer

and be made available to the preparing activity (DSCC-VA) upon request.

SIZE

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

REVISION LEVEL

5962-93157

SHEET

DSCC FORM 2234

APR 97

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