5962-8851301GX datasheet, PDF - EEWORLD Datasheet

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5962-8851301GX: Description5962-8851301GX amplifier basic information: 5962-8851301GX is an OPERATIONAL AMPLIFIER. 5962-8851301GX amplifier core information: The minimum operating temperature of 5962-8851301GX is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.02 µA How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of 5962-8851301GX is 52 V/us. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the 5962-8851301GX gain becomes 0.707 times the low-frequency gain is 10000 kHz. The nominal supply voltage of 5962-8851301GX is 15 V, and its corresponding nominal negative supply voltage is -15 V. The input offset voltage of 5962-8851301GX is 2000 µV (Input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).) Related dimensions of 5962-8851301GX: 5962-8851301GX has 8 terminals. Its terminal position type is: BOTTOM. 5962-8851301GX amplifier additional information: Its temperature grade is: MILITARY. The corresponding JESD-30 code is: O-MBCY-W8. The packaging code of 5962-8851301GX is: TO-99. The material of 5962-8851301GX packaging is mostly METAL. And its package shape is ROUND. 5962-8851301GX package pin formats are: CYLINDRICAL. Its terminal form is: WIRE.; CategoryAnalog mixed-signal IC Amplifier circuit; File Size75KB，12 Pages; ManufacturerPrecision Monolithics Inc; Alternative parts：5962-8851301GX

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5962-8851301GX Overview

5962-8851301GX amplifier basic information:

5962-8851301GX is an OPERATIONAL AMPLIFIER.

5962-8851301GX amplifier core information:

The minimum operating temperature of 5962-8851301GX is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.02 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of 5962-8851301GX is 52 V/us. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the 5962-8851301GX gain becomes 0.707 times the low-frequency gain is 10000 kHz.

The nominal supply voltage of 5962-8851301GX is 15 V, and its corresponding nominal negative supply voltage is -15 V. The input offset voltage of 5962-8851301GX is 2000 µV (Input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of 5962-8851301GX:

5962-8851301GX has 8 terminals. Its terminal position type is: BOTTOM.

5962-8851301GX amplifier additional information:

Its temperature grade is: MILITARY. The corresponding JESD-30 code is: O-MBCY-W8. The packaging code of 5962-8851301GX is: TO-99. The material of 5962-8851301GX packaging is mostly METAL. And its package shape is ROUND.

5962-8851301GX package pin formats are: CYLINDRICAL. Its terminal form is: WIRE.

5962-8851301GX Parametric

Parameter Name	Attribute value
Maker	Precision Monolithics Inc
Reach Compliance Code	unknown
Amplifier type	OPERATIONAL AMPLIFIER
Maximum average bias current (IIB)	0.02 µA
Nominal Common Mode Rejection Ratio	94 dB
Maximum input offset voltage	2000 µV
JESD-30 code	O-MBCY-W8
Negative supply voltage upper limit	-20 V
Nominal Negative Supply Voltage (Vsup)	-15 V
Number of functions	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	METAL
encapsulated code	TO-99
Package shape	ROUND
Package form	CYLINDRICAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Nominal slew rate	52 V/us
Supply voltage upper limit	20 V
Nominal supply voltage (Vsup)	15 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal form	WIRE
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	10000 kHz
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Page 2, 1.4, add IVR test conditions. Page 4, table I, I

and I

, add footnote

to guarantee subgroup 3. For I

, change unit from pA to nA.

For V

, add subgroup 6. Editorial changes throughout.

Add device type 02 and case outline, F-4. Editorial changes throughout.

Change boilerplate to add one-part part numbers. Add delta test limits.

Make changes to table IIA. - ro

91-03-07

96-11-13

02-01-07

M. A. FRYE

R. MONNIN

DATE (YR-MO-DA)

88-07-19

APPROVED

M. A. FRYE

THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

MARCIA B. KELLEHER

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

D. A. DiCENZO

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

http://www.dscc.dla.mil

APPROVED BY

ROBERT P. EVANS

MICROCIRCUIT, LINEAR, HIGH SPEED, FAST

SETTLING, PRECISION OPERATIONAL

AMPLIFIER, MONOLITHIC SILICON

DRAWING APPROVAL DATE

87-11-27

AMSC N/A

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-88513

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E127-02

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883 -

MIL-STD-1835 -

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the

full ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space

limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the

RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.

Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-88513

SHEET

5962-8851301GX Related Products

	5962-8851301GX	5962-88513012C	5962-88513012A	5962-8851301GA	5962-8851301PA	5962-8851301PB	5962-88513012X	PFC-W0805R-02-1720-D	5962-8851301GB
Description	Operational Amplifier, 1 Func, 2000uV Offset-Max, BIPolar, MBCY8,	Operational Amplifier, 1 Func, 2000uV Offset-Max, BIPolar, CQCC20, CERAMIC, LCC-20	Operational Amplifier, 1 Func, 1000uV Offset-Max, BIPolar, CQCC20,	Operational Amplifier, 1 Func, 1000uV Offset-Max, BIPolar, MBCY8,	Operational Amplifier, 1 Func, 1000uV Offset-Max, BIPolar, CDIP8,	Operational Amplifier, 1 Func, 2000uV Offset-Max, BIPolar, CDIP8, CERAMIC, DIP-8	Operational Amplifier, 1 Func, 2000uV Offset-Max, BIPolar, CQCC20,	Fixed Resistor, Thin Film, 0.25W, 172ohm, 100V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 0805, CHIP	Operational Amplifier, 1 Func, 2000uV Offset-Max, MBCY8, METAL CAN, 8-PIN
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	compliant	unknown
Number of terminals	8	20	20	8	8	8	20	2	8
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	150 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-65 °C	-55 °C
Package form	CYLINDRICAL	CHIP CARRIER	CHIP CARRIER	CYLINDRICAL	IN-LINE	IN-LINE	CHIP CARRIER	SMT	CYLINDRICAL
surface mount	NO	YES	YES	NO	NO	NO	YES	YES	NO
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	-	OPERATIONAL AMPLIFIER
Maximum average bias current (IIB)	0.02 µA	0.02 µA	0.0002 µA	0.0002 µA	0.0002 µA	0.02 µA	0.02 µA	-	0.02 µA
Nominal Common Mode Rejection Ratio	94 dB	80 dB	86 dB	86 dB	86 dB	80 dB	94 dB	-	80 dB
Maximum input offset voltage	2000 µV	2000 µV	1000 µV	1000 µV	1000 µV	2000 µV	2000 µV	-	2000 µV
JESD-30 code	O-MBCY-W8	S-CQCC-N20	S-CQCC-N20	O-MBCY-W8	R-CDIP-T8	R-GDIP-T8	S-CQCC-N20	-	O-MBCY-X8
Negative supply voltage upper limit	-20 V	-20 V	-20 V	-20 V	-20 V	-20 V	-20 V	-	-20 V
Nominal Negative Supply Voltage (Vsup)	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-15 V	-	-15 V
Number of functions	1	1	1	1	1	1	1	-	1
Package body material	METAL	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	METAL	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	-	METAL
encapsulated code	TO-99	QCCN	QCCN	TO-99	DIP	DIP	QCCN	-	-
Package shape	ROUND	SQUARE	SQUARE	ROUND	RECTANGULAR	RECTANGULAR	SQUARE	-	ROUND
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Nominal slew rate	52 V/us	52 V/us	52 V/us	52 V/us	52 V/us	52 V/us	52 V/us	-	-
Supply voltage upper limit	20 V	20 V	20 V	20 V	20 V	20 V	20 V	-	20 V
Nominal supply voltage (Vsup)	15 V	15 V	15 V	15 V	15 V	15 V	15 V	-	15 V
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	THIN FILM	-
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	-	MILITARY
Terminal form	WIRE	NO LEAD	NO LEAD	WIRE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	-	UNSPECIFIED
Terminal location	BOTTOM	QUAD	QUAD	BOTTOM	DUAL	DUAL	QUAD	-	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-
Nominal Uniform Gain Bandwidth	10000 kHz	10000 kHz	10000 kHz	10000 kHz	10000 kHz	10000 kHz	10000 kHz	-	-
Base Number Matches	1	1	1	1	1	1	1	-	1
package instruction	-	QCCN,	QCCN,	-	-	CERAMIC, DIP-8	-	CHIP	METAL CAN, 8-PIN
JESD-609 code	-	e0	e0	e0	e0	e0	-	e0	e0
Maximum seat height	-	2.54 mm	2.54 mm	-	5.08 mm	5.08 mm	2.54 mm	-	-
Terminal surface	-	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	-	Tin/Lead (Sn/Pb)	TIN LEAD
Terminal pitch	-	1.27 mm	1.27 mm	-	2.54 mm	2.54 mm	1.27 mm	-	-
width	-	8.89 mm	8.89 mm	-	7.62 mm	7.62 mm	8.89 mm	-	-

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