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MA1N4692CUR-1

Description
Zener Diode
CategoryDiscrete semiconductor    diode   
File Size171KB,5 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

MA1N4692CUR-1 Overview

Zener Diode

MA1N4692CUR-1 Parametric

Parameter NameAttribute value
Reach Compliance Codecompli
ECCN codeEAR99
Diode typeZENER DIODE
JESD-609 codee0
Terminal surfaceTIN LEAD
Base Number Matches1
1N4678UR-1 thru 1N4717UR-1
Available on
commercial
versions
500 mW SURFACE MOUNT ZENER DIODES
DESCRIPTION
Screening in
reference to
MIL-PRF-19500
available
The 1N4678UR-1 thru 1N4717UR-1 series of 0.5 watt glass surface mount DO-213AA Zener
voltage regulators provides a selection from 1.8 to 43 volts in standard 5% tolerances as well
as tighter tolerances with a very low test current of 50 µA. These have an internal
metallurgical bond. This type of internally bonded Zener package construction is also
available with high-reliability up-screening as described in the Features section. Microsemi
also offers numerous other Zener products to meet higher and lower power applications.
DO-213AA Package
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
Surface mount equivalent of JEDEC registered 1N4678 thru 1N4717 series.
Internal metallurgical bond.
Hermetically sealed surface mount package.
Tighter voltage tolerances of 2% and 1% are available.
Up-screening available in reference to MIL-PRF-19500 (see
part nomenclature
for all available
options).
RoHS compliant devices available (commercial grade only).
Also available in:
DO-35 (DO-204AH)
(surface mount)
1N4678-1 – 1N4717-1
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current and temperature range.
Voltage selection from 1.8 to 43 V.
Standard voltage tolerance +/- 5 %.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Minimal capacitance (see
Figure 2).
Inherently radiation hard as described in Microsemi’s “MicroNote
050”.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
(1)
Thermal Resistance Junction-to-End Cap
(1)
Thermal Resistance Junction-to-Ambient
(2)
Steady-State Power Dissipation
Forward Voltage @ 100 mA
Solder Temperature @ 10 s
Symbol
T
J
and T
STG
R
ӨJL
R
ӨJA
P
D
V
F
T
SP
Value
-65 to +175
100
250
0.5
1.5
260
Unit
C
o
C/W
o
C/W
W
V
o
C
o
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).
2. At T
EC
< 125
o
C or at ambient T
A
< 50
º
C when mounted on FR4 PC board.
T4-LDS-0240-1, Rev. 1 (112022)
©2011 Microsemi Corporation
Page 1 of 5
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