SI8234AD-C-IS datasheet, PDF - EEWORLD Datasheet

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SI8234AD-C-IS: DescriptionHB Based Peripheral Driver With Pwm, 4A, PDSO16, ROHS COMPLIANT, SOIC-16; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size636KB，56 Pages; ManufacturerSilicon Laboratories Inc; Environmental Compliance

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SI8234AD-C-IS Overview

HB Based Peripheral Driver With Pwm, 4A, PDSO16, ROHS COMPLIANT, SOIC-16

SI8234AD-C-IS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Silicon Laboratories Inc
Parts packaging code	SOIC
package instruction	ROHS COMPLIANT, SOIC-16
Contacts	16
Reach Compliance Code	unknown
ECCN code	EAR99
Built-in protection	UNDER VOLTAGE
Interface integrated circuit type	HB BASED PERIPHERAL DRIVER WITH PWM
JESD-30 code	R-PDSO-G16
length	10.3 mm
Number of functions	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Output current flow direction	SOURCE AND SINK
Nominal output peak current	4 A
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	2.65 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
Supply voltage 1-max	24 V
Mains voltage 1-minute	6.5 V
Supply voltage1-Nom	12 V
surface mount	YES
Temperature level	AUTOMOTIVE
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Disconnect time	60 µs
connection time	60 µs
width	7.5 mm
Base Number Matches	1

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Si823x

0 . 5

AND

4 . 0 A

I S O

D R I V E R S

(2.5

AND

RMS

)

Features



Two completely isolated drivers



60 ns propagation delay (max)

in one package



Independent HS and LS inputs or



Up to 5 kV

RMS

input-to-output

PWM input versions

isolation



Transient immunity >45 kV/µs



Up to 1500 V

peak driver-to-



Overlap protection and

driver differential voltage

programmable dead time

HS/LS and dual driver versions



AEC-Q100 qualification

Up to 8 MHz switching frequency



Wide operating range

0.5 A peak output (Si8230/1/2/7)



–40 to +125 °C



RoHS-compliant packages

4.0 A peak output

(Si8233/4/5/6/8)



SOIC-16 wide body

High electromagnetic immunity



SOIC-16



LGA-14

narrow body

Applications



Power delivery systems



Motor control systems



Isolated dc-dc power supplies



Lighting control systems



Plasma displays



Solar and industrial inverters

Safety Approval



UL 1577 recognized





VDE certification conformity



IEC

to 5000 Vrms for 1 minute

CSA component notice 5A

approval



IEC

60747-5-5 (VDE 0884 Part 5)



EN 60950-1 (reinforced

insulation)



60950-1, 61010-1, 60601-1

(reinforced insulation)

CQC certification approval



GB4943.1

Description

The Si823x isolated driver family combines two independent, isolated

drivers into a single package. The Si8230/1/3/4 are high-side/low-side

drivers, and the Si8232/5/6/7/8 are dual drivers. Versions with peak

output currents of 0.5 A (Si8230/1/2/7) and 4.0 A (Si8233/4/5/6/8) are

available. All drivers operate with a maximum supply voltage of 24 V.

The Si823x drivers utilize Silicon Labs' proprietary silicon isolation

technology, which provides up to 5 kV

RMS

withstand voltage per UL1577

and fast 60 ns propagation times. Driver outputs can be grounded to the

same or separate grounds or connected to a positive or negative voltage.

The TTL level compatible inputs with >400 mV hysteresis are available in

individual control input (Si8230/2/3/5/6/7/8) or PWM input (Si8231/4)

configurations. High integration, low propagation delay, small installed

size, flexibility, and cost-effectiveness make the Si823x family ideal for a

wide range of isolated MOSFET/IGBT gate drive applications.

Ordering Information:

See page 39.

Rev. 1.5 3/14

Si823x

Si823x

ABLE O F

ONTENTS

Section

Page

1. Top-Level Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

2.1. Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.1. Typical Operating Characteristics (0.5 Amp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.2. Typical Operating Characteristics (4.0 Amp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.3. Family Overview and Logic Operation During Startup . . . . . . . . . . . . . . . . . . . . . . . 21

3.4. Power Supply Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.5. Power Dissipation Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

3.6. Layout Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

3.7. Undervoltage Lockout Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

3.8. Programmable Dead Time and Overlap Protection . . . . . . . . . . . . . . . . . . . . . . . . . 28

4. Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

4.1. High-Side/Low-Side Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

4.2. Dual Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

4.3. Dual Driver with Thermally Enhanced Package (Si8236) . . . . . . . . . . . . . . . . . . . . .31

5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

7. Package Outline: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9. Package Outline: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

10. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

11. Package Outline: 14 LD LGA (5 x 5 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

12. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

13. Package Outline: 14 LD LGA with Thermal Pad (5 x 5 mm) . . . . . . . . . . . . . . . . . . . . .50

14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

15. Top Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

15.1. Si823x Top Marking (16-Pin Wide Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

15.2. Top Marking Explanation (16-Pin Wide Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . 52

15.3. Si823x Top Marking (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . . . . 53

15.4. Top Marking Explanation (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . . . . 53

15.5. Si823x Top Marking (14 LD LGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

15.6. Top Marking Explanation (14 LD LGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56

Rev. 1.5

SI8234AD-C-IS Related Products

	SI8234AD-C-IS	SI8232BD-B-ISR	SI8232BB-B-IS1R	SI8234BB-C-IMR	SI8232BB-B-IS	SI8232BB-B-ISR	Si8232BB-B-IS1	SI8233AB-C-IM	SI8233AB-C-IMR
Description	HB Based Peripheral Driver With Pwm, 4A, PDSO16, ROHS COMPLIANT, SOIC-16	Peripheral Driver, PDSO16	Peripheral Driver, PDSO16	Peripheral Driver	HB Based Peripheral Driver With Pwm, 0.5A, PDSO16, ROHS COMPLIANT, SOIC-16	Peripheral Driver, PDSO16	HB Based Peripheral Driver With Pwm, 4A, PDSO16, ROHS COMPLIANT, MO-012AC, SOIC-16	HB Based Peripheral Driver With Pwm, 0.4A, 5 X 5 MM, ROHS COMPLIANT, LGA-14	Peripheral Driver
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
package instruction	ROHS COMPLIANT, SOIC-16	SOP, SOP16,.4	SOP, SOP16,.25	, SOLCC14,.2,25	SOP, SOP16,.4	SOP, SOP16,.4	SOP, SOP16,.25	VFLGA, SOLCC14,.2,25	, SOLCC14,.2,25
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Number of terminals	16	16	16	14	16	16	16	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY
Encapsulate equivalent code	SOP16,.4	SOP16,.4	SOP16,.25	SOLCC14,.2,25	SOP16,.4	SOP16,.4	SOP16,.25	SOLCC14,.2,25	SOLCC14,.2,25
power supply	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Base Number Matches	1	1	1	1	1	1	1	1	1
Maker	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	Silicon Laboratories Inc	-	-
ECCN code	EAR99	-	-	-	EAR99	EAR99	EAR99	EAR99	-
JESD-30 code	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	-	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	S-XBGA-B14	-
encapsulated code	SOP	SOP	SOP	-	SOP	SOP	SOP	VFLGA	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	-
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	-
Terminal form	GULL WING	GULL WING	GULL WING	-	GULL WING	GULL WING	GULL WING	BUTT	-
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	0.65 mm	-
Terminal location	DUAL	DUAL	DUAL	-	DUAL	DUAL	DUAL	BOTTOM	-

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