SF2124E
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•
•
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Designed for RF Front-end Applications
Low Insertion Loss
3.0 x 3.0 x 1.3 mm Surface-mount Case
No Matching Circuit Required
2441.8 MHz
SAW Filter
Value
+20
0
-40 to +85
-40 to +85
260°C for 30 s
Absolute Maximum Ratings
Rating
Input Power Level
DC Voltage on any Non-ground Terminal
Operating Temperture Range
Storage Temperature Range in Tape and Reel
Suitable for Lead-free Soldering - Maximum Soldering Profile
Units
dBm
Volts
°C
°C
SM3030-6
Electrical Characteristics
Characteristic
Center Frequency
Insertion Loss, 2400.0 to 2483.5 MHz
Amplitude Ripple, 2400.0 to 2483.5 MHz
Attenuation, referenced to 0 dB
DC to 1700 MHz
1700 to 2200 MHz
2700 to 3100 MHz
3100 to 4000 MHz
4000 to 5000 MHz
VSWR, 2400 to 2483.5 MHz
Source Impedance
Load Impedance
Single-Ended Input / Output Impedance Match
Case Style
Lid Symbolization, Y=year, WW=week, S=shift
Sym
f
C
IL
Notes
1
Min
Typ
2441.8
2.1
0.9
Max
3.2
3.0
Units
MHz
dB
dB
P-P
20.0
25.0
30.0
20.0
10.0
Z
S
Z
L
29.0
30.0
40.0
29.0
20.0
1.7
50
50
dB
2.6
Ω
Ω
No matching network required for operation at 50 ohms
SM3030-6 3 x 3 mm Nominal Footprint
646 YWWS
Electrical Connections
Pin #
1
2
3
Description
Ground
Input
Ground
Pin #
4
5
6
Description
Ground
Output
Ground
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance
matching to 50
Ω
and measured with 50
Ω
network analyzer.
Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc.
Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external
impedance matching design. See Application Note No. 42 for details.
"LRIP" or "L" after the part number indicates "low rate initial production" and "ENG" or "E" indicates "engineering parts."
The design, manufacturing process, and specifications of this filter are subject to change.
Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port 1 and Port
2, so that the filter must always be installed in one direction per the circuit design.
US and international patents may apply.
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
www.RFM.com E-mail: info@rfm.com
©2013 by RF Monolithics, Inc.
Page 1 of 5
SF2124E - 12/12/13
SM3030-6 Case
6-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
Dimension
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
N
K
L
Min
2.87
2.87
1.12
0.77
2.67
1.47
0.72
1.37
0.47
1.17
K
N
O
N
M
M
mm
Nom
3.00
3.00
1.25
0.90
2.80
1.60
0.85
1.50
0.60
1.30
3.20
1.70
1.05
0.81
0.38
Max
3.13
3.13
1.38
1.03
2.93
1.73
0.98
1.63
0.73
1.43
Min
0.113
0.113
0.044
0.030
0.105
0.058
0.028
0.054
0.019
0.046
Inches
Nom
0.118
0.118
0.049
0.035
0.110
0.063
0.033
0.059
0.024
0.051
0.126
0.067
0.041
0.032
0.015
Max
0.123
0.123
0.054
0.040
0.115
0.068
0.038
0.064
0.029
0.056
Case Materials
Materials
Solder Pad
Plating
Lid Plating
Body
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
2.0 to 3.0 µm Nickel
Al
2
O
3
Ceramic
Pb Free
PCB Footprint Top View
TOP VIEW
B
1
6
C
6
BOTTOM VIEW
G
H
1
646
YWWS
A 2
5
E
F
5
2
I
3
4
D
4
J
3
www.RFM.com E-mail: info@rfm.com
©2013 by RF Monolithics, Inc.
Page 4 of 5
SF2124E - 12/12/13
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