Cache SRAM, 8KX18, BICMOS, PQFP52, PLASTIC, QFP-52
| Parameter Name | Attribute value |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | QFP |
| package instruction | QFP, |
| Contacts | 52 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| JESD-30 code | S-PQFP-G52 |
| JESD-609 code | e0 |
| memory density | 147456 bit |
| Memory IC Type | CACHE SRAM |
| memory width | 18 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 52 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8KX18 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| IDT71B221S24PF | IDT71B221S24J | IDT71B221S28JB8 | IDT71B221S28PF | IDT71B221S28J | IDT71B221S28JB | IDT71B221S28J8 | IDT71B221S24J8 | |
|---|---|---|---|---|---|---|---|---|
| Description | Cache SRAM, 8KX18, BICMOS, PQFP52, PLASTIC, QFP-52 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 8KX18, BICMOS, PQFP52, PLASTIC, QFP-52 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Parts packaging code | QFP | LCC | LCC | QFP | LCC | LCC | LCC | LCC |
| package instruction | QFP, | QCCJ, | QCCJ, | QFP, | QCCJ, | QCCJ, | QCCJ, | QCCJ, |
| Contacts | 52 | 52 | 52 | 52 | 52 | 52 | 52 | 52 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | 3A001.A.2.C | EAR99 | EAR99 | 3A001.A.2.C | EAR99 | EAR99 |
| JESD-30 code | S-PQFP-G52 | S-PQCC-J52 | S-PQCC-J52 | S-PQFP-G52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit |
| Memory IC Type | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| memory width | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 52 | 52 | 52 | 52 | 52 | 52 | 52 | 52 |
| word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C |
| organize | 8KX18 | 8KX18 | 8KX18 | 8KX18 | 8KX18 | 8KX18 | 8KX18 | 8KX18 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QCCJ | QCCJ | QFP | QCCJ | QCCJ | QCCJ | QCCJ |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK | CHIP CARRIER | CHIP CARRIER | FLATPACK | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | GULL WING | J BEND | J BEND | GULL WING | J BEND | J BEND | J BEND | J BEND |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| length | - | 19.1262 mm | 19.1262 mm | - | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm |
| Maximum seat height | - | 4.57 mm | 4.57 mm | - | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
| Terminal pitch | - | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| width | - | 19.1262 mm | 19.1262 mm | - | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm |
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