Smart Modular Technologies
1.
Document Status
Revision
0.5
0.9
0.92
0.94
1.0
Date
September 6, 2002
September 23, 2002
October 11, 2002
December 6, 2002
December 10, 2002
Specification ASY90147-1&2
December 10, 2002
Comments
First draft
Modified Table 1.
Modified Table 1, mechanical drawing, HCI
stack features.
Modified Table 1 and mechanical drawing.
First formal release version.
To make a request for change, correction, additions or information on references, please
contact:
Product Management
Communication Products Division
Smart Modular Technologies,
4305 Cushing Parkway,
Fremont, CA 94538.USA
+1 (510)-623-1231
2. Reference
[1] Specification of the Bluetooth System, Version 1.1, February 22, 2001.
3. Scope
The intention of this specification is to provide a general guideline on the integration of a
Bluetooth Mini module. The product specification complies with Bluetooth
Specification 1.1 [1].
4. Module General Features and Chipset Description
4.1 Module General Features
The Smart Modular Technologies’ Bluetooth Mini module is based on a Bluetooth
single chip reference design. It is a complete Bluetooth module. The module has the
following general main features:
•
Small footprint 52-pin BGA package with 0.8mm ball and1.27mm pitch (14.43mm
x
21.47mm
x
3.0mm).
•
Highly integrated small, thin module built with high-density mounting technology.
•
Class II device.
•
On board pin out for direct 50Ω RF trace connection.
•
Fully compliant with Bluetooth specification v1.1.
•
Full speed HCI UART.
•
USB v1.1 compliant and USB2.0 compatible.
•
Pulse Code Modulation (PCM) interface.
•
Programmable Parallel Input Output (PIO) ports.
•
Serial Peripheral Interface (SPI).
•
Low power 1.8V operation.
•
Full speed Bluetooth
TM
operation.
•
Full speed USB interface supports OHCI and UHCI host interface.
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Smart Modular Technologies
Smart Modular Technologies
•
•
•
•
•
•
•
•
Specification ASY90147-1&2
December 10, 2002
Full piconet support.
On board 4Mbit or 8Mbit external Flash.
Very low power consumption in active and standby modes.
Support for low power sleep modes.
Firmware upgradeable via UART, USB or SPI interface.
RF Shielding Can.
Conforms to FCC Part 15, ICAN RSS-210, ETSI, ARIB ST-T66, CE and (per
customers request for other countries’ EMI standards).
Temperature range: -20°C to +95°C.
5. Mechanical Drawing:
Figure 1. Mechanical drawing of Bluetooth Mini module.
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Smart Modular Technologies
Smart Modular Technologies
Specification ASY90147-1&2
December 10, 2002
6. Interface Definitions:
Table 1. Bluetooth Mini module interface definitions
Pin#
Name
Type
Note
A2
GND
GND
Ground
A8
VIN_3.3V
I
3.3V input
A9
VIN_3.3V
I
3.3V input
B1
N/C
No Connection
B2
N/C
No Connection
B8
GND
GND
Ground
B9
GND
GND
Ground
C1
PCM_IN
I
PCM synchronous data input
C2
N/C
No Connection
C8
N/C
No Connection
C9
N/C
No Connection
D1
PCM_OUT
O
PCM synchronous data output
D2
PCM_SYNC
I/O
PCM synchronous data SYNC
D8
PIO[10]
I/O
Programmable I/O terminal
D9
PIO[2]
I/O
USB_PULL_UP
E1
PCM_CLK
I/O
PCM synchronous data clock
E2
RXD
I
UART data input active high
E8
PIO[5]
I
USB_DETACH
E9
PIO[11]
I/O
Programmable I/O terminal
F1
CTS
I
UART clear to send active low
F2
TXD
O
UART data output active high
F8
PIO[9]
I/O
Programmable I/O terminal
F9
PIO[8]
I/O
Programmable I/O terminal
G1
SPI_MOSI
I
Serial Peripheral interface data input
G2
RTS
O
UART request to send active low
G8
PIO[7]
I/O
Programmable I/O terminal
G9
PIO[6]
I/O
CLK_REQ
H1
USB D+
I/O
USB data plus
H2
SPI_CLK
I
Serial Peripheral interface clock
H8
PIO[1]
I/O
Control output for external PA Class I
application only
H9
RST
I
Hardware reset, 3.3V±10% for > 5ms
J1
USB D-
I/O
USB data minus
J2
SPI_CSB
I
Select for Synchronous Serial Interface
active low
J8
NC
No Connection
J9
NC
No Connection
K1
SPI_MISO
O
Serial Peripheral interface data output
K2
PIO[0]
I/O
Control output for external LNA (if fitted)
K8
N/C
No Connection
K9
N/C
No Connection
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Smart Modular Technologies
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