
RIGHT SIDE LGA3647-1 SOCKET-P1 FOR ODM
| Parameter Name | Attribute value |
| Connector System | Board to Board |
| Connectors and terminals terminate to | A printed circuit board |
| Number of Positions | 1823 |
| grid spacing | .9906 x .8585 mm [ .039 x .0338 in ] |
| Plating thickness (µin) | 30 |
| Plating materials | gold |
| Frame type | C shape |
| Terminal base material | copper alloy |
| Outlet type | LGA 3647 |
| Terminal contact plating material | gold |
| Terminal contact plating thickness | 30 |
| Contact Current Rating (Max) (A) | .5 |
| PCB installation method | surface mount solder balls |
| Connector mounting type | board mounting |
| Radiator installation | Without |
| Centerline (Pitch) (mm) | .8585, .9906 |
| Centerline (Pitch) (in) | .0338, .039 |
| Shell color | black |
| Shell material | high temperature thermoplastics |
| Working group temperature range | -25 – 100 °C [ -13 – 212 °F ] |
| Circuit Application | Signal |
| UL flammability rating | UL 94V-0 |
| Encapsulation method | tray |
| Pallet color | blue |
| Comment | Lead-free solder balls |
| 2-2129710-8 | GUB-GL8A-03-2231-B-C | 2299804-3 | 2299806-1 | 2299805-1 | 2299804-1 | 2-2822979-4 | |
|---|---|---|---|---|---|---|---|
| Description | RIGHT SIDE LGA3647-1 SOCKET-P1 FOR ODM | Array/Network Resistor, Isolated, Thin Film, 0.16W, 2230ohm, 0.1% +/-Tol, -25,25ppm/Cel, 4430, | NRW NON-FABRIC BOLSTER,P0, W/O COVER | NRW NON-FABRIC CARRIER, SOCKET P0 | NRW BACK PLATE ASSY,SOCKET P0,STUD6.8MM | NRW NON-FABRIC BOLSTER,P0,W/ COVER | LGA3647-1 SOCKET-P1 KIT FOR ODM (30U AU) |
| Outlet type | LGA 3647 | - | LGA 3647 | LGA 3647 | LGA 3647 | LGA 3647 | LGA 3647 |
| Working group temperature range | -25 – 100 °C [ -13 – 212 °F ] | - | -25 – 100 °C [ -13 – 212 °F ] | -25 – 100 °C [ -13 – 212 °F ] | -25 – 100 °C [ -13 – 212 °F ] | -25 – 100 °C [ -13 – 212 °F ] | -25 – 100 °C [ -13 – 212 °F ] |
| Encapsulation method | tray | - | boxes and trays | Box & Tray | boxes and trays | boxes and trays | tray |
| Comment | Lead-free solder balls | - | Narrow type, without cover. | - | Backplate Assembly | Narrow version with lid. | Lead-free solder balls |
| Attachment type | - | - | Bolster Assembly | Carrier | backplane | Bolster Assembly | - |