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5962-005401-V9X

Description
RISC Microprocessor, 32-Bit, 25MHz, CMOS, DIE
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size3MB,42 Pages
Manufacturere2v technologies
Download Datasheet Parametric Compare View All

5962-005401-V9X Overview

RISC Microprocessor, 32-Bit, 25MHz, CMOS, DIE

5962-005401-V9X Parametric

Parameter NameAttribute value
Makere2v technologies
Parts packaging codeDIE
package instructionDIE,
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Address bus width32
bit size32
boundary scanYES
maximum clock frequency25 MHz
External data bus width32
FormatFLOATING POINT
Integrated cacheNO
JESD-30 codeX-XUUC-N
low power modeYES
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeUNSPECIFIED
Package formUNCASED CHIP
Certification statusNot Qualified
Filter levelMIL-PRF-38535 Class V
speed25 MHz
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formNO LEAD
Terminal locationUPPER
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Base Number Matches1
F
eatures
Integer Unit Based on SPARC V7 High-performance RISC Architecture
Optimized Integrated 32/64-bit Floating-point Unit
On-chip Peripherals:
– EDAC and Parity Generator and Checker
– Memory Interface:
Chip Select Generator
Waitstate Generation
Memory Protection
– DMA Arbiter
– Timers:
General Purpose Timer (GPT)
Real-time Clock Timer (RTCT)
Watchdog Timer (WDT)
– Interrupt Controller With 5 External Inputs
– General Purpose Interface (GPI)
– Dual UART
Speed Optimized Code RAM Interface
8- or 40-bit boot-PROM (Flash) Interface
IEEE 1149.1 Test Access Port (TAP) for Debugging and Test Purposes
Fully Static Design
Performance: 20 MIPs/5 MFlops (double precision) at SYSCLK = 25 MHz
Core Consumption: 1.0W typ. at 20 MIPs/0.7W typ. at 10 MIPs
Operating Range: 4.5V to 5.5V (3.3V Capability) -55°C to +125°C
Total Dose Radiation Capability (Parametric and Functional): 300 KRADs (Si)
SEU Event Rate Better than 1E
-8
Error/Component/Day (Worst Case)
Latch-up Immunity Better than (LET) 100 MeV-cm
2
/mg
Quality Grades: ESA SCC, QML Q or V
Package: 256 MQFPF; Bare Die
Rad-Hard 32-bit
SPARC
Embedded
Processor
TSC695F
Description
The TSC695F (ERC32 Single-Chip) is a highly integrated, high-performance 32-bit
RISC embedded processor implementing the SPARC architecture V7 specification. It
has been developed with the support of the ESA (European Space Agency), and
offers a full development environment for embedded space applications.
The processor is manufactured using the Atmel 0.5 µm radiation tolerant (≥ 300
KRADs
(Si)
) CMOS enhanced process (RTP). It can operate at a low voltage for opti-
mized power consumption. It has been specially designed for space, as it has on-chip
concurrent transient and permanent error detection.
The TSC695F includes an on-chip Integer Unit (IU), a Floating Point Unit (FPU), a
Memory Controller and a DMA arbiter. For real-time applications, the TSC695F offers
a high security watchdog, two timers, an interrupt controller, parallel and serial inter-
faces. Fault tolerance is supported using parity on internal/external buses and an
EDAC on the external data bus. The design is highly testable with the support of an
On-Chip Debugger (OCD), and a boundary scan through JTAG interface.
Rev. 4118F–AERO–04/02
1

5962-005401-V9X Related Products

5962-005401-V9X 5962-005401-VXX 5962-005401-QXX 5962-005401-VXC 5962-005401-V9A 5962-005401-QXC
Description RISC Microprocessor, 32-Bit, 25MHz, CMOS, DIE RISC Microprocessor, 32-Bit, 25MHz, CMOS, DIE RISC Microprocessor, 32-Bit, 25MHz, CMOS, PQFP256, MQFP-256 RISC Microprocessor, 32-Bit, 25MHz, CMOS, DIE RISC Microprocessor, 32-Bit, 25MHz, CMOS, DIE RISC Microprocessor, 32-Bit, 25MHz, CMOS, PQFP256, MQFP-256
Parts packaging code DIE DIE QFP DIE DIE QFP
package instruction DIE, DIE, MQFP-256 DIE, DIE, QFF,
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Address bus width 32 32 32 32 32 32
bit size 32 32 32 32 32 32
boundary scan YES YES YES YES YES YES
maximum clock frequency 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
External data bus width 32 32 32 32 32 32
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache NO NO NO NO NO NO
JESD-30 code X-XUUC-N X-XUUC-N S-PQFP-F256 X-XUUC-N X-XUUC-N S-PQFP-F256
low power mode YES YES YES YES YES YES
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY
encapsulated code DIE DIE QFF DIE DIE QFF
Package shape UNSPECIFIED UNSPECIFIED SQUARE UNSPECIFIED UNSPECIFIED SQUARE
Package form UNCASED CHIP UNCASED CHIP FLATPACK UNCASED CHIP UNCASED CHIP FLATPACK
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level MIL-PRF-38535 Class V MIL-PRF-38535 Class V MIL-PRF-38535 Class Q MIL-PRF-38535 Class V MIL-PRF-38535 Class V MIL-PRF-38535 Class Q
speed 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form NO LEAD NO LEAD FLAT NO LEAD NO LEAD FLAT
Terminal location UPPER UPPER QUAD UPPER UPPER QUAD
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1 1 1 1 1

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