BG030-26-G-0250-0300-L-E datasheet, PDF

Datasheet> All Categories > The connector> The connector> BG030-26-G-0250-0300-L-E

BG030-26-G-0250-0300-L-E: DescriptionBoard Connector,; CategoryThe connector The connector; File Size140KB，1 Pages; ManufacturerGlobal Connector Technology; Environmental Compliance

Download Datasheet Parametric View All

BG030-26-G-0250-0300-L-E Overview

Board Connector,

BG030-26-G-0250-0300-L-E Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Global Connector Technology
Reach Compliance Code	compliant
ECCN code	EAR99
Connector type	BOARD CONNECTOR
Contact to complete cooperation	GOLD (10)
Contact completed and terminated	TIN
Contact material	COPPER ALLOY
JESD-609 code	e3
Manufacturer's serial number	BG030
Base Number Matches	1

Preview

Download Datasheet

View All

Global Connector Technology Ltd. - BG030: 2.54mm PITCH PIN HEADER, SINGLE ROW, THROUGH-HOLE, VERTICAL

Ø1.02

(Typ.)

2.54

Typ. (Non-Accum)

2.50

2.54

RECOMMENDED PCB LAYOUT

B±0.38

A±0.25

PIN 0.64 SQ. (Typ.)

C±0.2

2.54

D±0.2

2.54 Typ.

SPECIFICATIONS

规格

CURRENT RATING

电流额定值

: 3 Amp

INSULATION RESISTANCE

绝缘电阻值

: 1000 MΩ min.

DIELECTRIC WITHSTANDING

耐电压

: 600V AC

CONTACT RESISTANCE

接触电阻值

: 20mΩ MAX.

OPERATING TEMPERATURE

工½温度

: -40°C TO +105°C

CONTACT MATERIAL

端子物料

: COPPER ALLOY

INSULATOR MATERIAL

绝缘½物料

STANDARD

标准物料

: POLYAMIDE

聚醯胺

, NYLON 6T, UL 94V-0

OPTIONS

可选物料

: POLYESTER

聚酯

, LCP, UL 94V-0

OR POLYESTER

聚酯

, PBT, UL94-V0

SOLDERING PROCESS

可焊性

NYLON 6T (STANDARD

标准物料

) -

IR REFLOW

回流焊

: 260°C for 10 sec.

WAVE

波峰焊

: 230°C for 5-10 sec.

MANUAL SOLDER

人工焊接

: 350°C for 3-5 sec

PBT (OPTION

可选物料

) - MANUAL SOLDER

人工焊接

: 330°C for 3-5 sec.

(NOT SUITABLE FOR HI-TEMP PROCESS

不适合高温处理

)

LCP (OPTION

可选物料

) -

IR REFLOW

回流焊

: 260°C for 10 sec.

WAVE

波峰焊

: 250°C for 5-10 sec.

MANUAL SOLDER

人工焊接

: 350°C for 3-5 sec

MATES WITH

配套之母座

(SUBJECT TO PIN LENGTH

在端子长度适合的条件下

BG090

BG095

BG096

BG100

BG110

BG115

BG125

BG130

BG135

BG145

BG205

LYH

INSULATOR

MATERIAL

12/03/09

PACKING

OPTIONS

27/04/09

SOLDER

TEMP.

05/08/09

ASE

STANDARD

DIMENSION

08/12/09

ASE

PLATING

OPTION

04/05/12

AJO

PACKING

OPTION

19/02/13

2.50

Ordering Grid

BG030

No. of Contacts

02 to 40

XXXX

REQUEST SAMPLES

AND QUOTATION

Contact Plating

A = Gold Flash All Over

(Standard)

B = Selective Gold Flash Contact

Area/Tin On Tail

C = Tin All Over

G = 10µ" Gold Contact Area/Tin On Tail

I = 30µ" Gold Contact Area/Tin On Tail

L = Matt Tin

Dimension C (1/100mm)

(Post Height)

0450 = 4.50mm

(Standard)

0650 = 6.50mm

(Standard)

Or specify Dimension C

e.g. 0250 = 2.50mm

Tolerances

(Except as noted)

Packing Options

G = Plastic Box

(Standard)

B = Tape & Reel with Cap

D = Tube

E = Tube with Cap

Insulator Material

N = Nylon 6T

(Standard)

P = PBT

L = LCP

Dimension D (1/100mm)

(Tail Length)

0300 = 3.00mm

(Standard)

Or specify Dimension D

e.g. 0250 = 2.50mm

Part Number:-

Date:-

Dimensions in mm

BG030

Description:-

01 NOV 06

DRAWING

DETAIL

RELEASE

REV

DATE

01/11/06

X.°±5°

.X°±2°

X.X ± 0.20

X.XX ± 0.15 .XX°±1°

X.XXX ± 0.10 .XXX°±0.5°

X. ± 0.30

Third Angle Projection

2.54mm PITCH PIN HEADER, SINGLE ROW,

THROUGH-HOLE, VERTICAL

Scale

NTS

Sheet No.

E & OE

1/1

www.gct.co

Drawn by

LYH

THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE

COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT

Revision

Material

See Note

Recommended Resources

A simple DC LED driver circuit

Rectifier circuit

high pass filter circuit

Ear point detection circuit

555 new digital thermometer circuit

Infrared TV circuit

IMEI verification on WinCE platform: I checked online and found that IMEI verification under WinCE requires the use of the API function "lineGetGeneralInfo". It seems to be quite complicated to use. I wonder if there is any expert who ca...; batonsoft Embedded System

Power supply topology: Power supply topology: AC-DC full-bridge drive, DC-AC full-bridge inverter, motor H-bridge drive, what are the differences between these full-bridge circuit principles? Can the topology structure be u...; QWE4562009 Discrete Device

Application of circular queue: [i=s]This post was last edited by Lazy Cat Love Flying on 2018-11-30 08:34[/i] [b][color=#00B0F0][font=楷体][size=14.0pt]About the Application of Circular Queue[/size][/font][/color][/b][align=left] Aut...; 懒猫爱飞 MCU

OV5620 camera acquisition and display, based on DE2 development board: OV5620 camera acquisition and display, OV5620 camera acquisition and display, based on DE2 development board. Can you guys help me find out where the problem is? The screen has a signal, but it seems ...; frankjintao FPGA/CPLD

關於C2000 使用SCI在線升級做法求解: [align=left][color=rgb(85, 85, 85)][font="][size=14px]想請問各位，若想使用SCI來更新程式該如何做呢?[/size][/font][/color][/align][align=left][color=rgb(85, 85, 85)][font="][size=14px]依目前的了解需要IAP以及APP兩個專案，IAP為更新程式使用，主要是將HE...; news9801 Microcontroller MCU

The ACLK oscillation stop problem caused by high temperature. The temperature difference of nearly 100C does not cause frequency deviation due to temperature drift? ? Please discuss! !: [i=s]This post was last edited by helloxieyu on 2014-8-9 11:56[/i] The ACLK oscillation problem caused by high temperature, there is no frequency deviation caused by temperature drift with a temperatu...; helloxieyu Microcontroller MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components