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ZL50075GAC

Description
IC DIGITAL SWITCH 32K CH 324PBGA
CategoryWireless rf/communication    Telecom circuit   
File Size453KB,60 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
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ZL50075GAC Overview

IC DIGITAL SWITCH 32K CH 324PBGA

ZL50075GAC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerZarlink Semiconductor (Microsemi)
package instructionBGA,
Reach Compliance Codecompli
JESD-30 codeS-PBGA-B324
JESD-609 codee0
length19 mm
Humidity sensitivity level1
Number of functions1
Number of terminals324
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
Certification statusNot Qualified
Maximum seat height1.9 mm
Nominal supply voltage1.8 V
surface mountYES
Telecom integrated circuit typesDIGITAL TIME SWITCH
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width19 mm
ZL50075
32 K Channel Digital Switch with High Jitter
Tolerance, Rate Conversion per Group of
2 Streams (8, 16, 32 or 64 Mbps),
and 64 Inputs and 64 Outputs
Data Sheet
Features
32,768 channel x 32,768 channel non-blocking
digital Time Division Multiplex (TDM) switch at
65.536 Mbps or 32.768 Mbps or using a
combination of rates
16,384 channel x 16,384 channel non-blocking
digital TDM switch at 16.384 Mbps
8,192 channel x 8,192 channel non-blocking
digital TDM switch at 8.192 Mbps
High jitter tolerance with multiple input clock
sources and frequencies
Up to 64 serial TDM input streams, divided into
32 groups with 2 input streams per group
Up to 64 serial TDM output streams, divided into
32 groups with 2 output streams per group
Per-group input and output data rate conversion
selection at 65.536 Mbps, 32.768 Mbps,
16.384 Mbps and 8.192 Mbps. Input and output
data group rates can differ
Per-group input bit delay for flexible sampling
point selection
Per-group output fractional bit advancement
Two sets of output timing signals for interfacing
additional devices
VDD_CORE
VDD_IO
VSS
January 2006
Ordering Information
ZL50075GAC
324 Ball PBGA
Trays
ZL50075GAG2 324 Ball PBGA** Trays
**Pb Free Tin/Silver/Copper
-40°C to +85°C
Per-channel A-Law/µ-Law Translation
Per-channel constant or variable throughput delay
for frame integrity and low latency applications
Per-stream Bit Error Rate (BER) test circuits
Per-channel high impedance output control
Per-channel force high output control
Per-channel message mode
Control interface compatible with Intel and
Motorola 16 bit non-multiplexed buses
Connection memory block programming
Supports ST-BUS and GCI-Bus standards for
input and output timing
IEEE 1149.1 (JTAG) test port
3.3 V I/O with 5V tolerant inputs; 1.8 V core
voltage
ODE
PWR
Input
Group 0
STiA0
STiB0
Output
Group 0
Data Memory
S/P
Converter
Connection Memory
P/S
Converter
SToA0
SToB0
Input
Group 31
:
:
STiA31
STiB31
:
:
SToA31
SToB31
Output
Timing
Output
Group 31
Input
Timing
FPi0
CKi0
CK_SEL1-0
FPo1-0
CKo1-0
Timing
Microprocessor Interface
and Control Registers
Test Access
Port
IM
DS
CS
R/W
SIZ1-0
A18-0
DTA
WAIT
BERR
D15-0
TMS
TDi
TDo
TCK
Figure 1 - ZL50075 Functional Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2004-2006, Zarlink Semiconductor Inc. All Rights Reserved.
TRST

ZL50075GAC Related Products

ZL50075GAC ZL50075 ZL50075GAG2
Description IC DIGITAL SWITCH 32K CH 324PBGA IC DIGITAL SWITCH 32K CH 324PBGA IC DIGITAL SWITCH 32K CH 324PBGA
Maker Zarlink Semiconductor (Microsemi) - Zarlink Semiconductor (Microsemi)
package instruction BGA, - BGA,
Reach Compliance Code compli - unknow
JESD-30 code S-PBGA-B324 - S-PBGA-B324
JESD-609 code e0 - e1
length 19 mm - 19 mm
Number of functions 1 - 1
Number of terminals 324 - 324
Maximum operating temperature 85 °C - 85 °C
Minimum operating temperature -40 °C - -40 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code BGA - BGA
Package shape SQUARE - SQUARE
Package form GRID ARRAY - GRID ARRAY
Certification status Not Qualified - Not Qualified
Maximum seat height 1.9 mm - 1.9 mm
Nominal supply voltage 1.8 V - 1.8 V
surface mount YES - YES
Telecom integrated circuit types DIGITAL TIME SWITCH - DIGITAL TIME SWITCH
Temperature level INDUSTRIAL - INDUSTRIAL
Terminal surface TIN LEAD - TIN SILVER COPPER
Terminal form BALL - BALL
Terminal pitch 1 mm - 1 mm
Terminal location BOTTOM - BOTTOM
width 19 mm - 19 mm

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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