EEWORLDEEWORLDEEWORLD

Part Number

Search

5-147279-3

Description
14 MODII HDR DR SFMT B/A T&R LF
CategoryThe connector   
File Size147KB,1 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Environmental Compliance
Download Datasheet Parametric View All

5-147279-3 Online Shopping

Suppliers Part Number Price MOQ In stock  
5-147279-3 - - View Buy Now

5-147279-3 Overview

14 MODII HDR DR SFMT B/A T&R LF

5-147279-3 Parametric

Parameter NameAttribute value
PCB Connector Component TypesPCB mounting header
Connectors and terminals terminate toA printed circuit board
Connector typeseparation
Line spacing2.54 mm [ .1 in ]
sealing ringWithout
plate supportWithout
stress reliefWithout
stabilizing deviceWithout
Connector terminal load statusFully loaded
PCB mounting directionvertical
Number of Positions14
Rows2
keyingno
Cylinder size.64 mm [ .025 in ]
Terminal base materialcopper alloy
PCB terminal termination area plating materialstin lead
Solder tail terminal plating material surface coatingTin: matte
Terminal base materialnickel
Terminal protectionWithout
Terminal shapesquare
Terminal typePin
Terminal contact plating materialgold
Terminal Contact Plating Thickness (µin)30
PCB Termination Methodssurface mount
Termination Post Length (in).05
Terminal Plating Thickness (µin)100 – 200
Terminal plating materialstin
PCB installation and fixationWithout
Panel mount featuresWithout
Engage connector latchWithout
PCB installation methodsurface mount
joint alignmentwith
Centerline (Pitch)2.54 mm [ .1 in ]
Shell materialLCP - GF (Liquid Crystal Polymer), LCP (Liquid Crystal Polymer)
Shell colorblack
Joint post length5.84 mm [ .23 in ]
High temperature shellno
High speed serial data connectorno
Package quantity250
Encapsulation methodTape and reel packaging
CommentIncludes pick and place cover
Solved: Memory management benchmark program
I saw some papers that mentioned "memory management benchmark program", which is used to test the time it takes for the system to request and release memory. I can't find any relevant information on h...
idonotknow0914 Embedded System
xpsp1 ddk, DirverStudio3.2, xp system, how to configure the environment
This is my first time developing a driver, and I have many questions. Can anyone with experience in this area give me some advice? I followed the instructions on the Internet and configured the files ...
chen611 Embedded System
VS2005 creates a smart device program in VC++ that cannot simulate wince5.0?
As the title says, when creating a VC++ smart device program with VS2005, can I choose PPC2003 or smartphone2003 when initializing it? Are there no other options? Such as wince5.0 or 4.0?...
sunqiyan99168 Embedded System
Mooncake pattern shaped antenna, please explain
Mooncake flower pattern antenna, have you tried it? I feel too arrogant, is this antenna good for you:lol Please explain {:1_123:}A pair of...
nmg RF/Wirelessly
LSM6DSO Zynq FPGA Test Project
[i=s]This post was last edited by littleshrimp on 2020-3-31 10:23[/i]Tested using EBAZ4205 mining board LSM6DSO C-Driver-MEMS read_data_simple routine FPGA's PS SPI uses EMIO to connect external pins ...
littleshrimp MEMS sensors
When Happiness Knocks on the Door
I watched the movie "The Pursuit of Happyness" on CCTV6: lol, it's the same as my mood...
shicong Talking

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 494  572  949  2038  1150  10  12  20  42  24 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号