NL27WZ32
Dual 2-Input OR Gate
The NL27WZ32 is a high performance dual 2−input OR Gate
operating from a 1.65 V to 5.5 V supply.
Features
•
•
•
•
•
•
•
•
•
•
•
Extremely High Speed: t
PD
2.5 ns (typical) at V
CC
= 5 V
Designed for 1.65 V to 5.5 V V
CC
Operation
Over Voltage Tolerant Inputs
LVTTL Compatible − Interface Capability With 5 V TTL Logic with
V
CC
= 3 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Replacement for NC7WZ32
Chip Complexity: FET = 120
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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MARKING
DIAGRAM
8
8
1
US8
US SUFFIX
CASE 493
LR
M
G
L4 M
G
G
1
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon
manufacturing location.
PIN ASSIGNMENT
Pin
A1
1
8
V
CC
1
2
3
B1
2
7
Y1
4
5
6
Y2
3
6
B2
7
8
GND
4
5
A2
Function
A1
B1
Y2
GND
A2
B2
Y1
V
CC
FUNCTION TABLE
Input
Output
Y=A+B
B
L
H
L
H
Y
L
H
H
H
Figure 1. Pinout
A
L
IEEE/IEC
A1
B1
A2
B2
w1
Y1
Y2
L
H
H
ORDERING INFORMATION
Figure 2. Logic Symbol
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 2012
1
January, 2018 − Rev. 10
Publication Order Number:
NL27WZ32/D
NL27WZ32
MAXIMUM RATINGS
Symbol
V
CC
V
I
V
O
I
IK
I
OK
I
O
I
CC
I
GND
T
STG
T
L
T
J
q
JA
P
D
MSL
F
R
V
ESD
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
V
I
< GND
DC Output Diode Current
V
O
< GND
DC Output Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance (Note 1)
Power Dissipation in Still Air at 85°C
Moisture Sensitivity
Flammability Rating
Oxygen Index: 28 to 34
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Latch−Up Performance
Above V
CC
and Below GND at 85°C (Note 5)
Parameter
Value
−0.5 to +7.0
−0.5 to +7.0
−0.5 to +7.0
−50
−50
±50
±100
±100
−65 to +150
260
+150
250
250
Level 1
UL 94 V−0 @ 0.125 in
V
> 2000
> 200
N/A
±500
mA
Units
V
V
V
mA
mA
mA
mA
mA
°C
°C
°C
°C/W
mW
I
Latch−Up
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
Supply Voltage
Operating
Data Retention Only
Input Voltage (Note 6)
Output Voltage (HIGH or LOW State)
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
V
CC
= 1.8 V
±0.15
V
V
CC
= 2.5 V
±0.2
V
V
CC
= 3.0 V
±0.3
V
V
CC
= 5.0 V
±0.5
V
Parameter
Min
1.65
1.5
0
0
−40
0
0
0
0
Max
5.5
5.5
5.5
5.5
+125
20
20
10
5
V
V
°C
ns/V
Units
V
V
I
V
O
T
A
Dt/DV
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
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2
NL27WZ32
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493
ISSUE D
A
8
5
X Y
J
DETAIL E
B
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR. MOLD
FLASH. PROTRUSION AND GATE BURR SHALL
NOT EXCEED 0.14MM (0.0055”) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
AND PROTRUSION SHALL NOT EXCEED 0.14MM
(0.0055”) PER SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203MM (0.003−0.008”).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED
±0.0508MM
(0.0002”).
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0
_
6
_
0
_
10
_
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.128
0
_
6
_
0
_
10
_
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
1
4
R
S
U
C
H
0.10 (0.004) T
M
P
G
SEATING
PLANE
T
D
K
0.10 (0.004)
T X Y
N
R 0.10 TYP
V
M
F
DETAIL E
RECOMMENDED
SOLDERING FOOTPRINT*
8X
0.30
8X
0.68
3.40
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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