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MAX7314ATG

Description
16 I/O, PIA-GENERAL PURPOSE, QCC24, 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGD2, TQFN-24
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,26 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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MAX7314ATG Overview

16 I/O, PIA-GENERAL PURPOSE, QCC24, 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGD2, TQFN-24

MAX7314ATG Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerRochester Electronics
Parts packaging codeQFN
package instruction4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGD2, TQFN-24
Contacts24
Reach Compliance Codeunknown
JESD-30 codeS-XQCC-N24
JESD-609 codee0
length4 mm
Humidity sensitivity level1
Number of I/O lines16
Number of ports1
Number of terminals24
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)245
Certification statusCOMMERCIAL
Maximum seat height0.8 mm
Maximum supply voltage3.6 V
Minimum supply voltage2 V
Nominal supply voltage3.3 V
surface mountYES
technologyBICMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width4 mm
uPs/uCs/peripheral integrated circuit typePARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches1
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MAX7314ATG Related Products

MAX7314ATG MAX7314AEG
Description 16 I/O, PIA-GENERAL PURPOSE, QCC24, 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGD2, TQFN-24 16 I/O, PIA-GENERAL PURPOSE, PDSO24, 0.150 INCH, 0.025 INCH PITCH, MO-137, QSOP-24
Is it lead-free? Contains lead Contains lead
Maker Rochester Electronics Rochester Electronics
Parts packaging code QFN SSOP
package instruction 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGD2, TQFN-24 0.150 INCH, 0.025 INCH PITCH, MO-137, QSOP-24
Contacts 24 24
Reach Compliance Code unknown unknown
JESD-30 code S-XQCC-N24 R-PDSO-G24
JESD-609 code e0 e0
length 4 mm 8.65 mm
Humidity sensitivity level 1 1
Number of I/O lines 16 16
Number of ports 1 1
Number of terminals 24 24
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C
Package body material UNSPECIFIED PLASTIC/EPOXY
encapsulated code VQCCN SSOP
Package shape SQUARE RECTANGULAR
Package form CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 245 245
Certification status COMMERCIAL COMMERCIAL
Maximum seat height 0.8 mm 1.73 mm
Maximum supply voltage 3.6 V 3.6 V
Minimum supply voltage 2 V 2 V
Nominal supply voltage 3.3 V 3.3 V
surface mount YES YES
technology BICMOS BICMOS
Temperature level AUTOMOTIVE AUTOMOTIVE
Terminal surface TIN LEAD TIN LEAD
Terminal form NO LEAD GULL WING
Terminal pitch 0.5 mm 0.635 mm
Terminal location QUAD DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 4 mm 3.9 mm
uPs/uCs/peripheral integrated circuit type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches 1 1
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