K7D321874A-HC370 datasheet, PDF

K7D321874A-HC370: DescriptionDDR SRAM, 2MX18, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153; Categorystorage storage; File Size468KB，18 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K7D321874A-HC370 Overview

DDR SRAM, 2MX18, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	BGA,
Contacts	153
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
JESD-30 code	R-PBGA-B153
JESD-609 code	e0
length	22 mm
memory density	37748736 bit
Memory IC Type	DDR SRAM
memory width	18
Number of functions	1
Number of terminals	153
word count	2097152 words
character code	2000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX18
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	230
Certification status	Not Qualified
Maximum seat height	2.21 mm
Maximum supply voltage (Vsup)	2.6 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	14 mm
Base Number Matches	1

K7D323674C

K7D321874C

Preliminary

1Mx36 & 2Mx18 SRAM

32Mb C-die DDR SRAM Specification

153BGA with Pb & Pb-Free

(RoHS compliant)

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.

ALL INFORMATION IN THIS DOCUMENT IS PROVIDED

ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or simi-

lar applications where Product failure could result in loss of life or personal or physical harm, or any military

or defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

-1-

Rev 0.0

Nov. 2005

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