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82V3255TFG8

Description
TQFP-64, Reel
CategoryWireless rf/communication    Telecom circuit   
File Size1MB,173 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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82V3255TFG8 Overview

TQFP-64, Reel

82V3255TFG8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeTQFP
package instruction10 X 10 MM, 1.40 MM HEIGHT, GREEN, MO-136BJ, MS-026BCB, TQFP-64
Contacts64
Manufacturer packaging codePPG64
Reach Compliance Codecompliant
ECCN codeEAR99
JESD-30 codeS-PQFP-G64
JESD-609 codee3
length10 mm
Humidity sensitivity level3
Number of functions1
Number of terminals64
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
Maximum seat height1.6 mm
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width10 mm
Base Number Matches1
WAN PLL
IDT82V3280
Version 7
June 22, 2015
6024 Silver Creek Valley Road, San Jose, CA 95138
Telephone: (800) 345-7015 • TWX: 910-338-2070 • FAX: (408) 284-2775
Printed in U.S.A.
© 2009 Integrated Device Technology, Inc.

82V3255TFG8 Related Products

82V3255TFG8 82V3255TFG 82V3255EDG 82V3255TF
Description TQFP-64, Reel TQFP-64, Tray TQFP-64, Tray TQFP-64, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Lead free Contains lead
Is it Rohs certified? conform to conform to conform to incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code TQFP TQFP TQFP TQFP
package instruction 10 X 10 MM, 1.40 MM HEIGHT, GREEN, MO-136BJ, MS-026BCB, TQFP-64 10 X 10 MM, 1.40 MM HEIGHT, GREEN, MO-136BJ, MS-026BCB, TQFP-64 10 X 10 MM, 1 MM HEIGHT, GREEN, MS-026ACD, TQFP-64 10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, MS-026BCB, TQFP-64
Contacts 64 64 64 64
Manufacturer packaging code PPG64 PPG64 EDG64 PP64
Reach Compliance Code compliant compliant compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99
JESD-30 code S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64
JESD-609 code e3 e3 e3 e0
length 10 mm 10 mm 10 mm 10 mm
Humidity sensitivity level 3 3 3 3
Number of functions 1 1 1 1
Number of terminals 64 64 64 64
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP HTFQFP LFQFP
Package shape SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260 260 240
Maximum seat height 1.6 mm 1.6 mm 1.2 mm 1.6 mm
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed MATTE TIN Tin/Lead (Sn85Pb15)
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 30 30 NOT SPECIFIED 20
width 10 mm 10 mm 10 mm 10 mm
Base Number Matches 1 1 1 1
Certification status - Not Qualified Not Qualified Not Qualified
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