05210
ESD4-LFC
LOW CAPACITANCE FLIP CHIP ARRAY
APPLICATIONS
✔
Cellular Phones
✔
I/O Ports
✔
Notebooks & Pocket PCs
✔
Personal Digital Assistant (PDA)
✔
Ground Positioning System (GPS)
✔
SMART Cards
IEC COMPATIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
5 BUMP FLIP CHIP
FEATURES
✔
ESD Protection > 25 kilovolts
✔
Unidirectional Configuration
✔
Low Capacitance: 15pF
✔
Protects Up to Four(4) Data Lines
✔
RoHS Compliant
MECHANICAL CHARACTERISTICS
✔
5 Bump Flip Chip Package
✔
Weight 0.73 milligrams (Approximate)
✔
Available in Lead-Free Plating
✔
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔
Consult Factory for Leaded Device Availability
✔
Flammability Rating UL 94V-0
✔
8mm Tape and Reel Per EIA Standard 481
PIN CONFIGURATION
G1
05210.R3 2/07
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ESD4-LFC
DEVICE CHARACTERISTICS
MAXIMUM RATINGS
@ 25°C Unless Otherwise Specified
PARAMETER
Operating Temperature
Storage Temperature
DC Power Rating
SYMBOL
T
A
T
STG
P
VALUE
-40 to 85
-55 to 150
200
UNITS
°C
°C
mW
ELECTRICAL CHARACTERISTICS PER LINE
PART
NUMBER
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
LEAKAGE
CURRENT
@ 25°C Unless Otherwise Specified
TYPICAL
FORWARD
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
TYPICAL
CAPACITANCE
PER LINE
(See Note 1)
@2.5V, 1 MHz
C
pF
V
WM
VOLTS
@ 1mA
V
(BR)
VOLTS
@3.3V
I
D
µA
@ 10mA
V
F
VOLTS
@ I
P
= 10mA
V
C
VOLTS
ESD4-LFC
Note 1:
±20% tolerance.
5.0
6.0
0.1
0.8
8
15
1.6
C
j
- Capacitance (Normalized)
FIGURE 1
CAPACITANCE VS REVERSE VOLTAGE
(Normalized to Capacitance at 2.5V DC & 25°C)
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
1
2
3
4
5
6
V
R
- Reverse Voltage - Volts
05210.R3 2/07
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ESD4-LFC
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-270°C
T
P
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
T
P
Ramp-up
Temperature - °C
Ramp-down
T
L
T
SMAX
155°
T
SMIN
140°
T
S
- Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
05210.R3 2/07
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ESD4-LFC
5 BUMP FLIP CHIP PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
BOTTOM VIEW
PACKAGE DIMENSIONS
MILLIMETERS
DIM
MIN
0.914
1.285
0.495
0.245
0.430
0.430
0.180
0.180
0.432
0.330
INCHES
MIN
0.036
0.0506
0.0195
0.0096
0.0169
0.0169
0.0071
0.0071
0.017
0.013
A
G
C
O
G
H
I
1
2
D
I
J
E
F
B
SIDE VIEW
MAX
1.016
1.375
0.505
0.255
0.440
0.440
0.280
0.280
0.559
0.457
MAX
0.040
0.0541
0.0199
0.0100
0.0173
0.0173
0.0110
0.0110
0.022
0.018
A
B
C
D
E
F
G
H
I
J
0.30 DIA.
63/67 Sn/Pb
SOLDER BUMPS
NOTE:
1. Controlling dimensions in millimeters.
Outline & Dimensions: Rev 1 - 8/05, 06055
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia.
178mm (7”)
Tape Width
8mm
A0
B0
K0
D
E
F
W
P0
P2
P
t
1.08 ± 0.05 1.60 ± 0.05 0.72 ± 0.05 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 0.20±0.025
P0
t
D
P2
10 Pitches Cumulative
Tolerance on Tape. ± 0.2
MARKING CODE
DIAGRAM
4L
E
Top cover tape
A0
K0
B0
F
W
P
User Direction of Feed
TAPE & REEL ORDERING NOMENCLATURE
1.
2.
3.
4.
Surface mount product is taped and reeled in accordance with EIA-481.
Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e.,
ESD4-LFC-T73-1.
Suffix - LF - Lead-Free, i.e.,
ESD4-LFC-LF-T73-1.
Suffix - C - Coated Version, i.e.,
ESD4-LFC-LF-T73C-1.
COPYRIGHT © ProTek Devices 2007
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
05210.R3 2/07
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Embedded System
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